Explore the vast range of titles available.

HighlightsBottlenecks in the field of thermally conductive polymer composites are raised, and corresponding reasons are analysed.Three possible directions for breaking through such bottlenecks are put forward, and current advances in these three directions are illustrated.Future development trends and demands are foreseen to help the development of thermally conductive polymers and their composites.Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible directions for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.

HighlightsBottlenecks for developing polymer based electromagnetic interference (EMI) shielding composites are proposed and inner reasons are discussedPossible directions to break through bottlenecks are raised and recent advances in such directions are introduced.Development trends in the future are foreseen to provide theoretical basis and technical guidance for development of polymer based EMI shielding composites.The rapid development of aerospace weapons and equipment, wireless base stations and 5G communication technologies has put forward newer and higher requirements for the comprehensive performances of polymer-based electromagnetic interference (EMI) shielding composites. However, most of currently prepared polymer-based EMI shielding composites are still difficult to combine high performance and multi-functionality. In response to this, based on the research works of relevant researchers as well as our research group, three possible directions to break through the above bottlenecks are proposed, including construction of efficient conductive networks, optimization of multi-interfaces for lightweight and multifunction compatibility design. The future development trends in three directions are prospected, and it is hoped to provide certain theoretical basis and technical guidance for the preparation, research and development of polymer-based EMI shielding composites.

HighlightsThe review discusses the key concepts, loss mechanisms and test methods of electromagnetic interference (EMI) shielding.The research progress of polymer matrix EMI shielding composites with different structures is detailedly illustrated, especially their preparation methods and corresponding evaluations.The key scientific and technical problems for polymer matrix EMI shielding composites with different structures are proposed, and their development trend are prospected.With the widespread application of electronic communication technology, the resulting electromagnetic radiation pollution has been significantly increased. Metal matrix electromagnetic interference (EMI) shielding materials have disadvantages such as high density, easy corrosion, difficult processing and high price, etc. Polymer matrix EMI shielding composites possess light weight, corrosion resistance and easy processing. However, the current polymer matrix composites present relatively low electrical conductivity and poor EMI shielding performance. This review firstly discusses the key concept, loss mechanism and test method of EMI shielding. Then the current development status of EMI shielding materials is summarized, and the research progress of polymer matrix EMI shielding composites with different structures is illustrated, especially for their preparation methods and evaluation. Finally, the corresponding key scientific and technical problems are proposed, and their development trend is also prospected.

The combination between macroscopic structure designs and microscopic material designs offers tremendous possibilities for the development of advanced electromagnetic wave (EMW) absorbers. Herein, we propose a metamaterial design to address persistent challenges in this field, including narrow bandwidth, low–frequency bottlenecks, and, particularly, the urgent issue of robustness (i.e., oblique, and polarized incidence). Our absorber features a semiconductive metal-organic framework/iron 2D/2D assembly (CuHT–FCIP) with abundant crystal/crystal heterojunctions and strong magneto-electric coupling networks. This design achieves remarkable EMW absorption across a broad range (2 to 40 GHz) at a thickness of just 9.3 mm. Notably, it maintains stable performance against oblique incidence (within 75°) and polarizations (both transverse electric and transverse magnetic). Furthermore, the absorber demonstrates high specific compressive strength (201.01 MPa·cm 3 ·g −1 ) and low density (0.89 g·cm −3 ). This advancement holds promise for developing robust EMW absorbers with superior performance. Here the Authors showcase a microwave absorber design that combines semiconductive metal-organic frameworks with iron 2D layers, achieving ultra-broadband absorption in the whole 5 G frequencies and stable performance against various angles and polarizations.

