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The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues. Although there are several polymer dielectrics available commercially, there are numerous challenges associated with incorporating them into interposers or package substrates. This article reviewed the properties of polymer dielectric materials currently available, their properties, and the challenges associated with their fabrication, electrical performance, mechanical reliability, and electrical reliability. The current state-of-the-art is discussed, and guidelines are provided for polymer dielectrics for the next-generation interposers.

In this paper, package integration of glass–based passive components for 5G new radio (NR) millimeter–wave (mm wave) bands and an analysis of their system performance are presented. Passive components such as diplexers and couplers covering 5G NR mm wave bands n257, n258 and n260 are modeled, designed, fabricated and characterized individually along with their integrated versions. Non–contiguous diplexers are designed using three different types of filters, hairpin, interdigital and edge–coupled, and combined with a broadband coupler to emulate a power detection and control circuitry block in an RF transmitter chain. A panel–compatible semi–additive patterning (SAP) process is utilized to form high–precision redistribution layers (RDLs) on laminated glass substrate, onto which fine features with tight tolerance are added to fabricate these structures. The diplexers exhibit low insertion loss, low VSWR and high isolation, and have a small footprint. A system performance analysis using a co–simulation technique is presented for the first time to quantify the distortion in amplitude and phase produced by the fabricated passive component block in terms of error vector magnitude (EVM). Moreover, the scalability of this approach to compare similar passive components based on their specifications and signatures using a system–level performance metric such as EVM is discussed.

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

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Glass-based materials, including polymer/glass stack ups, are attractive structural blocks for packaging substrates supporting 5 G and 6 G microelectronic modules and components. We present the first broadband characterization of AGC Inc. EN-A1 alkali-free boroaluminosilicate glass and of Ajinomoto Build-up Film (ABF) laminated on soda-lime float glass substrate from 200 GHz to 2.5 THz with a commercial terahertz time-domain spectroscopy (THz-TDS) system. The refractive index n ( ν ) , attenuation coefficient α ( ν ) , permittivity ε ′ ( ν ) , and loss tangent tan δ ( ν ) of EN-A1 glass as well as laminated ABF are n EN - A 1 = 2.376 , α EN - A 1 = 31.1 cm - 1 , ε EN - A 1 ′ = 5.64 , tan δ EN - A 1 = 0.062 , and n ABF = 1.9 , α ABF = 30 cm - 1 , ε ABF = 3.8 , tan δ ABF = 0.072 , all at 1 THz. Our results validate the promising perspective of both EN-A1 glass and ABF polymer materials as microwave and THz packaging solutions.

We propose a machine-learning approach for design of planar inverted-F antennas with a magneto-dielectric nanocomposite substrate. It is shown that machine-learning techniques can be efficiently used to characterize nanomagnetic-based antennas by accurately mapping the particle radius and volume fraction of the nanomagnetic material to antenna parameters such as gain, bandwidth, radiation efficiency, and resonant frequency. A modified mixing rule model is also presented. In addition, the inverse problem is addressed through machine learning as well, where given the antenna parameters, the corresponding design space of possible material parameters is identified.

Cobalt–polymer magnetic nanocomposites have been synthesized and characterized for their microstructure and properties such as permeability, permittivity, dielectric and magnetic losses from 100 MHz to 2 GHz to study their suitability as antenna dielectrics. Oxide-passivated cobalt nanoparticles were dispersed in epoxies to form nanocomposite toroids and thin-film resonator structures on organic substrates. Permeabilities of 2.10 and 2.65 were measured up to 500 MHz, respectively, with 25-nm to 50-nm and 5-nm nanoparticles in the nanocomposites. The loss tangent ranged from 0.02 to 0.04 at these frequencies. A combination of stable permeability of ∼2 at 1 GHz to 2 GHz and permittivity of ∼7 was achieved with nanocomposites having 5-nm nanoparticles. The magnetic nanomaterials described in this paper can overcome the limitations from domain-wall and eddy-current losses in microscale metal–polymer composites, leading to enhanced frequency stability. The paper also demonstrates integration of metal–polymer nanocomposites as thin-film build-up layers with two-metal-layer structures on organic substrates.

In this paper, we propose a low-cost approach for testing GHz RF amplifiers. It is demonstrated for the first time that GHz RF amplifiers can be tested for their specifications using oscillation principles . In the test mode, the RF test signal is “self generated” by the amplifier with the help of additional external circuitry which forces the amplifier to oscillate (Barkhausen criterion) around its characteristic frequency. The RF sinusoidal output from the oscillating RF amplifier is down-converted to a lower frequency enabling low frequency test response analysis as well as increased sensitivity to parametric deviations. In addition to the detection of catastrophic failures, it is shown that multiple RF specifications (Gain, P1dB, and Noise Figure) can be predicted via analysis of the frequency of the down-converted response . To account for RF parasitics on the production floor, a calibration technique is proposed in the test-setup. Thus, the proposed method reduces test cost significantly by reducing the cost of test setup (by as much as 80%) and significantly reducing test time. The viability of the proposed test method is demonstrated both by simulation experiments and measurement.

In this paper we consider the problem of developing a computational model for emulating an RF channel. The motivation for this is that an accurate and scalable emulator has the potential to minimize the need for field testing, which is expensive, slow, and difficult to replicate. Traditionally, emulators are built using a tapped delay line model where long filters modeling the physical interactions of objects are implemented directly. For an emulation scenario consisting of \\(M\\) objects all interacting with one another, the tapped delay line model's computational requirements scale as \\(O(M^3)\\) per sample: there are \\(O(M^2)\\) channels, each with \\(O(M)\\) complexity. In this paper, we develop a new ``direct path\" model that, while remaining physically faithful, allows us to carefully factor the emulator operations, resulting in an \\(O(M^2)\\) per sample scaling of the computational requirements. The impact of this is drastic, a \\(200\\) object scenario sees about a \\(100\\times\\) reduction in the number of per sample computations. Furthermore, the direct path model gives us a natural way to distribute the computations for an emulation: each object is mapped to a computational node, and these nodes are networked in a fully connected communication graph. Alongside a discussion of the model and the physical phenomena it emulates, we show how to efficiently parameterize antenna responses and scattering profiles within this direct path framework. To verify the model and demonstrate its viability in hardware, we provide several numerical experiments produced using a cycle level C++ simulator of a hardware implementation of the model.