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"Electroforming"
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Electroforming
Electroforming is a technique used by jewellery makers as well as ceramicists and glass artists. It allows the manufacture of delicate and/or irregular shapes that would be difficult to achieve by other means. This highly illustrated handbook covers the topic in detail.
Book
Research on integrated design of MEMS setback safety mechanism
In response to the requirement for the integrated design and manufacturing of non-silicon MEMS safety and arming devices, a MEMS setback safety mechanism with an integrated design is proposed. Its movable parts are electroformed synchronously with the substrate, having the same thickness and eliminating the need for assembly. The dynamic characteristics of the setback safety mechanism with a dislocation-type sliding tooth structure are simulated and analyzed, and the structural parameters of the sliding teeth are determined. The test results show that after the drop test of the integrated setback safety mechanism, the mechanism does not deform and can meet the requirements of drop safety; after the firing test of a 35mm grenade, only one prototype has a failure of the setback spring breaking, and all the setback safety mechanisms can be armed. It basically meets the usage requirements, verifying the feasibility of the integrated design and manufacturing.
Journal Article
Improved Design of Electroforming Equipment for the Manufacture of Sinker Electrical Discharge Machining Electrodes with Microtextured Surfaces
The development of microtextures has had a transformative impact on surface design in engineering, leading to substantial advancements in the performance, efficiency, and functionality of components and tools. This study presents an innovative methodology for fabricating SEDM electrodes. The methodology combines additive manufacturing by mask stereolithography with an optimized electroforming process to obtain high-precision copper shells. A key aspect of the study involved redesigning the electroforming equipment, enabling the independent examination of critical variables such as anode–cathode distance and electrolyte recirculation. This approach allowed precise analysis of their impact on metal deposition. This redesign enabled the assessment of the impact of electrolyte recirculation on the quality of the shells obtained. The findings indicate that continuous recirculation at 60% power effectively reduced thickness deviation by up to 32.5% compared to the worst-case scenario, achieving average thicknesses within the functional zone of approximately 110 µm. In contrast, the absence of flow or excessive turbulence did not generate defects such as unfilled zones or non-uniform thicknesses. The shells obtained were validated as functional tools in SEDM, demonstrating their viability for the generation of textures with high geometric fidelity. This approach optimizes the manufacturing of textured electrodes and opens new opportunities for their application in advanced industrial processes, providing a more efficient and sustainable alternative to conventional methods.
Journal Article
Research and Exploration of Terahertz Feeder Manufacturing Technology Based on Micro-precision Machining
With the development of radar towards high frequency, the demand for terahertz waveguides and other devices is gradually increasing. But it is difficult to prepare such high-precision micro-devices by conventional processing methods. This paper summarizes several micromachining methods commonly used in terahertz feeder devices. On this basis, according to the development requirements of a certain type of terahertz waveguide with the characteristic of single-input-four-output, an experimental exploration is carried out. In the development process, the methods of precision NC machining and micro electroforming are comprehensively applied. which breaks through the difficulties of reliable transfer of surface coating and efficient dissolution of micro mold. The sample that meets dimensional accuracy and microwave performance was successfully prepared. The scheme has a reasonable process setting and can promote the engineering application of terahertz waveguide devices.
Journal Article
Tribological characteristics and advanced processing methods of textured surfaces: a review
Surface texture is one of the hot spots in the field of surface tribology. It promotes friction by storing lubricating oil and abrasive particles, and in some cases it can also improve hydrodynamic effects. Since it has been widely used in mechanical parts, tribological characteristics and surface quality cannot be ignored. Nowadays, there are many ways to fabricate surface texture. Several classification methods based on different processing principles are introduced in this paper. It includes direct laser ablation, mechanical processing, EDM and ECM in material reduction processing, laser cladding, deposition method, and electroforming in additive processing and laser shock processing in deformation processing. The surface texture with good quality can be obtained by selecting proper machining method and proper machining parameters. The machining principle of each method, the research status of surface morphology of surface texture, and the advantages and disadvantages of each method are summarized. Finally, potential hybrid processing methods including their advantages and disadvantages as well as examples are presented.
Journal Article
A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength
Multilayer electroforming has a high potential to produce Ni/Ni layer structured metal walls with excellent material properties and a high thickness uniformity. However, Ni is easily oxidized in air, which fundamentally leads to a low adhesion strength between the Ni layers. Here, a novel in situ treatment is proposed for improving the adhesion performance between Ni layers. This treatment integrated the steps of electrochemical dissolution, surface protection, and electroforming. A study of the polarization behavior implied the electroformed Ni layer was dissolved efficiently in the NH2SO3H solution, beginning at a dissolution current density of 5 A·cm−2, which could remove the oxide film. A smooth substrate surface with a good surface hydrophilicity was obtained starting at 8 A·cm−2, helping to protect the activated substrate from being contaminated and oxidized. The experimental results showed that ultrahigh normal and shear adhesion strengths over 400 MPa between the Ni layers were achieved.
