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Increasing the modulation speed of semiconductor lasers has attracted much attention from the viewpoint of both physics and the applications of lasers. Here we propose a membrane distributed reflector laser on a low-refractive-index and high-thermal-conductivity silicon carbide substrate that overcomes the modulation bandwidth limit. The laser features a high modulation efficiency because of its large optical confinement in the active region and small differential gain reduction at a high injection current density. We achieve a 42 GHz relaxation oscillation frequency by using a laser with a 50-μm-long active region. The cavity, designed to have a short photon lifetime, suppresses the damping effect while keeping the threshold carrier density low, resulting in a 60 GHz intrinsic 3 dB bandwidth (f3dB). By employing the photon–photon resonance at 95 GHz due to optical feedback from an integrated output waveguide, we achieve an f3dB of 108 GHz and demonstrate 256 Gbit s−1 four-level pulse-amplitude modulations with a 475 fJ bit−1 energy cost of the direct-current electrical input.Directly modulated membrane distributed reflector lasers are fabricated on a silicon carbide platform. The 3 dB bandwidth, four-level pulse-amplitude modulation speed and operating energy for transmitting one bit are 108 GHz, 256 Gbit s−1 and 475 fJ, respectively.

Hybrid silicon optical modulator brings efficiency benefits. Demand for more transmission capacity in data centres is increasing due to the continuous growth of Internet traffic. The introduction of external modulators into datacom networks is essential with advanced modulation formats. However, the large footprint of silicon photonics Mach–Zehnder (MZ) modulators will limit further increases in transmission capacity 1 , 2 , 3 , 4 . To overcome this, we introduce III–V compound semiconductors because the large electron-induced refractive-index change, high electron mobility and low carrier-plasma absorption are beneficial for overcoming the trade-offs among the voltage–length product ( V π L ), operation speed and insertion loss of Si MZ modulators. Here, we demonstrate an MZ modulator with a 250-µm-long InGaAsP/Si metal-oxide–semiconductor (MOS) capacitor phase-shifter and obtain a V π L of 0.09 Vcm in accumulation mode, an insertion loss of ∼1.0 dB, a cutoff frequency of ∼2.2 GHz in depletion mode and a 32-Gbit s –1 modulation with signal pre-emphasis. These results are promising for fabricating high-capacity large-scale photonic integrated circuits with low power consumption.

A low operating energy is needed for nanocavity lasers designed for on-chip photonic network applications. On-chip nanocavity lasers must be driven by current because they act as light sources driven by electronic circuits. Here, we report the high-speed direct modulation of a lambda-scale embedded active region photonic-crystal (LEAP) laser that holds three records for any type of laser operated at room temperature: a low threshold current of 4.8 µA, a modulation current efficiency of 2.0 GHz µA −0.5 and an operating energy of 4.4 fJ bit −1 . Five major technologies make this performance possible: a compact buried heterostructure, a photonic-crystal nanocavity, a lateral p–n junction realized by ion implantation and thermal diffusion, an InAlAs sacrificial layer and current-blocking trenches. We believe that an output power of 2.17 µW and an operating energy of 4.4 fJ bit −1 will enable us to realize on-chip photonic networks in combination with the recently developed highly sensitive receivers. High-speed modulation and 4.4 fJ bit −1 data transmission is demonstrated using a photonic-crystal nanocavity laser. Its current threshold of 4.8 µA, modulation current efficiency of 2.0 GHz µA −0.5 and output power of 2.17 µW may enable on-chip photonic networks in combination with recently developed high-sensitivity receivers.

The rapid increase in total transmission capacity within and between data centers requires the construction of low-cost, high-capacity optical transmitters. Since a tremendous number of transmitters are required, photonic integrated circuits (PICs) using Si photonics technology enabling the integration of various functional devices on a single chip is a promising solution. A limitation of a Si-based PIC is the lack of an efficient light source due to the indirect bandgap of Si; therefore, hybrid integration technology of III-V semiconductor lasers on Si is desirable. The major challenges are that heterogeneous integration of III-V materials on Si induces the formation of dislocation at high process temperature; thus, the epitaxial regrowth process is difficult to apply. This paper reviews the evaluations conducted on our epitaxial growth technique using a directly bonded III-V membrane layer on a Si substrate. This technique enables epitaxial growth without the fundamental difficulties associated with lattice mismatch or anti-phase boundaries. In addition, crystal degradation correlating with the difference in thermal expansion is eliminated by keeping the total III-V layer thickness thinner than ~350 nm. As a result, various III-V photonic-device-fabrication technologies, such as buried regrowth, butt-joint regrowth, and selective area growth, can be applicable on the Si-photonics platform. We demonstrated the growth of indium-gallium-aluminum arsenide (InGaAlAs) multi-quantum wells (MQWs) and fabrication of lasers that exhibit >25 Gbit/s direct modulation with low energy cost. In addition, selective-area growth that enables the full O-band bandgap control of the MQW layer over the 150-nm range was demonstrated. We also fabricated indium-gallium-arsenide phosphide (InGaAsP) based phase modulators integrated with a distributed feedback laser. Therefore, the directly bonded III-V-on-Si substrate platform paves the way to manufacturing hybrid PICs for future data-center networks.

