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Modern digital cameras employ silicon focal plane array (FPA) image sensors featuring millions of pixels. However, it is possible to make a camera that only needs one pixel. In these cameras a spatial light modulator, placed before or after the object to be imaged, applies a time-varying pattern and synchronized intensity measurements are made with a single-pixel detector. The principle of compressed sensing then allows an image to be generated. As the approach suits a wide a variety of detector technologies, images can be collected at wavelengths outside the reach of FPA technology or at high frame rates or in three dimensions. Promising applications include the visualization of hazardous gas leaks and 3D situation awareness for autonomous vehicles.

Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world 1 . The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller 2 . In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam divergence (0.050° × 0.049°) and a random-access beam addressing with sub-MHz operation speed. The 128 × 128-element focal plane switch array (FPSA) of grating antennas and microelectromechanical systems (MEMS)-actuated optical switches are monolithically integrated on a 10 × 11-mm 2 silicon photonic chip, where a 128 × 96 subarray is wire bonded and tested in experiments. 3D imaging with a distance resolution of 1.7 cm is achieved with frequency-modulated continuous-wave (FMCW) ranging in monostatic configuration. The FPSA can be mass-produced in complementary metal–oxide–semiconductor (CMOS) foundries, which will allow ubiquitous 3D sensors for use in autonomous cars, drones, robots and smartphones. A large focal plane switch array is constructed to steer the laser beam of a LiDAR system, leading to 3D imaging with 16,384 pixels, improving the resolution and coverage of solid-state LiDARs.

The ability to image invisible gases has applications in industrial and environmental monitoring settings, but is technologically challenging to embed in a low-cost device. For example, imaging methane gas has applications among gas utility companies for routine pipeline monitoring and storage facility inspection. Video rate gas imaging conveys the direction of dispersal and hence the location of a leak source, helping users to improve their efficiency of response to hazardous events. Conventional approaches to detecting methane gas leaks have mainly been based upon flame ionization detectors, but such technology measures concentration at only a single point, making locating the source of the leak a difficult and slow process. One approach to gas imaging is to use a focal plane array (FPA) to image the methane directly. As an alternative to using a FPA, it is possible to use a single photo-detector and an infrared laser, wavelength tuned to an absorption line of the gas, which is raster scanned over a scene and the resulting backscattered light collected and measured.

Digital image sensors in hemispherical geometries offer unique imaging advantages over their planar counterparts, such as wide field of view and low aberrations. Deforming miniature semiconductor-based sensors with high-spatial resolution into such format is challenging. Here we report a simple origami approach for fabricating single-crystalline silicon-based focal plane arrays and artificial compound eyes that have hemisphere-like structures. Convex isogonal polyhedral concepts allow certain combinations of polygons to fold into spherical formats. Using each polygon block as a sensor pixel, the silicon-based devices are shaped into maps of truncated icosahedron and fabricated on flexible sheets and further folded either into a concave or convex hemisphere. These two electronic eye prototypes represent simple and low-cost methods as well as flexible optimization parameters in terms of pixel density and design. Results demonstrated in this work combined with miniature size and simplicity of the design establish practical technology for integration with conventional electronic devices. Hemispherical format has been adopted in camera systems to better mimic human eyes, yet the current designs rely on complicated fabrications. Here, Zhang et al. show an origami-inspired approach that enables planar silicon-based photodetector arrays to reshape into concave or convex geometries.

Photodetection over a broad spectral range is necessary for multispectral sensing and imaging. Despite the fact that broadband single-element detectors with high performance have been demonstrated with various low-dimensional materials, broadband focal plane array imagers have been rarely reported. Here we propose a stacked lead sulfide/mercury telluride colloidal quantum dot photodetector configuration with optimized graded energy gaps. This architecture allows for ultrabroadband spectral response from 0.4 to 5.0 µm, with responsivity values of 0.23, 0.31, 0.83 and 0.71 A W −1 at 0.4, 0.7, 2.2 and 4.2 µm, respectively. We also fabricate a focal plane array imager with a resolution of 640 × 512, a low photoresponse non-uniformity down to 6% and a noise equivalent temperature difference as low as 34 mK. We demonstrate broadband imaging by simultaneously capturing both short-wave infrared and mid-wave infrared information, as well as multispectral imaging in the red, green, blue, short-wave infrared and mid-wave infrared channels, using a set of optical filters. Graded-energy-gap lead sulfide/mercury telluride stacked quantum dots enable photodetection and imaging in a focal plane array configuration from the visible (0.4 µm) to the mid-wave infrared (about 5 µm) region.

