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Phased arrays are multiple antenna systems capable of forming and steering beams electronically using constructive and destructive interference between sources. They are employed extensively in radar and communication systems but are typically rigid, bulky and heavy, which limits their use in compact or portable devices and systems. Here, we report a scalable phased array system that is both lightweight and flexible. The array architecture consists of a self-monitoring complementary metal–oxide–semiconductor-based integrated circuit, which is responsible for generating multiple independent phase- and amplitude-controlled signal channels, combined with flexible and collapsible radiating structures. The modular platform, which can be collapsed, rolled and folded, is capable of operating standalone or as a subarray in a larger-scale flexible phased array system. To illustrate the capabilities of the approach, we created a 4 × 4 flexible phased array tile operating at 9.4–10.4 GHz, with a low areal mass density of 0.1 g cm −2 . We also created a flexible phased array prototype that is powered by photovoltaic cells and intended for use in a wireless space-based solar power transfer array. By combining a CMOS-based integrated circuit with flexible and collapsible radiating structures, a scalable phased array architecture can be fabricated that has an areal mass density of only 0.1 g cm −2 .

The geometry and constituent materials of metastructures can be used to engineer the thermal expansion coefficient. In this thesis, we design, fabricate, and test thin thermally stable metastructures consisting of bi-metallic unit cells and show how the coefficient of thermal expansion (CTE) of these metastructures can be finely and coarsely tuned by varying the CTE of the constituent materials and the unit cell geometry. Planar and three-dimensional finite element method modeling is used to drive the design and inform experiments, and predict the response of these metastructures. We demonstrate computationally the significance of out-of-plane effects in the metastructure response. We develop an experimental setup using digital image correlation and an infrared camera to experimentally measure full displacement and temperature fields during testing and accurately measure the metastructures' CTE. We experimentally demonstrate high aspect ratio metastructures of Ti/Al and Kovar/Al which exhibit near-zero and negative CTE, respectively. We demonstrate robust fabrication procedures for thermally stable samples with high aspect ratios in thin foil and thin film scales. We investigate the lattice structure and mechanical properties of thin films comprising a near-zero CTE metastructure. The mechanics developed in this work can be used to engineer metastructures of arbitrary CTE and can be extended to three dimensions.

We propose a novel design for a lightweight, high-performance space-based solar power array combined with power beaming capability for operation in geosynchronous orbit and transmission of power to Earth. We use a modular configuration of small, repeatable unit cells, called tiles, that each individually perform power collection, conversion, and transmission. Sunlight is collected via lightweight parabolic concentrators and converted to DC electric power with high efficiency III-V photovoltaics. Several CMOS integrated circuits within each tile generates and controls the phase of multiple independently-controlled microwave sources using the DC power. These sources are coupled to multiple radiating antennas which act as elements of a large phased array to beam the RF power to Earth. The power is sent to Earth at a frequency chosen in the range of 1-10 GHz and collected with ground-based rectennas at a local intensity no larger than ambient sunlight. We achieve significantly reduced mass compared to previous designs by taking advantage of solar concentration, current CMOS integrated circuit technology, and ultralight structural elements. Of note, the resulting satellite has no movable parts once it is fully deployed and all beam steering is done electronically. Our design is safe, scalable, and able to be deployed and tested with progressively larger configurations starting with a single unit cell that could fit on a cube satellite. The design reported on here has an areal mass density of 160 g/m2 and an end-to-end efficiency of 7-14%. We believe this is a significant step forward to the realization of space-based solar power, a concept once of science fiction.

Previously, it was difficult to fabricate deformable mirrors made by piezoelectric actuators. This is because numerous actuators need to be precisely assembled to control the surface shape of the mirror. Two approaches have been developed. Both approaches begin by depositing a stack of piezoelectric films and electrodes over a silicon wafer substrate. In the first approach, the silicon wafer is removed initially by plasmabased reactive ion etching (RIE), and non-plasma dry etching with xenon difluoride (XeF2). In the second approach, the actuator film stack is immersed in a liquid such as deionized water. The adhesion between the actuator film stack and the substrate is relatively weak. Simply by seeping liquid between the film and the substrate, the actuator film stack is gently released from the substrate. The deformable mirror contains multiple piezoelectric membrane layers as well as multiple electrode layers (some are patterned and some are unpatterned). At the piezolectric layer, polyvinylidene fluoride (PVDF), or its co-polymer, poly(vinylidene fluoride trifluoroethylene P(VDF-TrFE) is used. The surface of the mirror is coated with a reflective coating. The actuator film stack is fabricated on silicon, or silicon on insulator (SOI) substrate, by repeatedly spin-coating the PVDF or P(VDFTrFE) solution and patterned metal (electrode) deposition. In the first approach, the actuator film stack is prepared on SOI substrate. Then, the thick silicon (typically 500-micron thick and called handle silicon) of the SOI wafer is etched by a deep reactive ion etching process tool (SF6-based plasma etching). This deep RIE stops at the middle SiO2 layer. The middle SiO2 layer is etched by either HF-based wet etching or dry plasma etch. The thin silicon layer (generally called a device layer) of SOI is removed by XeF2 dry etch. This XeF2 etch is very gentle and extremely selective, so the released mirror membrane is not damaged. It is possible to replace SOI with silicon substrate, but this will require tighter DRIE process control as well as generally longer and less efficient XeF2 etch. In the second approach, the actuator film stack is first constructed on a silicon wafer. It helps to use a polyimide intermediate layer such as Kapton because the adhesion between the polyimide and silicon is generally weak. A mirror mount ring is attached by using adhesive. Then, the assembly is partially submerged in liquid water. The water tends to seep between the actuator film stack and silicon substrate. As a result, the actuator membrane can be gently released from the silicon substrate. The actuator membrane is very flat because it is fixed to the mirror mount prior to the release. Deformable mirrors require extremely good surface optical quality. In the technology described here, the deformable mirror is fabricated on pristine substrates such as prime-grade silicon wafers. The deformable mirror is released by selectively removing the substrate. Therefore, the released deformable mirror surface replicates the optical quality of the underlying pristine substrate.