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Ensuring the stability of monolithic concrete slabs during construction represents a crucial safety challenge in monolithic reinforced concrete buildings. Theoretical models and structural analyses often assume ideal conditions of supporting props. However, significant deviations occur in practice due to variations in technical condition and installation methods. This study investigates the magnitude of prestressing forces generated in adjustable telescopic steel props depending on manual tightening and hammer blows. Experimental measurements were conducted on different types of props compliant with EN 1065, including both new and worn specimens, to simulate real on-site conditions. The influence of worker body weight was also analyzed. The results confirmed that the technical condition of the prop is the decisive factor affecting the level of prestress. Props in poor condition achieved substantially lower and inconsistent prestressing forces, while new props subjected to five hammer blows reached maximum values up to 13.16 kN. This difference can significantly influence static calculations for slab construction. Contrary to expectations, the influence of worker body weight was not statistically significant; instead, the dominant role was played by installation technique and the accuracy of hammer blows. The findings contribute to the optimization of safety guidelines and the improvement of calculation models for temporary support systems in monolithic construction.

This article focuses on the energy performance of buildings with an emphasis on the consequences of non-compliance with technological practices during the building process. We analyse the impact of construction deficiencies on the consumption of heat for heating, focusing on specific case studies of selected building constructions in the Slovak Republic. The results show that non-compliance with prescribed technological standards and procedures leads to significant deterioration in the building’s energy efficiency, which is manifested in increased heat consumption and higher operating costs. The findings of this study have key importance for future construction projects as they offer valuable recommendations for improving energy standards and construction quality, thus contributing to a more sustainable and efficient building process. When designing buildings with near-zero energy demand, it is necessary to eliminate all risks in the project that arise during the preparation and design itself, as well as during implementation.

The results of this analysis have a significant impact on future construction projects and contribute to improving energy standards and building quality in the pursuit of more sustainable and efficient construction practices. V rámci tejto obhliadky sa pristúpilo k realizácii termomeraní pomocou prístroja Flir B250 Thermal Imagera a vlastností vnútorného prostredia ako je teplota a vlhkosť pomocou pinless Moisture Psychrometer with IR Thermometer and Bluetooth Meterlink Meterlink MO297 a získaniu projektovej dokumentácie ako podkladu pre výskum. Použitá literatúra [1] L. Pérez-Lombard, J. Ortiz, a C. Pout, \"A review on buildings energy consumption information\", Energy Build., roč. 40, č. 3, s. 394-398, jan. 2008, doi: 10.1016/j.enbuild.2007.03.007. [2] R. Crawford a A. Stephan, The significance of embodied energy in certified passive houses, roč. 7.

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 Ω/square and low temperature coefficient of resistance ±100·10−6 K−1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause deflection of the substrate and in extreme cases, the deflection can lead to damage of the substrate. Two silver pastes and two dielectric pastes, as well as their combinations, were used for the experiments, and the internal stress in the thick films was investigated using the cantilever method. Further experiments were also focused on internal stress changes during the experiment and on the influence of heat treatment (annealing) on internal stress. The results were correlated with the morphology of the fired thick films. The internal stress in the thick films was in the range of 8 to 21 MPa for metallic films and in the range from 12 to 16 MPa for dielectric films. It was verified that the cantilever method can be successfully used for the evaluation of internal stress in thick films. It was also found that the values of deflection and internal stress are not stable after firing, and they can change over time, mainly for metallic thick films.

This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power resistors. This copper-nickel paste has been designed for use in combination with thick printed copper conductors and in comparison with conventional ruthenium-based thick film resistor pastes allows firing in a nitrogen protective atmosphere. The copper-nickel paste was prepared from copper and nickel microparticles, glass binder particles and a combination of organic solvents optimized for its firing in a nitrogen atmosphere. This paper covers a detailed description of copper-nickel paste composition and its thermal properties verified by simultaneous thermal analysis, a description of the morphology of dried and fired copper-nickel films, as well as the electrical parameters of the final printed resistors. It has been proven by electron microscopy with element distribution analysis that copper and nickel microparticles diffused together during firing and created homogenous copper-nickel alloy film. This film shows a low temperature coefficient of resistance ±45 × 0−6 K−1 and low sheet resistance value 45 mΩ/square. It was verified that formulated copper-nickel paste is nitrogen-fireable and well-compatible with thick printed copper pastes. This combination allows the realization of power substrates with directly integrated low-ohmic resistors.