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Wave propagation is observed through a negative permeability metamaterial immersed in gaseous plasma. A 3D array of split ring resonators (SRR) is enveloped by an inductively heated argon plasma with a nominal plasma frequency of 2.65 GHz. Transmission spectra show electromagnetic waves traverse the composite medium from 1.3–1.7 GHz for which the permeability of the SRRs and the permittivity of the plasma are simultaneously negative. Only surface waves and evanescence are observed outside this frequency band. The edge of the transmission band also shows negative group velocity, albeit with high wave attenuation. The free electron density of the plasma is coupled to the inductive heating, allowing dynamic reconfiguration of the metamaterial’s frequency band and wave impedance.

Over the past decade, conductive hydrogels have received great attention as tissue-interfacing electrodes due to their soft and tissue-like mechanical properties. However, a trade-off between robust tissue-like mechanical properties and good electrical properties has prevented the fabrication of a tough, highly conductive hydrogel and limited its use in bioelectronics. Here, we report a synthetic method for the realization of highly conductive and mechanically tough hydrogels with tissue-like modulus. We employed a template-directed assembly method, enabling the arrangement of a disorder-free, highly-conductive nanofibrous conductive network inside a highly stretchable, hydrated network. The resultant hydrogel exhibits ideal electrical and mechanical properties as a tissue-interfacing material. Furthermore, it can provide tough adhesion (800 J/m 2 ) with diverse dynamic wet tissue after chemical activation. This hydrogel enables suture-free and adhesive-free, high-performance hydrogel bioelectronics. We successfully demonstrated ultra-low voltage neuromodulation and high-quality epicardial electrocardiogram (ECG) signal recording based on in vivo animal models. This template-directed assembly method provides a platform for hydrogel interfaces for various bioelectronic applications. Conductive hydrogels have potential as tissue-interfacing electrodes, but it is challenging to achieve both robust mechanical properties and good electrical properties. Here, the authors report a synthetic method for developing highly conductive and mechanically tough hydrogels, with a tissue-like modulus, for electrocardiogram signal recording.

Human skin is essential for perception, encompassing haptic, thermal, proprioceptive, and pain-sensing functions through ion movement. Additionally, it is mechanically resilient and self-healing for protection. Inspired by these unique properties, researchers have attempted to develop stretchable, self-healing sensors based on ion dynamics. However, most self-healing sensors reported to date suffer from low fracture strength and toughness. In this work, we present an ion-based self-healing electronic skin with exceptionally high fracture strength and toughness. We enhanced self-healing polymers and ionic conductors by introducing two types of orthogonal dynamic crosslinking bonds: dynamic aromatic disulfide bonds and 2-ureido-4-pyrimidone moieties. These dynamic bonds provide autonomous self-healing and high mechanical toughness even in the presence of ionic liquids. As a result, our self-healing polymer and self-healing ionic conductor exhibit remarkable stretchability (700%, 850%), fracture strength (34 MPa, 30 MPa), and toughness (78.5 MJ/m 3 , 87.3 MJ/m 3 ), the highest values reported among self-healing ionic conductors to date. Using our materials, we developed various fully self-healing sensors and a soft gripper capable of autonomously recovering from mechanical damage. By integrating these components, we created a comprehensive self-healing electronic skin suitable for soft robotics applications. Stretchable and self-healing sensors based on ion dynamics usually suffer from low fracture strength and toughness. Here, the authors describe an ion-based self-healing electronic skin with autonomous self-healing, high mechanical toughness and fracture strength.

Mechanically tough and self-healable polymeric materials have found widespread applications in a sustainable future. However, coherent strategies for mechanically tough self-healing polymers are still lacking due to a trade-off relationship between mechanical robustness and viscoelasticity. Here, we disclose a toughening strategy for self-healing elastomers crosslinked by metal–ligand coordination. Emphasis was placed on the effects of counter anions on the dynamic mechanical behaviors of polymer networks. As the coordinating ability of the counter anion increases, the binding of the anion leads to slower dynamics, thus limiting the stretchability and increasing the stiffness. Additionally, multimodal anions that can have diverse coordination modes provide unexpected dynamicity. By simply mixing multimodal and non-coordinating anions, we found a significant synergistic effect on mechanical toughness ( > 3 fold) and self-healing efficiency, which provides new insights into the design of coordination-based tough self-healing polymers. The trade-off relationship between mechanical robustness and viscoelasticity limits the strategies to produce mechanically tough self-healing polymers. Here the authors, introduce a strengthening strategy for self-healing polymers cross-linked by metal-ligand coordination using mixed counter anion dynamics.

Crack assessment is an essential process in the maintenance of concrete structures. In general, concrete cracks are inspected by manual visual observation of the surface, which is intrinsically subjective as it depends on the experience of inspectors. Further, it is time-consuming, expensive, and often unsafe when inaccessible structural members are to be assessed. Unmanned aerial vehicle (UAV) technologies combined with digital image processing have recently been applied to crack assessment to overcome the drawbacks of manual visual inspection. However, identification of crack information in terms of width and length has not been fully explored in the UAV-based applications, because of the absence of distance measurement and tailored image processing. This paper presents a crack identification strategy that combines hybrid image processing with UAV technology. Equipped with a camera, an ultrasonic displacement sensor, and a WiFi module, the system provides the image of cracks and the associated working distance from a target structure on demand. The obtained information is subsequently processed by hybrid image binarization to estimate the crack width accurately while minimizing the loss of the crack length information. The proposed system has shown to successfully measure cracks thicker than 0.1 mm with the maximum length estimation error of 7.3%.

