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The performance of lithium-ion batteries is closely related to temperature, and much attention has been paid to their thermal safety. With the increasing application of the lithium-ion battery, higher requirements are put forward for battery thermal management systems. Compared with other cooling methods, liquid cooling is an efficient cooling method, which can control the maximum temperature and maximum temperature difference of the battery within an acceptable range. This article reviews the latest research in liquid cooling battery thermal management systems from the perspective of indirect and direct liquid cooling. Firstly, different coolants are compared. The indirect liquid cooling part analyzes the advantages and disadvantages of different liquid channels and system structures. Direct cooling summarizes the different systems’ differences in cooling effectiveness and energy consumption. Then, the combination of liquid cooling, air cooling, phase change materials, and heat pipes is examined. Later, the connection between the cooling and heating functions in the liquid thermal management system is considered. In addition, from a safety perspective, it is found that liquid cooling can effectively manage thermal runaway. Finally, some problems are put forward, and a summary and outlook are given.

Thermoelectric coolers are preferred in many areas because of their simple mechanism and no need for a refrigerant. In this study, an air-to-water mini thermoelectric cooler system was designed and produced. Experiments were performed by placing different numbers of thermoelectric modules on the liquid-cooling heat sink and applying different voltages. The cooling capacity and COP values of the system under different operating conditions were analyzed and discussed. In addition, the effect of fluid flow rate on system performance and temperature difference between inlet and outlet sections has been presented. The heat transfer and flow behavior of the fluid in the liquid-cooling heat sink were determined using CFD simulation methods. Moreover, the heat loss from the system was tried to be reduced by using extra foam insulation and the results were compared with single foam and the effect of the insulation on the temperature drop inside cooler was discussed. At 0.011 kg s −1 mass flow rate and 12 V voltage conditions, when the number of TE modules is increased from 1 to 3 in the TE cooler, a maximum increase of 35% in cooling load is obtained. Also, if the cases with 3 TE modules and 0.011 kg s −1 flow rate are compared in terms of cooling load, 12 V has 80% higher cooling load than 4 V. According to the numerical results, flow structures that negatively affect the heat transfer interactions and reduce the cooling performance of the TE cooler have been determined in the liquid-cooled heat exchanger. Additionally, a significant decrease in the temperature of the cooling chamber has also been achieved with additional insulation.

This study proposes a battery thermal management system based on L-shaped heat pipes coupled with liquid cooling. Experimental and computational fluid dynamics (CFD) numerical simulation studies have been conducted on the performance of the thermal management system. The thermal performance of three heat dissipation methods including forced air cooling, bottom liquid cooling and heat pipe coupled liquid cooling were compared. The results demonstrate that the coupling system can control the maximum temperature and temperature difference of the module at 30.12°C and 2.02°C at a 3C discharge rate. Compared with forced air cooling and bottom liquid cooling, the maximum temperature was decreased by 30.16% and 17.01% and the temperature difference was decreased by 72.14% and 77.20%, respectively. Studied the impact of factors such as coolant flow rate, the number of liquid-cooled plate channels, and the coolant inlet temperature under different ambient temperatures on the thermal management performance of the coupled system. By monitoring the maximum temperature of the module and the ambient temperature, a method for controlling the flow rate and the inlet temperature of the cooling water has been developed to implement an intermittent liquid cooling strategy for the battery module. Intermittent liquid cooling at various ambient temperatures can obtain similar thermal management performance to continuous liquid cooling, while significantly reducing liquid cooling energy consumption. Compared to continuous liquid cooling, intermittent liquid cooling can reduce energy consumption by a maximum of 97.05% and a minimum of 30.00%.

Electric vehicles (EVs) offer a potential solution to face the global energy crisis and climate change issues in the transportation sector. Currently, lithium-ion (Li-ion) batteries have gained popularity as a source of energy in EVs, owing to several benefits including higher power density. To compete with internal combustion (IC) engine vehicles, the capacity of Li-ion batteries is continuously increasing to improve the efficiency and reliability of EVs. The performance characteristics and safe operations of Li-ion batteries depend on their operating temperature which demands the effective thermal management of Li-ion batteries. The commercially employed cooling strategies have several obstructions to enable the desired thermal management of high-power density batteries with allowable maximum temperature and symmetrical temperature distribution. The efforts are striving in the direction of searching for advanced cooling strategies which could eliminate the limitations of current cooling strategies and be employed in next-generation battery thermal management systems. The present review summarizes numerous research studies that explore advanced cooling strategies for battery thermal management in EVs. Research studies on phase change material cooling and direct liquid cooling for battery thermal management are comprehensively reviewed over the time period of 2018–2023. This review discusses the various experimental and numerical works executed to date on battery thermal management based on the aforementioned cooling strategies. Considering the practical feasibility and drawbacks of phase change material cooling, the focus of the present review is tilted toward the explanation of current research works on direct liquid cooling as an emerging battery thermal management technique. Direct liquid cooling has the potential to achieve the desired battery performance under normal as well as extreme operating conditions. However, extensive research still needs to be executed to commercialize direct liquid cooling as an advanced battery thermal management technique in EVs. The present review would be referred to as one that gives concrete direction in the search for a suitable advanced cooling strategy for battery thermal management in the next generation of EVs.

