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Generating packages of picosecond-spaced ultrashort pulses yields various advantages in their application in nonlinear spectroscopy, micromachining, and plasma generation. We outline methods of burst amplification, with a focus on recent advancements in the generation and application of amplified pulse bursts.

New considerably improved laser systems (LS) featuring beam propagation factor equal to unit, two different laser pulse durations and an average output power from several tens of Watts up to 50 W are reported. Micron-sized machining is also demonstrated.

Microfluidic platform technology has presented a new strategy to detect and analyze analytes and biological entities thanks to its reduced dimensions, which results in lower reagent consumption, fast reaction, multiplex, simplified procedure, and high portability. In addition, various forces, such as hydrodynamic force, electrokinetic force, and acoustic force, become available to manipulate particles to be focused and aligned, sorted, trapped, patterned, etc. To fabricate microfluidic chips, silicon was the first to be used as a substrate material because its processing is highly correlated to semiconductor fabrication techniques. Nevertheless, other materials, such as glass, polymers, ceramics, and metals, were also adopted during the emergence of microfluidics. Among numerous applications of microfluidics, where repeated short-time monitoring and one-time usage at an affordable price is required, polymer microfluidics has stood out to fulfill demand by making good use of its variety in material properties and processing techniques. In this paper, the primary fabrication techniques for polymer microfluidics were reviewed and classified into two categories, e.g., mold-based and non-mold-based approaches. For the mold-based approaches, micro-embossing, micro-injection molding, and casting were discussed. As for the non-mold-based approaches, CNC micromachining, laser micromachining, and 3D printing were discussed. This review provides researchers and the general audience with an overview of the fabrication techniques of polymer microfluidic devices, which could serve as a reference when one embarks on studies in this field and deals with polymer microfluidics.

We present a coaxial dual-comb LiDAR integrated into a laser micromachining station, enabling in-situ 3D profiling of machined parts with sub-micrometer axial precision, offering a cost-effective solution with high precision capability.

Optical waveguides are far more than mere connecting elements in integrated optical systems and circuits. Benefiting from their high optical confinement and miniaturized footprints, waveguide structures established based on crystalline materials, particularly, are opening exciting possibilities and opportunities in photonic chips by facilitating their on-chip integration with different functionalities and highly compact photonic circuits. Femtosecond-laser-direct writing (FsLDW), as a true three-dimensional (3D) micromachining and microfabrication technology, allows rapid prototyping of on-demand waveguide geometries inside transparent materials via localized material modification. The success of FsLDW lies not only in its unsurpassed aptitude for realizing 3D devices but also in its remarkable material-independence that enables cross-platform solutions. This review emphasizes FsLDW fabrication of waveguide structures with 3D layouts in dielectric crystals. Their functionalities as passive and active photonic devices are also demonstrated and discussed.

Integrated quantum photonics, i.e. the generation, manipulation, and detection of quantum states of light in integrated photonic chips, is revolutionizing the field of quantum information in all applications, from communications to computing. Although many different platforms are being currently developed, from silicon photonics to lithium niobate photonic circuits, none of them has shown the versatility of femtosecond laser micromachining (FLM) in producing all the components of a complete quantum system, encompassing quantum sources, reconfigurable state manipulation, quantum memories, and detection. It is in fact evident that FLM has been a key enabling tool in the first-time demonstration of many quantum devices and functionalities. Although FLM cannot achieve the same level of miniaturization of other platforms, it still has many unique advantages for integrated quantum photonics. In particular, in the last five years, FLM has greatly expanded its range of quantum applications with several scientific breakthroughs achieved. For these reasons, we believe that a review article on this topic is very timely and could further promote the development of this field by convincing end-users of the great potentials of this technological platform and by stimulating more research groups in FLM to direct their efforts to the exciting field of quantum technologies.