Despite the impressive development of metal halide perovskites in diverse optoelectronics, progress on high-performance transistors employing state-of-the-art perovskite channels has been limited due to ion migration and large organic spacer isolation. Herein, we report high-performance hysteresis-free p-channel perovskite thin-film transistors (TFTs) based on methylammonium tin iodide (MASnI 3 ) and rationalise the effects of halide (I/Br/Cl) anion engineering on film quality improvement and tin/iodine vacancy suppression, realising high hole mobilities of 20 cm 2 V −1 s −1 , current on/off ratios exceeding 10 7 , and threshold voltages of 0 V along with high operational stabilities and reproducibilities. We reveal ion migration has a negligible contribution to the hysteresis of Sn-based perovskite TFTs; instead, minority carrier trapping is the primary cause. Finally, we integrate the perovskite TFTs with commercialised n-channel indium gallium zinc oxide TFTs on a single chip to construct high-gain complementary inverters, facilitating the development of halide perovskite semiconductors for printable electronics and circuits. Progress on high-performance transistor employing perovskite channels has been limited to date. Here, Zhu et al. report hysteresis-free tin-based perovskite thin-film transistors with high hole mobility of 20 cm 2 V –1 S –1 , which can be integrated with commercial metal oxide transistors on a single chip.

High internal phase emulsions have been widely used as templates for various porous materials, but special strategies are required to form, in particular, particle-covered ones that have been more difficult to obtain. Here, we report a versatile strategy to produce a stable high internal phase Pickering emulsion by exploiting a depletion interaction between an emulsion droplet and a particle using water-soluble polymers as a depletant. This attractive interaction facilitating the adsorption of particles onto the droplet interface and simultaneously suppressing desorption once adsorbed. This technique can be universally applied to nearly any kind of particle to stabilize an interface with the help of various non- or weakly adsorbing polymers as a depletant, which can be solidified to provide porous materials for many applications. The fabrication of emulsion droplets stabilized by solid particles adsorbed on the interface is restricted to delicate interfacial conditions. Here, Kim et al . show a general approach to prepare them using the depletion interaction, modified by soluble polymers, between particles and emulsions.

Stretchable polymer semiconductors (PSCs) are essential for soft stretchable electronics. However, their environmental stability remains a longstanding concern. Here we report a surface-tethered stretchable molecular protecting layer to realize stretchable polymer electronics that are stable in direct contact with physiological fluids, containing water, ions and biofluids. This is achieved through the covalent functionalization of fluoroalkyl chains onto a stretchable PSC film surface to form densely packed nanostructures. The nanostructured fluorinated molecular protection layer (FMPL) improves the PSC operational stability over an extended period of 82 days and maintains its protection under mechanical deformation. We attribute the ability of FMPL to block water absorption and diffusion to its hydrophobicity and high fluorination surface density. The protection effect of the FMPL (~6 nm thickness) outperforms various micrometre-thick stretchable polymer encapsulants, leading to a stable PSC charge carrier mobility of ~1 cm 2  V −1  s −1 in harsh environments such as in 85–90%-humidity air for 56 days or in water or artificial sweat for 42 days (as a benchmark, the unprotected PSC mobility degraded to 10 −6  cm 2  V −1  s −1 in the same period). The FMPL also improved the PSC stability against photo-oxidative degradation in air. Overall, we believe that our surface tethering of the nanostructured FMPL is a promising approach to achieve highly environmentally stable and stretchable polymer electronics. A surface functionalization approach allows for preparing a nanostructured molecular protection layer, enabling stretchable polymer electronics that stably operate in physiological environments over 80 days.

Packaging in stretchable electronics is crucial to protect components from environmental damage while preserving mechanical flexibility and providing electrical insulation. The conventional packaging process involves multiple steps that increase in complexity as the number of circuit layers multiply. In this study, we introduce a self-packaged stretchable printed circuit board enabled by the in situ phase separation of liquid metal particles (LMPs) within various polymer matrices during solution-based printing processes. The ligand-bound LMPs (LB-LMPs), engineered to inhibit oxide growth, undergo in situ sintering, prompting vertical phase separation. This synthesis strategy not only achieves high initial conductivity of the LMPs but also encapsulates them within the polymer matrix, preventing leakage and providing electrical insulation. Our method enables multi-layer circuit printing, eliminating the need for additional activation and packaging processes. Furthermore, by integrating conductive materials into packaging layers for selective electrical conductivity, vertical interconnect accesses and conductive pads can be formed, enabling large-scale, stretchable, and leakage-free multi-layer electrical circuits and bio-interfaces. Conventional stretchable circuit fabrication requires complex packaging to prevent leakage. Here the authors introduce a self packaging stretchable circuit enabled by in situ sintering of ligand-bound liquid metal particles, allowing scalable, leakage-free, multilayer integration.

Grover search algorithm is the most representative quantum attack method that threatens the security of symmetric key cryptography. If the Grover search algorithm is applied to symmetric key cryptography, the security level of target symmetric key cryptography can be lowered from n-bit to n2-bit. When applying Grover’s search algorithm to the block cipher that is the target of potential quantum attacks, the target block cipher must be implemented as quantum circuits. Starting with the AES block cipher, a number of works have been conducted to optimize and implement target block ciphers into quantum circuits. Recently, many studies have been published to implement lightweight block ciphers as quantum circuits. In this paper, we present optimal quantum circuit designs of symmetric key cryptography, including PRESENT and GIFT block ciphers. The proposed method optimized PRESENT and GIFT block ciphers by minimizing qubits, quantum gates, and circuit depth. We compare proposed PRESENT and GIFT quantum circuits with other results of lightweight block cipher implementations in quantum circuits. Finally, quantum resources of PRESENT and GIFT block ciphers required for the oracle of the Grover search algorithm were estimated.