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36,530 result(s) for "Copper products"
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Fragmentation of Cusub.2O Oxides Caused by Various States of Stress Resulting from Extreme Plastic Deformation
The development of microelectronics results in higher demand for copper microwires and thin foils. Higher demand requires conducting research to obtain knowledge on the influence of extreme plastic deformation on materials’ susceptibility to plastic processing without the loss of coherence. One of the key factors contributing to rupture during the plastic deformation of copper is the presence of micrometer-sized, eutectic Cu[sub.2]O oxides, which are weakly bound to the copper matrix. These oxides are formed during the metallurgical stage of wire rod copper manufacturing. Copper wire rod of the ETP (electrolytic tough pitch) grade was subjected to wire drawing followed by cold-rolling. Applying different states of stress during plastic deformation (wire drawing, cold-rolling, and upsetting) made it possible to specify the conditions required for Cu[sub.2]O oxides’ fragmentation due to the extreme total deformation. Qualitative and quantitative analyses of the Cu[sub.2]O oxides’ evolution and fragmentation as the plastic deformation progressed were the main focus of this paper. It was determined that major fragmentation occurred during the initial stages of plastic deformation. Applying further extreme deformation or changing the state of stress during plastic deformation did not facilitate the continuation of fragmentation. It was only their shape that was becoming elongated.
Experimental and numerical study of forced convection heat transfer in a upward two-phase flow of air-water/SiO.sub.2 nanofluid with slug flow regime
This paper studied the heat transfer characteristics of the upward vertical two-phase flow of air and water/SiO.sub.2 nanofluid under constant heat flux conditions with a slug flow regime. An experimental setup has been erected. The test section included a vertical copper pipe with an 11 mm inner diameter and a 1.6 m length. The concentration range of nano-SiO.sub.2 in the nanofluids was reported as 0.1-0.5 mass%. Also, 0.5 mass% of sodium dodecyl sulfate (SDS) was added to the base fluid as a surfactant in all of the tests. In order to control the slug flow regime according to the Beggs and Brill flow pattern map in the vertical pipe, liquid Reynolds numbers were controlled from 2100 to 9600 and gas Reynolds numbers were 820 to 1650. The results indicated higher heat transfer coefficient (HTC) and Nusselt numbers of air/aqueous nanosilica nanofluids relative to the two-phase flow of air/water with the same regime. In two-phase flows with maximum Reynolds numbers, the upmost HTC was obtained at 0.5 mass% of nanosilica. The simulation results presented an average relative error less than 10%, which indicates that the experimental and simulation results are in good agreement.
Oxide-Derived Copper Nanowire Bundles for Efficient COsub.2 Reduction to Multi-Carbon Products
Cu-based catalysts for efficient C[sub.2+] production from CO[sub.2] electrocatalytic reduction reaction (CO[sub.2]ERR) exhibit significant promise, but still suffer from ambiguous mechanisms due to the intrinsic structure instability during electroreduction. Herein, we report an oxide-derived copper nanowire bundle (OD-Cu NWB) for efficient CO[sub.2]ERR to C[sub.2+] products. OD-Cu NWBs with a well-preserved nanowire bundle morphology lead to promoted multi-carbon production compared to commercial copper powders. The formation of OD-Cu NWBs shows a great dependence on the precipitation/calcination temperatures and per-reduction potentials, which further influence the ultimate CO[sub.2]ERR performance correspondingly. The optimized preparation parameters for the formation of a well-ordered nanowire bundle morphology are found, leading to a preferred C[sub.2+] production ability. Besides the nanowire bundle morphology, the oxide-derived Cu essence of OD-Cu NWBs with stabilized Cu[sup.+] species from per-reduction also promotes the CO[sub.2]ERR activity and facilitates the C-C coupling of key intermediates for C[sub.2+] production. This work provides a facile strategy and inspiration for CO[sub.2]ERR catalyst developments targeting high-valued multi-carbon products.
Metal and Silicate Particles Including Nanoparticles Are Present in Electronic Cigarette Cartomizer Fluid and Aerosol
Electronic cigarettes (EC) deliver aerosol by heating fluid containing nicotine. Cartomizer EC combine the fluid chamber and heating element in a single unit. Because EC do not burn tobacco, they may be safer than conventional cigarettes. Their use is rapidly increasing worldwide with little prior testing of their aerosol. We tested the hypothesis that EC aerosol contains metals derived from various components in EC. Cartomizer contents and aerosols were analyzed using light and electron microscopy, cytotoxicity testing, x-ray microanalysis, particle counting, and inductively coupled plasma optical emission spectrometry. The filament, a nickel-chromium wire, was coupled to a thicker copper wire coated with silver. The silver coating was sometimes missing. Four tin solder joints attached the wires to each other and coupled the copper/silver wire to the air tube and mouthpiece. All cartomizers had evidence of use before packaging (burn spots on the fibers and electrophoretic movement of fluid in the fibers). Fibers in two cartomizers had green deposits that contained copper. Centrifugation of the fibers produced large pellets containing tin. Tin particles and tin whiskers were identified in cartridge fluid and outer fibers. Cartomizer fluid with tin particles was cytotoxic in assays using human pulmonary fibroblasts. The aerosol contained particles >1 µm comprised of tin, silver, iron, nickel, aluminum, and silicate and nanoparticles (<100 nm) of tin, chromium and nickel. The concentrations of nine of eleven elements in EC aerosol were higher than or equal to the corresponding concentrations in conventional cigarette smoke. Many of the elements identified in EC aerosol are known to cause respiratory distress and disease. The presence of metal and silicate particles in cartomizer aerosol demonstrates the need for improved quality control in EC design and manufacture and studies on how EC aerosol impacts the health of users and bystanders.
