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An initial study has been conducted to characterize the surface morphology of treated Indium Tin Oxide (ITO). Treatment done is annealing process where the samples are put through heat and annealed for an hour. Time of deposition and layers of ITO has been varied to study the correlation between both.The treated ITO are examined under Atomic Force Microscopy (AFM) for the surface roughness and the grain size. Results shows that deposition time of ITO do play an important role in determining a desired grain size in ITO material.

The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70 °C. Electroless nickel time has more influence to the bump height compared to immersion gold time.

Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds number 500 and step height 1μm. Numerical simulation was performed usingAnsys-CFX software with the assumption of Newtonian fluid and laminar condition. The simulation result showed that wall shear stress distribution increased after the fluid passing through the step.

Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different cross-sections has been topic in previous studies. In this paper, numerical simulation of fluid flow in Forward Facing Step (FFS) configuration was performed to investigate velocity profile after the step. Reynolds numbers (Re) 100 with different step heights, 1μm and 3μm were used to observe trend occurs in the flow characteristics. The result illustrated an increase of velocity distribution with the increase of the step height.

This paper reports on the contact angle measurement analysis on a glass based surface for anodic bonding process cleaned by three distinct cleaning processes. The three types of glass based surface used were silica, pyrex, and soda lime glass. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. The solid surface is considered hydrophilic when water contact angle is smaller than 90°, and hydrophobic profile if the water contact angle is larger than 90°. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.