Modern imaging systems can be enhanced in efficiency, compactness, and application through the introduction of multilayer nanopatterned structures for manipulation of light based on its fundamental properties. High transmission multispectral imaging is elusive due to the commonplace use of filter arrays which discard most of the incident light. Further, given the challenges of miniaturizing optical systems, most cameras do not leverage the wealth of information in polarization and spatial degrees of freedom. Optical metamaterials can respond to these electromagnetic properties but have been explored primarily in single-layer geometries, limiting their performance and multifunctional capacity. Here we use advanced two-photon lithography to realize multilayer scattering structures that achieve highly nontrivial optical transformations intended to process light just before it reaches a focal plane array. Computationally optimized multispectral and polarimetric sorting devices are fabricated with submicron feature sizes and experimentally validated in the mid-infrared. A final structure shown in simulation redirects light based on its angular momentum. These devices demonstrate that with precise 3-dimensional nanopatterning, one can directly modify the scattering properties of a sensor array to create advanced imaging systems. The authors show computationally optimized, multilayer scattering structures in the mid-infrared for high efficiency imaging. Multispectral and polarization sorting devices are fabricated via two-photon lithography and characterized optically.

Abstract The traditional manual analysis of microplastics has been criticized for its labor-intensive, inaccurate identification of small microplastics, and the lack of uniformity. There are already three automated analysis strategies for microplastics based on vibrational spectroscopy: laser direct infrared (LDIR)–based particle analysis, Raman-based particle analysis, and focal plane array-Fourier transform infrared (FPA-FTIR) imaging. We compared their performances in terms of quantification, detection limit, size measurement, and material identification accuracy and speed by analyzing the same standard and environmental samples. LDIR-based particle analysis provides the fastest analysis speed, but potentially questionable material identification and quantification results. The number of particles smaller than 60 μm recognized by LDIR-based particle analysis is much less than that recognized by Raman-based particle analysis. Misidentification could occur due to the narrow tuning range from 1800 to 975 cm−1 and dispersive artifact distortion of infrared spectra collected in reflection mode. Raman-based particle analysis has a submicrometer detection limit but should be cautiously used in the automated analysis of microplastics in environmental samples because of the strong fluorescence interference. FPA-FTIR imaging provides relatively reliable quantification and material identification for microplastics in environmental samples greater than 20 μm but might provide an imprecise description of the particle shapes. Optical photothermal infrared (O-PTIR) spectroscopy can detect submicron-sized environmental microplastics (0.5–5 μm) intermingled with a substantial amount of biological matrix; the resulting spectra are searchable in infrared databases without the influence of fluorescence interference, but the process would need to be fully automated.

The noise characteristics of readout circuit for ultraviolet focal plane array are analysed in this paper. And the restraining method of noise with correlated double sampling circuit is discussed. In order to verify the principle, a 64×1 line readout circuit is designed. The results show that the total noise is effectively restrained by applying the correlated double sampling circuit.

Imaging systems operating in the terahertz part of the electromagnetic spectrum are attractive due to their ability to penetrate many opaque materials and provide unique spectral signatures of various chemicals. However, the use of terahertz imagers in real-world applications has been limited by the slow speed, large size, high cost and complexity of present systems, largely due to the lack of suitable terahertz focal-plane array detectors. Here we report a terahertz focal-plane array that can directly provide the spatial amplitude and phase distributions, along with the ultrafast temporal and spectral information of an imaged object. It consists of a two-dimensional array of ~0.3 million plasmonic photoconductive nanoantennas optimized to rapidly detect broadband terahertz radiation with a high signal-to-noise ratio. We utilized the multispectral nature of the amplitude and phase data captured by these plasmonic nanoantennas to image different objects, including super-resolved etched patterns in a silicon substrate and defects in battery electrodes. By eliminating the need for raster scanning and spatial terahertz modulation, our terahertz focal-plane array offers more than a 1,000-fold increase in the imaging speed compared with the state of the art and potentially suits a broad range of applications in industrial inspection, security screening and medical diagnosis, among others. A terahertz focal-plane array based on a two-dimensional array of plasmonic photoconductive nanoantennas offers high-quality imaging in the terahertz region.

There is a long history of using angle sensors to measure wavefront. The best example is the Shack-Hartmann sensor. Compared to other methods of wavefront sensing, angle-based approach is more broadly used in industrial applications and scientific research. Its wide adoption is attributed to its fully integrated setup, robustness, and fast speed. However, there is a long-standing issue in its low spatial resolution, which is limited by the size of the angle sensor. Here we report a angle-based wavefront sensor to overcome this challenge. It uses ultra-compact angle sensor built from flat optics. It is directly integrated on focal plane array. This wavefront sensor inherits all the benefits of the angle-based method. Moreover, it improves the spatial sampling density by over two orders of magnitude. The drastically improved resolution allows angle-based sensors to be used for quantitative phase imaging, enabling capabilities such as video-frame recording of high-resolution surface topography. Generally, wavefronts are measured using angle-based sensors like the Shack-Hartmann sensor. Here, the authors present an angle-sensitive device that uses flat optics integrated on a focal plane array for compact wavefront sensing with improved resolution.