Near-future upgrades of intra data center networks and high-performance computing systems would require optical interconnects capable of operating at beyond 100 Gbps/lane. In order for this evolution to be achieved in a sustainable way, high-speed yet energy-efficient transceivers are in need. Towards this direction we have previously demonstrated directly-modulated lasers (DMLs) capable of operating at 50 Gbps/lane with sub-pJ/bit efficiencies based on our novel membrane-III-V-on-Si technology. However, there exists an inherent tradeoff between modulation speed and power consumption due to the carrier-photon dynamics in DMLs. In this work, we alleviate this tradeoff by introducing photon–photon resonance dynamics in our energy-efficient membrane DMLs-on-Si design and demonstrate a device with a maximum 3-dB bandwidth of 47.5 GHz. This denotes a bandwidth increase of more than 2x times compared to our previous membrane DMLs-on-Si. Moreover, the DML is capable of delivering 60-GBaud PAM-4 signals under Ethernet’s KP4-FEC threshold (net data rate of 113.42 Gbps) over 2-km of standard single-mode fiber transmission. DC energy-efficiencies of 0.17 pJ/bit at 25 °C and 0.34 pJ/bit at 50 °C have been achieved for the > 100-Gbps signals. Deploying such DMLs in an integrated multichannel transceiver should ensure a smooth evolution towards Terabit-class Ethernet links and on-board optics subsystems.

In the original article [...]

The ability to directly modulate a nanocavity laser with ultralow power consumption is essential for the realization of a CMOS-integrated, on-chip photonic network, as several thousand lasers must be integrated onto a single chip. Here, we show high-speed direct modulation (3-dB modulation bandwidth of 5.5 GHz) of an ultracompact InP/InGaAsP buried heterostructure photonic-crystal laser at room temperature by optical pumping. The required energy for transmitting one bit is estimated to be 13 fJ. We also achieve a threshold input power of 1.5 µW, which is the lowest observed value for room-temperature continuous-wave operation of any type of laser. The maximum single-mode fibre output power of 0.44 µW is the highest output power, to our knowledge, for photonic-crystal nanocavity lasers under room-temperature continuous-wave operation. Implementing a buried heterostructure leads to excellent device performance, reducing the active region temperature and effectively confining the carriers inside the cavity. Advanced on-chip photonic networks require integrated nanoscale lasers with low power consumption. Researchers have now demonstrated high-speed modulation of a compact heterostructure photonic crystal laser at room temperature with an unprecedented low required energy of ∼13 fJ per bit transmitted.

The ability to directly modulate a nanocavity laser with ultralow power consumption is essential for the realization of a CMOS-integrated, on-chip photonic network, as several thousand lasers must be integrated onto a single chip. Here, we show high-speed direct modulation (3-dB modulation bandwidth of 5.5GHz) of an ultracompact InP/InGaAsP buried heterostructure photonic-crystal laser at room temperature by optical pumping. The required energy for transmitting one bit is estimated to be 13fJ. We also achieve a threshold input power of 1.5 mu W, which is the lowest observed value for room-temperature continuous-wave operation of any type of laser. The maximum single-mode fibre output power of 0.44 mu W is the highest output power, to our knowledge, for photonic-crystal nanocavity lasers under room-temperature continuous-wave operation. Implementing a buried heterostructure leads to excellent device performance, reducing the active region temperature and effectively confining the carriers inside the cavity.

We demonstrate a membrane laser using an InP-based active region combined with a 220-nm-thick Si waveguide, where the Si waveguide width at the middle of the cavity is wider. The laser with a 500-μm long cavity exhibits a 3.3-mA threshold current and ~300-kHz Lorentzian linewidth.

500-μm-long membrane InGaAsP-based Mach-Zehnder modulators (MZMs) and MQW-based semiconductor optical amplifiers (SOAs) are integrated by using regrowth techniques on Si platforms. The fibre-to-fibre loss-less condition achieves with 24-mA SOA bias. The MZM operates at a 10.8-dB extinction ratio with 4 Vpp for 28-Gbit/s NRZ signals.