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The increasing speed of fibre-optic-based telecommunications has focused attention on high-speed optical processing of digital information 1 . Complex optical processing requires a high-density, high-speed, low-power optical memory that can be integrated with planar semiconductor technology for buffering of decisions and telecommunication data 2 . Recently, ring lasers with extremely small size and low operating power have been made 3 , 4 , 5 , 6 , 7 , and we demonstrate here a memory element constructed by interconnecting these microscopic lasers. Our device occupies an area of 18 × 40 µm 2 on an InP/InGaAsP photonic integrated circuit, and switches within 20 ps with 5.5 fJ optical switching energy. Simulations show that the element has the potential for much smaller dimensions and switching times. Large numbers of such memory elements can be densely integrated and interconnected on a photonic integrated circuit: fast digital optical information processing systems employing large-scale integration should now be viable.

Metallic cavities can confine light to volumes with dimensions considerably smaller than the wavelength of light. It is commonly believed, however, that the high losses in metals are prohibitive for laser operation in small metallic cavities. Here we report for the first time laser operation in an electrically pumped metallic-coated nanocavity formed by a semiconductor heterostructure encapsulated in a thin gold film. The demonstrated lasers show a low threshold current and their dimensions are smaller than the smallest electrically pumped lasers reported so far. With dimensions comparable to state-of-the-art electronic transistors and operating at low power and high speed, they are a strong contender as basic elements in digital photonic very large-scale integration. Furthermore we demonstrate that metallic-coated nanocavities with modal volumes smaller than dielectric cavities can have moderate quality factors.

Open access to generic technology platforms for photonic integrated circuit manufacturing enables low-cost development of application-specific photonic chips for novel or improved products. It brings photonic ICs within reach for many industrial users and research institutes, by moving toward a fabless business model. In the current status, InP-based open access manufacturing services are offered through multi-project wafer runs by Fraunhofer Heinrich Hertz Institut, SMART Photonics, and Oclaro. In this paper, we review state-of-the-art InP photonic integration technology platforms, present examples of complex InP photonic ICs developed in the generic technologies, and give a prospect for further development of these photonic integration platforms.

The generic foundry approach will lead to a revolution in micro and nanophotonics, just as it did in microelectronics thirty years ago. Generic integration leads to a drastic reduction in the entry costs for developing Photonic Integrated Circuits. Integrated circuits using generic integration open up a whole new range of applications including data communications, fiber-to- the-home, fiber sensors, gas sensing, medical diagnostics, metrology and consumer photonics. Present status and prospects of InP-based photonic foundry technology are reviewed.