HighlightsA layered segregated shielding network was organized in porous PBAT/Fe3O4@MWCNTs/Ag composite by scCO2 foaming and scraping techniques.The composite foam achieved an electromagnetic interference (EMI) shielding effectiveness (SE) of up to 68.0 dB and a reflectivity of as low as 23% due to the “absorption-reflection-re-absorption” shielding mechanism.The solid and foamed PBAT/Fe3O4@MWCNTs/Ag composites displayed superior retention (> 92%) of EMI SE even after peeling experiment of 500 times under 100 g weight pressure.The utilization of eco-friendly, lightweight, high-efficiency and high-absorbing electromagnetic interference (EMI) shielding composites is imperative in light of the worldwide promotion of sustainable manufacturing. In this work, magnetic poly (butyleneadipate-co-terephthalate) (PBAT) microspheres were firstly synthesized via phase separation method, then PBAT composite foams with layered structure was constructed through the supercritical carbon dioxide foaming and scraping techniques. The merits of integrating ferroferric oxide-loaded multi-walled carbon nanotubes (Fe3O4@MWCNTs) nanoparticles, a microcellular framework, and a highly conductive silver layer have been judiciously orchestrated within this distinctive layered configuration. Microwaves are consumed throughout the process of “absorption-reflection-reabsorption” as much as possible, which greatly declines the secondary radiation pollution. The biodegradable PBAT composite foams achieved an EMI shielding effectiveness of up to 68 dB and an absorptivity of 77%, and authenticated favorable stabilization after the tape adhesion experiment.

HighlightsCellulose aerogels were prepared by hydrogen bonding driven self-assembly, gelation and freeze-drying.The skin-core structure of CCA@rGO aerogels can form a perfect three-dimensional bilayer conductive network.Outstanding EMI SE (51 dB) is achieved with 3.05 wt% CCA@rGO, which is 3.9 times higher than that of the co-blended composites.In order to ensure the operational reliability and information security of sophisticated electronic components and to protect human health, efficient electromagnetic interference (EMI) shielding materials are required to attenuate electromagnetic wave energy. In this work, the cellulose solution is obtained by dissolving cotton through hydrogen bond driving self-assembly using sodium hydroxide (NaOH)/urea solution, and cellulose aerogels (CA) are prepared by gelation and freeze-drying. Then, the cellulose carbon aerogel@reduced graphene oxide aerogels (CCA@rGO) are prepared by vacuum impregnation, freeze-drying followed by thermal annealing, and finally, the CCA@rGO/polydimethylsiloxane (PDMS) EMI shielding composites are prepared by backfilling with PDMS. Owing to skin-core structure of CCA@rGO, the complete three-dimensional (3D) double-layer conductive network can be successfully constructed. When the loading of CCA@rGO is 3.05 wt%, CCA@rGO/PDMS EMI shielding composites have an excellent EMI shielding effectiveness (EMI SE) of 51 dB, which is 3.9 times higher than that of the co-blended CCA/rGO/PDMS EMI shielding composites (13 dB) with the same loading of fillers. At this time, the CCA@rGO/PDMS EMI shielding composites have excellent thermal stability (THRI of 178.3 °C) and good thermal conductivity coefficient (λ of 0.65 W m-1 K-1). Excellent comprehensive performance makes CCA@rGO/PDMS EMI shielding composites great prospect for applications in lightweight, flexible EMI shielding composites.Graphic abstract

HighlightsThe rGH@FeNi/epoxy electromagnetic interference (EMI) shielding composites with regular 3D honeycomb structures were prepared by sacrificial template, freeze-drying and vacuum-assisted impregnation of epoxy resin.The construction of 3D honeycomb structure and electromagnetic synergistic effect significantly increase the EMI shielding effectiveness and reduce the secondary contamination.The rGH@FeNi/epoxy composites possess excellent thermal stability and mechanical properties.With the rapid development of fifth-generation mobile communication technology and wearable electronic devices, electromagnetic interference and radiation pollution caused by electromagnetic waves have attracted worldwide attention. Therefore, the design and development of highly efficient EMI shielding materials are of great importance. In this work, the three-dimensional graphene oxide (GO) with regular honeycomb structure (GH) is firstly constructed by sacrificial template and freeze-drying methods. Then, the amino functionalized FeNi alloy particles (f-FeNi) are loaded on the GH skeleton followed by in-situ reduction to prepare rGH@FeNi aerogel. Finally, the rGH@FeNi/epoxy EMI shielding composites with regular honeycomb structure is obtained by vacuum-assisted impregnation of epoxy resin. Benefitting from the construction of regular honeycomb structure and electromagnetic synergistic effect, the rGH@FeNi/epoxy composites with a low rGH@FeNi mass fraction of 2.1 wt% (rGH and f-FeNi are 1.2 and 0.9 wt%, respectively) exhibit a high EMI shielding effectiveness (EMI SE) of 46 dB, which is 5.8 times of that (8 dB) for rGO/FeNi/epoxy composites with the same rGO/FeNi mass fraction. At the same time, the rGH@FeNi/epoxy composites also possess excellent thermal stability (heat-resistance index and temperature at the maximum decomposition rate are 179.1 and 389.0 °C respectively) and mechanical properties (storage modulus is 8296.2 MPa).