Epitaxial growth of a 100-square-centimetre single-crystal hexagonal boron nitride monolayer on copper
The development of two-dimensional (2D) materials has opened up possibilities for their application in electronics, optoelectronics and photovoltaics, because they can provide devices with smaller size, higher speed and additional functionalities compared with conventional silicon-based devices 1 . The ability to grow large, high-quality single crystals for 2D components—that is, conductors, semiconductors and insulators—is essential for the industrial application of 2D devices 2 – 4 . Atom-layered hexagonal boron nitride (hBN), with its excellent stability, flat surface and large bandgap, has been reported to be the best 2D insulator 5 – 12 . However, the size of 2D hBN single crystals is typically limited to less than one millimetre 13 – 18 , mainly because of difficulties in the growth of such crystals; these include excessive nucleation, which precludes growth from a single nucleus to large single crystals, and the threefold symmetry of the hBN lattice, which leads to antiparallel domains and twin boundaries on most substrates 19 . Here we report the epitaxial growth of a 100-square-centimetre single-crystal hBN monolayer on a low-symmetry Cu (110) vicinal surface, obtained by annealing an industrial copper foil. Structural characterizations and theoretical calculations indicate that epitaxial growth was achieved by the coupling of Cu step edges with hBN zigzag edges, which breaks the equivalence of antiparallel hBN domains, enabling unidirectional domain alignment better than 99 per cent. The growth kinetics, unidirectional alignment and seamless stitching of the hBN domains are unambiguously demonstrated using centimetre- to atomic-scale characterization techniques. Our findings are expected to facilitate the wide application of 2D devices and lead to the epitaxial growth of broad non-centrosymmetric 2D materials, such as various transition-metal dichalcogenides 20 – 23 , to produce large single crystals. The epitaxial growth of large single-crystal hexagonal boron nitride monolayers on low-symmetry copper foils is demonstrated.
A DFT + IU/I Study on the Stability of Small Cusub.N Clusters : Calculation of Phonon Frequencies
Despite the interest in copper clusters, a consensus on their atomic structure is still lacking. The experimental observation of isolated clusters is difficult, and theoretical predictions vary widely. The latter is because one must adequately describe the closed shell of d electrons both in its short- and long-range effects. Herein, we investigate the stability of small copper clusters (Cu[sub.N], N = 3–6 atoms) using spin-polarized DFT calculations under the GGA approximation, the Hubbard U correction, and the van der Waals forces. We found that the spin-polarized and vdW contributions have little effect on the binding energies of the isomers. The inclusion of U represents the most relevant contribution to the ordering of the Cu[sub.N] isomers, and our calculated binding energies for the clusters agreed with the experimental values. We also found that atomic relaxations alone are not enough to determine the stability of small copper clusters. It is also necessary to build the energy landscape or calculate the vibrational frequencies of the isomers. We found that the vibrational frequencies of the isomers were in the THz range and the normal modes of vibration were discrete. This approach is relevant to future studies involving isolated or supported copper clusters.
Supported NHC-Benzimi@Cu Complex as a Magnetically Separable and Reusable Catalyst for the Multicomponent and Click Synthesis of 1,4-Disubstituted 1,2,3-Triazoles via Huisgen 1,3-Dipolar Cycloaddition
In this paper, we report a novel magnetically separable silica coated copper nano-magnetite NHC-benzimi@Cu complex as heterogeneous catalyst for the multicomponent click reaction via Huisgen 1,3-dipolar cycloaddition reaction of alkyl or aryl halide, sodium azide and terminal alkyne, which affords various1,4-disubstituted 1,2,3-triazoles. The multistep prepared nano catalyst has been characterized by various spectroscopic methods such as FT-IR, TGA, EDX, XRD, TEM and VSM. The heterogeneous nano catalyst structures coated on the copper surface are responsible for the excellent catalyst performances in the reaction. The reusability of the catalyst makes the present protocol more fascinating from an environmental and economic point of view.Graphic Abstract
Exploring the Efficacy of Benzimidazolone Derivative as Corrosion Inhibitors for Copper in a 3.5 wt.% NaCl Solution: A Comprehensive Experimental and Theoretical Investigation
This study focuses on the synthesis, theoretical analysis, and application of the corrosion inhibitor known as benzimidazolone, specifically 1-(cyclohex-1-enyl)-1,3-dihydro-2H-benzimiazol-2-one (CHBI). The structure of CHBI was determined by X-ray diffraction (XRD). The inhibitory properties of CHBI were investigated in a 3.5 wt.% NaCl solution on pure copper using various electrochemical techniques such as potentiodynamic polarization curves (PDPs) and electrochemical impedance spectroscopy (EIS), as well as scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDX), UV-visible spectroscopy, and theoretical calculations. The obtained results indicate that CHBI is an excellent inhibitor, exhibiting remarkable effectiveness with an inhibition rate of 86.49% at 10−3 M. To further confirm the extent of adsorption of the inhibitory molecule on the copper surface, density functional theory (DFT) and Monte Carlo (MC) simulation studies were conducted. The results of this study demonstrate the synthesis and characterization of CHBI as a corrosion inhibitor. The experimental and theoretical analyses provide valuable insights into the inhibitory performance of CHBI, indicating its strong adsorption on the copper surface.