Journal Article
Exploring the Reconfigurable Memory Effect in Electroforming-Free YMnO3-Based Resistive Switches: Towards a Tunable Frequency Response
Memristors, since their inception, have demonstrated remarkable characteristics, notably the exceptional reconfigurability of their memory. This study delves into electroforming-free YMnO3 (YMO)-based resistive switches, emphasizing the reconfigurable memory effect in multiferroic YMO thin films with metallically conducting electrodes and their pivotal role in achieving adaptable frequency responses in impedance circuits consisting of reconfigurable YMO-based resistive switches and no reconfigurable passive elements, e.g., inductors and capacitors. The multiferroic YMO possesses a network of charged domain walls which can be reconfigured by a time-dependent voltage applied between the metallically conducting electrodes. Through experimental demonstrations, this study scrutinizes the impedance response not only for individual switch devices but also for impedance circuitry based on YMO resistive switches in both low- and high-resistance states, interfacing with capacitors and inductors in parallel and series configurations. Scrutinized Nyquist plots visually capture the intricate dynamics of impedance circuitry, revealing the potential of electroforming-free YMO resistive switches in finely tuning frequency responses within impedance circuits. This adaptability, rooted in the unique properties of YMO, signifies a paradigm shift heralding the advent of advanced and flexible electronic technologies.
Journal Article
Thermally stable threshold selector based on CuAg alloy for energy-efficient memory and neuromorphic computing applications
As a promising candidate for high-density data storage and neuromorphic computing, cross-point memory arrays provide a platform to overcome the von Neumann bottleneck and accelerate neural network computation. In order to suppress the sneak-path current problem that limits their scalability and read accuracy, a two-terminal selector can be integrated at each cross-point to form the one-selector-one-memristor (1S1R) stack. In this work, we demonstrate a CuAg alloy-based, thermally stable and electroforming-free selector device with tunable threshold voltage and over 7 orders of magnitude ON/OFF ratio. A vertically stacked 64 × 64 1S1R cross-point array is further implemented by integrating the selector with SiO
2
-based memristors. The 1S1R devices exhibit extremely low leakage currents and proper switching characteristics, which are suitable for both storage class memory and synaptic weight storage. Finally, a selector-based leaky integrate-and-fire neuron is designed and experimentally implemented, which expands the application prospect of CuAg alloy selectors from synapses to neurons.
Designing efficient selector devices remains a challenge. Here, the authors propose a CuAg alloy-based selector with excellent ON/OFF ratio and thermal stability. It can effectively suppress the sneak-path current in 1S1R arrays, making it suitable for storage class memory and neuromorphic computing applications.
Journal Article
Effect of Ag Concentration Dispersed in HfOx Thin Films on Threshold Switching
A sneak path current—a current passing through a neighboring memory cell—is an inherent and inevitable problem in a crossbar array consisting of memristor memory cells. This serious problem can be alleviated by serially connecting the selector device to each memristor cell. Among the various types of selector device concepts, the diffusive selector has garnered considerable attention because of its excellent performance. This selector features volatile threshold switching (TS) using the dynamics of active metals such as Ag or Cu, which act as an electrode or dopant in the solid electrolyte. In this study, a diffusive selector based on Ag-doped HfOx is fabricated using a co-sputtering system. As the Ag concentration in the HfOx layer varies, different electrical properties and thereby TS characteristics are observed. The necessity of the electroforming (EF) process for the TS characteristic is determined by the proper Ag concentration in the HfOx layer. This difference in the EF process can significantly affect the parameters of the TS characteristics. Therefore, an optimized doping condition is required for a diffusive selector to attain excellent selector device behavior and avoid an EF process that can eventually degrade device performance.
Journal Article
Effect of Cathode Rotation Speed on Mechanical Properties of Abrasive-Assisted Copper Electroforming with High Anode Current Density
In traditional sulfate electroforming copper without additives, the electroformed deposit often exhibits defects such as pinholes, burrs and nodules. The mechanical properties of copper electroforming deposits can be improved through an abrasive-assisted electroforming process at high current density. However, excessive dissolution of copper anodes often results in the generation of a significant amount of copper ions, which subsequently turn into copper powder by disproportionation reaction, leading to the formation of burrs on the surface of cathode. In this paper, the anode area is increased to reduce the anode current density and enhance the electric field. This can improve electric field and decrease Cu
+
or copper powder in the solution. The experimental results show that the mechanical properties of the electroformed deposit with bilateral anodes are significantly improved. The electroformed copper deposit with a microhardness value of 138.4 HV, a tensile strength of 259.2 Mpa and an elongation of 13.6% can be obtained, which is increased by 8.5, 27.2 and 1.7%, respectively, compared with the one-sided placement.
Journal Article