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23,911
result(s) for
"Intermetallic compounds"
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Intermetallic compounds in heterogeneous catalysis-a quickly developing field
by
Grin, Yuri
,
Armbrüster, Marc
,
Schlögl, Robert
in
acetylene semi-hydrogenation
,
Catalysis
,
Catalysts
2014
The application of intermetallic compounds for understanding in heterogeneous catalysis developed in an excellent way during the last decade. This review provides an overview of concepts and developments revealing the potential of intermetallic compounds in fundamental as well as applied catalysis research. Intermetallic compounds may be considered as platform materials to address current and future catalytic challenges, e.g. in respect to the energy transition.
Journal Article
Friction stir welding of dissimilar aluminum alloys and steels: a review
2018
The present paper is focused on friction stir welding (FSW) of dissimilar aluminum alloys and steels, an area that is getting great concern recently. The promise of FSW joints lies in low welding heat input and its ability to minimize the extent of the formation of intermetallic compound (IMC) in dissimilar metals. The present paper assessed the status of FSW process of dissimilar aluminum alloys and steels, and to identify the opportunities and challenges for the future. The essential reason for the formation of the dissimilar Al/steel FSW joints with high quality is explained by super diffusion behavior. This paper will provide basis to designers and engineers to consider FSW for a wider range of dissimilar aluminum alloys and steels.
Journal Article
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
by
Salleh, Mohd Arif Anuar Mohd
,
Amli, Siti Farahnabilah Muhd
,
Ramli, Mohd Izrul Izwan
in
Aging (metallurgy)
,
Alloys
,
Brittleness
2022
Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.
Journal Article
Pt-Based Intermetallic Compound Catalysts for the Oxygen Reduction Reaction: Structural Control at the Atomic Scale to Achieve a Win–Win Situation Between Catalytic Activity and Stability
2023
The development of ordered Pt-based intermetallic compounds is an effective way to optimize the electronic characteristics of Pt and its disordered alloys, inhibit the loss of transition metal elements, and prepare fuel cell catalysts with high activity and long-term durability for the oxygen reduction reaction (ORR). This paper reviews the structure–activity characteristics, research advances, problems, and improvements in Pt-based intermetallic compound fuel cell catalysts for the ORR. First, the structural characteristics and performance advantages of Pt-based intermetallic compounds are analyzed and explained. Second, starting with 3d transition metals such as Fe, Co, and Ni, whose research achievements are common, the preparation process and properties of Pt-based intermetallic compound catalysts for the ORR are introduced in detail according to element types. Third, in view of preparation problems, improvements in the preparation processes of Pt-based intermetallic compounds are also summarized in regard to four aspects: coating to control the crystal size, doping to promote ordering transformation, constructing a “Pt skin” to improve performance, and anchoring and confinement to enhance the interaction between the crystal and support. Finally, by analyzing the research status of Pt-based intermetallic compound catalysts for the ORR, prospective research directions are suggested.
Graphical abstract
Journal Article
Effect of Intermetallic Compounds on the Thermal and Mechanical Properties of Al–Cu Composite Materials Fabricated by Spark Plasma Sintering
by
Myunghoon Cho
,
Kyungju Kim
,
Kwangjae Park
in
aluminium composite; copper composite; spark plasma sintering; thermal properties; powder metallurgy; intermetallic compound
,
Aluminum
,
Ball milling
2019
Aluminium–copper composite materials were successfully fabricated using spark plasma sintering with Al and Cu powders as the raw materials. Al–Cu composite powders were fabricated through a ball milling process, and the effect of the Cu content was investigated. Composite materials composed of Al–20Cu, Al–50Cu, and Al–80Cu (vol.%) were sintered by a spark plasma sintering process, which was carried out at 520 °C and 50 MPa for 5 min. The phase analysis of the composite materials by X-ray diffraction (XRD) and energy-dispersive spectroscopy (EDS) indicated that intermetallic compounds (IC) such as CuAl2 and Cu9Al4 were formed through reactions between Cu and Al during the spark plasma sintering process. The mechanical properties of the composites were analysed using a Vickers hardness tester. The Al–50Cu composite had a hardness of approximately 151 HV, which is higher than that of the other composites. The thermal conductivity of the composite materials was measured by laser flash analysis, and the highest value was obtained for the Al–80Cu composite material. This suggests that the Cu content affects physical properties of the Al–Cu composite material as well as the amount of intermetallic compounds formed in the composite material.