HighlightsHierarchically multifunctional polyimide composite films were fabricated by hierarchical design and assembly strategy.Polyimide composite films have three functional layers and integrates high thermal conductivity (95.40 W (m K)−1), excellent EMI shielding (34.0 dB) and good tensile strength (93.6 MPa).Polyimide composite films present broad application prospects in electronics fields according to the test results in the central processing unit.The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe3O4/polyimide (Fe3O4/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement. PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe3O4/PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K)−1), excellent EMI shielding effectiveness (34.0 dB), good tensile strength (93.6 MPa) and fast electric-heating response (5 s). The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.

Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient cannot meet the current application requirements of advanced electronic and electrical equipment. Therefore, novel fluorine‐containing liquid crystal epoxy compounds (TFSAEy) with fluorinated groups, biphenyl units, and flexible alkyl chains are first synthesized via amidation and esterification reactions. Then, 4,4′‐diaminodiphenylmethane (DDM) is used as a curing agent to prepare the corresponding fluorine‐containing liquid crystal epoxy resins. The obtained dielectric constant (ε) and dielectric loss (tan δ) values of TFSAEy/DDM at 1 MHz are 2.54 and 0.025, respectively, which are significantly lower than those of conventional epoxy resins (E‐51/DDM, 3.52 and 0.038). Additionally, the intrinsic thermal conductivity coefficient (λ) of TFSAEy/DDM is 0.36 W/(m·K), 71.4% higher than that of E‐51/DDM (0.21 W/(m·K)). Meanwhile, the corresponding elastic modulus, hardness, glass transition temperature, and heat resistance index of TFSAEy/DDM are 5.73 GPa, 0.35 GPa, 213.5°C, and 188.7°C, respectively, all superior to those of E‐51/DDM (3.68 GPa, 0.27 GPa, 107.2°C, and 174.8°C), presenting potential application in high‐heating electronic component packaging and printed circuit boards. A novel fluorine‐containing liquid crystal epoxy cured resins (TFSAEy/DDM) have the optimal comprehensive properties, such as a low ε value, highly intrinsic λ value, excellent mechanical properties, outstanding heat resistance, wear resistance and flame retardancy, which would replace conventional epoxy resins (E‐51/DDM) in the high‐heating electronic component packaging and printed circuit boards.

Polymer memristors with light weight and mechanical flexibility are preeminent candidates for low-power edge computing paradigms. However, the structural inhomogeneity of most polymers usually leads to random resistive switching characteristics, which lowers the production yield and reliability of nanoscale devices. In this contribution, we report that by adopting the two-dimensional conjugation strategy, a record high 90% production yield of polymer memristors has been achieved with miniaturization and low power potentials. By constructing coplanar macromolecules with 2D conjugated thiophene derivatives to enhance the π – π stacking and crystallinity of the thin film, homogeneous switching takes place across the entire polymer layer, with fast responses in 32 ns, D2D variation down to 3.16% ~ 8.29%, production yield approaching 90%, and scalability into 100 nm scale with tiny power consumption of ~ 10 −15  J/bit. The polymer memristor array is capable of acting as both the arithmetic-logic element and multiply-accumulate accelerator for neuromorphic computing tasks. Though polymer memristors are promising for low‐power flexible edge computing applications, realizing efficient nanometer‐scale arrays remains a challenge. Here, the authors report a record high 90% production yield in nm‐scale 2D conjugated polymer memristors with homogeneous resistive switching.