In order to produce micro-dimple arrays in a metal surface with high precision, efficiency, and stability, a new processing method, air-shielding electrochemical micro-machining (AS-EMM), was proposed in this research. This method is based on the electrolyte jet micromachining and air-film protection principle. A numerical model with Gambit was created, and Fluent analyzed the flow field characteristics of the electrolyte between the multi-electrodes nozzle and the workpiece. Micro-dimple arrays were created on a 316L stainless steel surface with the consideration of the effects of machining parameters, including applied voltage and feeding speed. Compared with electrochemical micromachining (EMM), the average diameter of dimples is reduced by 31%, the ratio of dimple depth to diameter (DDR) is increased by 19%, and the surface roughness of micro-grooves is increased by 31.9%. In addition, the standard deviations of dimple diameter and depth suggest that the localization and stability by AS-EMM can be improved when using appropriate machining parameters.

The demand for industrial development toward advanced and precision manufacturing has sparked interest in ultrafast laser-based micromachining methods, particularly emerging advanced machining methods, such as laser-induced plasma micromachining (LIPMM). The main challenge in laser micromachining is finding the optimal process in a large process space to achieve a comprehensive improvement in processing efficiency and quality as approaches that rely on trial-and-error are impractical. In this work, we combined data-driven machine learning and physical model into a cycle design strategy, in order to efficient capture the comprehensive optimization process of LIPMM with high material removal rate and high microgroove depth. Based on the small sample dataset and additional physical variables provided by the physical model, the optimal process in the whole process space can be obtained using only four design cycles and dozens of data groups, and the material removal rate and microgroove depth of which are improved comprehensively compared with the original data. The design strategy integrated with physical model presented here could be applied in a wide range of fields, and thus shows the promise of accelerating the development of laser micromachining processes.

Glass-based microfluidic devices are essential for applications such as diagnostics and drug discovery, which utilize their optical clarity and chemical stability. This review systematically analyzes pulsed laser micromachining as a transformative technique for fabricating glass-based microfluidic devices, addressing the limitations of conventional methods. By examining three pulse regimes—long (≥nanosecond), short (picosecond), and ultrashort (femtosecond)—this study evaluates how laser parameters (fluence, scanning speed, pulse duration, repetition rate, wavelength) and glass properties influence ablation efficiency and quality. A higher fluence improves the material ablation efficiency across all the regimes but poses risks of thermal damage or plasma shielding in ultrashort pulses. Optimizing the scanning speed balances the depth and the surface quality, with slower speeds enhancing the channel depth but requiring heat accumulation mitigation. Shorter pulses (femtosecond regime) achieve greater precision (feature resolution) and minimal heat-affected zones through nonlinear absorption, while long pulses enable rapid deep-channel fabrication but with increased thermal stress. Elevating the repetition rate improves the material ablation rates but reduces the surface quality. The influence of wavelength on efficiency and quality varies across the three pulse regimes. Material selection is critical to outcomes and potential applications: fused silica demonstrates a superior surface quality due to low thermal expansion, while soda–lime glass provides cost-effective prototyping. The review emphasizes the advantages of laser micromachining and the benefits of a wide range of applications. Future directions should focus on optimizing the process parameters to improve the efficiency and quality of the produced devices at a lower cost to expand their uses in biomedical, environmental, and quantum applications.

Laser beam micromachining (LBMM) and micro electro-discharge machining (μEDM) based sequential micromachining technique, LBMM-μEDM, has drawn significant research attention to utilize the advantages of both methods, i.e., LBMM and μEDM. In this process, a pilot hole is machined by the LBMM, and subsequently finishing operation of the hole is carried out by the μEDM. This paper presents an experimental investigation on the stainless steel (type SS304) to observe the effects of laser input parameters (namely, laser power, scanning speed, and pulse frequency) on the performance of the finishing technique, that is, the μEDM in this case. The scope of the work is limited to 1-D machining, i.e., drilling microholes. It was found that laser input parameters mainly scanning speed and power influenced the output performance of μEDM significantly. Our study suggests that if an increased scanning speed at a lower laser power is used for the pilot hole drilling by the LBMM process, it could result in significantly slower μEDM machining time. On the contrary, if the higher laser power is used with even the highest scanning speed for the pilot hole drilling, then μEDM processing time was faster than the previous case. Similarly, μEDM time was also quicker for LBMMed pilot holes machined at low laser power and slow scanning speed. Our study confirms that LBMM-μEDM-based sequential machining technique reduces the machining time, tool wear, and instability (in terms of short circuit count) by a margin of 2.5 x, 9 x, and 40 x, respectively, in contrast to the pure μEDM process without compromising the quality of the holes.