Journal Article
A Review of Dissimilar Welding Techniques for Magnesium Alloys to Aluminum Alloys
by
Liu, Fei
,
Ren, Daxin
,
Liu, Liming
in
Aluminum alloys
,
Aluminum base alloys
,
Dissimilar material joining
2014
Welding of dissimilar magnesium alloys and aluminum alloys is an important issue because of their increasing applications in industries. In this document, the research and progress of a variety of welding techniques for joining dissimilar Mg alloys and Al alloys are reviewed from different perspectives. Welding of dissimilar Mg and Al is challenging due to the formation of brittle intermetallic compound (IMC) such as Mg17Al12 and Mg2Al3. In order to increase the joint strength, three main research approaches were used to eliminate or reduce the Mg-Al intermetallic reaction layer. First, solid state welding techniques which have a low welding temperature were used to reduce the IMCs. Second, IMC variety and distribution were controlled to avoid the degradation of the joining strength in fusion welding. Third, techniques which have relatively controllable reaction time and energy were used to eliminate the IMCs. Some important processing parameters and their effects on weld quality are discussed, and the microstructure and metallurgical reaction are described. Mechanical properties of welds such as hardness, tensile, shear and fatigue strength are discussed. The aim of the report is to review the recent progress in the welding of dissimilar Mg and Al to provide a basis for follow-up research.
Journal Article
Giant In-Plane Shrinkage Induced by Structural Phase Transformation in TbCoSisub.2
2025
Metal-based materials, pivotal for industrialization and technological progress, confront the long-standing issue of high thermal expansion, which limits their application in advanced scenarios. With a century-long research history, negative thermal expansion materials, particularly those in intermetallic compounds, offer promising solutions for regulating thermal expansion. Here, we investigate polycrystalline TbCoSi[sub.2] ingots, revealing a notable 3% in-plane shrinkage from 223 K to 298 K induced by structural phase transitions. Temperature-dependent XRD and Rietveld refinement identify a low-temperature Pbcm space group structure, and the drastic a-axis shrinkage during the phase transition drives the in-plane contraction. Macroscopic magnetic measurements and first-principles calculations reveal an antiferromagnetic structure below 13.7 K, with magnetic and structural phase transitions being independent. These findings present a metal-based weakly magnetic material for precise thermal expansion control, particularly in the uniaxial direction.
Journal Article
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
2017
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu6Sn5 intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu6Sn5 IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu6Sn5 IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu6Sn5 in solder matrix and the transition from Cu6Sn5 to Cu3Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder.
Journal Article
Laser welding dissimilar materials of aluminum to steel: an overview
2016
Joining aluminum to steel can lighten the weight of components in the automobile and other industries, which can reduce fuel consumption and harmful gas emissions to protect the environment. However, the differences of thermal, physical, and chemical properties between aluminum and steel bring a series of problems in laser welding. The main problems are how to control the thickness of the intermetallic compound layer and reduce or avoid the generation of pores, cracks, and thermal stresses which severely limit the mechanical properties of welded joints. Laser fusion-brazing technology utilizes the precise control of heat input with or without filler to partially melt the low melting temperature aluminum base material and promote wetting on the high melting temperature steel base material in order to achieve sound metallurgical by combining the advantages of fusion welding and brazing. Different forms of laser beam welding including single beam laser welding, dual-beam laser welding, and laser arc hybrid fusion-brazing welding are reviewed.
Journal Article
Understanding Fe-Containing Intermetallic Compounds in Al Alloys: An Overview of Recent Advances from the LiME Research Hub
2022
Control of Fe in Al alloys is a severe challenge for the full metal circulation to produce the recycled alloys with mechanical and physical performance as high as the primary alloys. The high restriction of Fe content is mainly due to the deterioration caused by the large-scale Fe-containing intermetallic compounds (FIMCs) in Al alloys. In this paper, recent knowledge gained regarding nucleation, formation, and technical developments on microstructural control and refinement of FIMCs are overviewed. Specific characteristics of the multiple types of FIMCs in Al alloys are presented in two- and three- dimensional (2D and 3D) form. Phase relationships between the FIMCs in different structures, such as primary phase, binary eutectic, and ternary eutectic, formed at different solidification stages are studied. Phase transformations between the FIMCs with or without intermediate phases during the solidification process are examined in different Al alloys, with the mechanisms being clarified. Various approaches to microstructural control of FIMCs are proposed and validated. Significant refinement of FIMCs has been achieved through inoculation of TiB2 particles that had been previously modified with deliberately interfacial segregation of desirable alloying elements, leading to the development of the novel “compositional templating” concept.
Journal Article