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result(s) for
"Szubartowski, Damian"
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Ecological Composite Materials Based on Polylactide (PLA) and Organic Fillers: Coffee Grounds and Hen Eggshells Produced by the FDM Method: Mechanical, Thermal Properties, Stress Relaxation and Creep
by
Gaweł, Anna
,
Setlak, Kinga
,
Liber-Kneć, Aneta
in
3-D printers
,
3D printing
,
Air quality management
2025
In this article, an ecological composite based on a neat polylactide with 50 and 75% degrees of coffee particles and eggshells as an infill and organic filler, was developed. It has been shown that the content of fillers used reduced the mechanical properties, increasing the possibility of environmental degradation and accelerating the biodegradation process. During the additive production of polylactide with 10% of coffee grounds as a filler, it was possible to reduce the additive manufacturing temperature, which reduced the process time, energy costs, carbon dioxide emissions and the amount of polymer that may affect the environment. The structure of polylactide enriched with hen eggshells is characterized by roan and irregular shapes, which can cause a high tendency to form a concentration of cracks in these areas. Based on the results obtained from the stress relaxation test, the Zener model was used to describe a creep model of the produced ecological composites. The polymer composition of coffee grounds and eggshells shows a tendency to creep faster than pure polylactide and with different degrees of infill. Voids reduce the strength of composite materials, which increases the creep potential of samples with incomplete degrees of infill.
Journal Article
On The Stress Free Deformation Of Linear FGM Interface Under Constant Temperature
2015
This paper demonstrates the stress free thermo-elastic problem of the FGM thick plate. Existence of such a purely thermal deformation is proved in two ways. First proof is based on application of the Iljushin thermo-elastic potential to displacement type system of equations. This reduces 3D problem to the plane stress state problem. Next it is shown that the unique solution fulfils conditions of simultaneous constant temperature and linear gradation of thermal expansion coefficient. Second proof is based directly on stress type system of equations which straightforwardly reduces to compatibility equations for purely thermal deformation. This occurs if only stress field is homogeneous in domain and at boundary. Finally an example of application to an engineering problem is presented.
Journal Article