To ensure the battery works in a suitable temperature range, a new design for distributed liquid cooling plate is proposed, and a battery thermal management system (BTMS) for cylindrical power battery pack based on the proposed cooling plate is also investigated. To verify the accuracy of the battery model and battery pack numerical calculation model used for simulation, an experiment is conducted for the liquid cooling BTMS. The influence of key working parameters, including the cooling water inlet flow, ambient temperature and working conditions, are investigated. The results show that at the discharge rate of 3 C, the best cooling performance can be achieved when the total inlet mass flow rate is 3.2 g/s and the flow distribution is 3:1:1:3. The obtained maximum temperature is 29.6°C and the maximum temperature difference is 2.1°C. When the ambient temperature is in the range of 20°C to 50°C, the proposed BTMS can keep the temperature of battery pack in the proper range. Finally, different inlet flow rates are recommended according to different battery working states.

The direct liquid cooling (DLC) of the data center is becoming popular due to its higher heat removal from the computer chips. The direct liquid cooling method is more effective than the conventional air-cooling system and reduces the higher infrastructure and maintenance costs. The DLC reduces the chip failure rate drastically and increases the life of the data centers. Different liquids can be used as a coolant and some manufacturers are coming up with different coolants where the liquid has high thermal efficiency and is electrically non-conductive. In this article, a heat-transfer cold plate made of aluminum is designed and a different combination of heat-transfer liquids (Distilled water, Ethylene Glycol, and Polyethylene Glycol) is tested to find a comparatively better combination of heat-transfer liquid. It was observed that the combination of Ethylene Glycol and distilled water performs better than other combinations. It was also found that the coolant flow rate plays an important role in the cooling of the chips as well.

This study examines the efficiency of a microprocessor’s cooling system and maintaining the optimal temperature of electronic components. To do this, experiments are carried out on the existing cooling system of the microprocessor with control of all main parameters, primarily such as the temperature and coolant flow, as well as the performance and temperature of the processor. Based on the data obtained, a mathematical model is built that describes the change in the microprocessor’s power and allows us to calculate the temperatures and speeds of coolants, as well as obtain the most effective modes for the operation of the cooling system. The obtained experimental data and mathematical model make it possible to predict the required power of the cooling system and the operating parameters of microelectronic components, which is especially important when new generations of microprocessors with the highest performance appear. The data obtained also makes it possible to calculate parameters for existing processors in order to maximize the efficiency and reliability of their operation, which is also relevant for other electronic devices, in particular microcontrollers.

The growth of computing power in data centers (DCs) leads to an increase in energy consumption and noise pollution of air cooling systems. Chip-level cooling with high-efficiency coolant is one of the promising methods to address the cooling challenge for high-power devices in DCs. Hybrid nanofluid (HNF) has the advantages of high thermal conductivity and good rheological properties. This study summarizes the numerical investigations of HNFs in mini/micro heat sinks, including the numerical methods, hydrothermal characteristics, and enhanced heat transfer technologies. The innovations of this paper include: (1) the characteristics, applicable conditions, and scenarios of each theoretical method and numerical method are clarified; (2) the molecular dynamics (MD) simulation can reveal the synergy effect, micro motion, and agglomeration morphology of different nanoparticles. Machine learning (ML) presents a feasible method for parameter prediction, which provides the opportunity for the intelligent regulation of the thermal performance of HNFs; (3) the HNFs flow boiling and the synergy of passive and active technologies may further improve the overall efficiency of liquid cooling systems in DCs. This review provides valuable insights and references for exploring the multi-phase flow and heat transport mechanisms of HNFs, and promoting the practical application of HNFs in chip-level liquid cooling in DCs.

Currently, there are many studies on power conversion system (PCS) in the industry, but there are few studies on high-altitude and plateau application scenarios. This paper takes the extreme environment of plateau and high altitude as the research background, uses PLECS software to establish a thermoelectric simulation of a three-phase LCL grid-connected inverter, and calculates the total heat loss of the power devices IGBT and diodes in the PCS and the power loss of the grid-connected filter. Combining the overall heat generation of IGBTs, diodes and filters and considering the characteristics of high-altitude extreme environments, two liquid-cooled radiators with different structures were designed to measure the thermal resistance and pressure loss of the two radiators (reflecting Flow resistance) and heat dissipation efficiency are quantitatively calculated. The results show that the heat dissipation performance of the liquid cooling radiator designed by the latter is better than that of the former, verifying that by improving the channel structure and size of the liquid cooling radiator, the thermal resistance and flow resistance of the radiator itself can be reduced, and its heat dissipation performance can be improved.

This study aims to investigate and optimize the thermal dissipation of a constant heat flux source by conducting a numerical analysis of four serpentine mini-channel heat sink configurations, each characterized by different inlet and outlet arrangements for the cooling fluid. The cooling system under study consists of an upper part made of ABS copolymer resin, incorporating the fluid inlets and outlets (water), and a lower part made of aluminum, which contains the serpentine mini-channel heat sink. The analyzed configurations included four cases: First: a single inlet and a single outlet, Second: two inlets and one outlet, Third: one inlet and two outlets, and Fourth: a variation of the third model with reversed inlet and outlet positions. Numerical simulations, performed using the finite volume method, cover a Reynolds number range from 200 to 600. The analysis focuses on flow behavior, temperature distributions, pressure drop, thermal resistance, the average Nusselt number and the performance evaluation factor (PEF). The results indicate that the configurations with two inlets and one outlet (Case 2) and the reversed inlet/outlet configuration (Case 4) significantly enhance cooling compared to the other configurations. However, the two-inlet, one-outlet case also results in a higher pressure drop. At a Reynolds number of 600, Case 2 achieves the best thermal performance with an average Nusselt number of 20.79 and a minimum thermal resistance of 0.228K/W, while Case 3 exhibits the lowest efficiency. These findings help identify optimal configurations for cooling high heat flux electronic components.