Explore the vast range of titles available.

We report on microfabrication and assembly process development on transparent, biocompatible polymers for patterning electrodes and growing electrically active cells for in vitro cell-based biosensor applications. Such biosensors are typically fabricated on silicon or glass wafers with traditional microelectronic processes that can be cost-prohibitive without imparting necessary biological traits on the devices, such as transparency and compatibility for the measurement of electrical activity of electrogenic cells and other biological functions. We have developed and optimized several methods that utilize traditional micromachining and non-traditional approaches such as printed circuit board (PCB) processing for fabrication of electrodes and growing cells on the transparent polymers polyethylene naphthalate (PEN) and polyethylene terephthalate (PET). PEN-based biosensors are fabricated utilizing lithography, metal lift-off, electroplating, wire bonding, inkjet printing, conformal polymer deposition and laser micromachining, while PET-based biosensors are fabricated utilizing post-processing technologies on modified PCBs. The PEN-based biosensors demonstrate 85–100% yield of microelectrodes, and 1-kHz impedance of 59.6 kOhms in a manner comparable to other traditional approaches, with excellent biofunctionality established with an ATP assay. Additional process characterization of the microelectrodes depicts expected metal integrity and trace widths and thicknesses. PET-based biosensors are optimized for a membrane bow of 6.9 to 15.75 µm and 92% electrode yield on a large area. Additional qualitative optical assay for biomaterial recognition with transmitted light microscopy and growth of rat cortical cells for 7 days in vitro (DIV) targeted at biological functionalities such as electrophysiology measurements are demonstrated in this paper.

Quality risk management, commonly known as QRM, is designed to systematically assess, control, communicate, and review potential risks at every stage of the pharmaceutical manufacturing process. The preservation of consistent product quality across the entirety of the product’s life cycle is of paramount importance. The aim of this article is to formulate a best practice guide that will assist pharmaceutical manufacturers in comprehending and implementing the International Council for Harmonisation of Technical Requirements for Pharmaceuticals for Human Use (ICH) Q9: quality risk management principles. A widely recognized methodology for defining and monitoring risk mitigation strategies within the pharmaceutical sector is the Failure Mode and Effects Analysis (FMEA). ICH Q9 does not, however, offer detailed instructions for applying FMEA to real-world pharmaceutical situations. We previously provided real-world case studies that identify and mitigate risks in the early stages of the manufacturing process of sterile products, such as (1) supply chain and procurement; (2) logistics and warehousing; (3) raw material dispensing; (4) glass bottle washing and handling; (5) product filling; and (6) final product receiving and handling. The final steps of the sterile manufacturing process are the subject of the case study we present in this paper. We identify and control the risks related to (I) product sterilization; (II) product inspection, labeling, and packaging; (III) the finished product’s transfer to storage; and (IV) storing finished products in a warehouse. In order to maximize decision-making and reduce the risk of regulatory noncompliance, this case study describes a proactive strategy for the identification, management, and communication of risks associated with crucial tasks. While each organization’s products and methods are distinct, with varying tolerances for risk, certain stages and associated risks are common. Consequently, the examples provided here offer relevant insights into any pharmaceutical production environment. Managing sustainability-related risks and ensuring the transparency of pharmaceutical company operations are key tasks of success today. These risks, if not managed, will cause serious problems and a negative reputation, as well as environmental and public impact.

In multihead weighers, packaging processes seek to find the best combination of passage hoppers whose product content provides a total package weight as close as possible to its (nominal) label weight. The weighing hoppers arranged in these machines dispense the product quantity that each package contains through computer algorithms designed and executed for this purpose. For its part, in the packaging process for double-layered multihead weighers, all hoppers are arranged in two levels. The first layer comprises a group of weighing hoppers, and the second comprises a set of booster hoppers placed uprightly or diagonally to each weighing hopper based on design of the machine. In both processes, the initial machine configuration is the same; however, the hopper selection algorithm works differently. This paper proposes a new packaging process optimization algorithm for double-layer upright and diagonal machines, wherein the hopper subset combined has previously been defined, and the packaging weight is expressed as actual values. As part of its validation, product filling strategies were implemented for weighing hoppers to assess the algorithm in different scenarios. Results from the process performance metrics prove that the new algorithm improves processes by reducing variability. In addition, results reveal that some machine configurations were also able to improve their operation.

Silicon carbide (SiC) half-bridge power modules are widely utilized in new energy power generation, electric vehicles, and industrial power supplies. To address the research gap in collaborative validation between electro-thermal coupling models and process reliability, this paper proposes a closed-loop methodology of “design-simulation-process-validation”. This approach integrates in-depth electro-thermal simulation (LTspice XVII/COMSOL Multiphysics 6.3) with micro/nano-packaging processes (sintering/bonding). Firstly, a multifunctional double-pulse test board was designed for the dynamic characterization of SiC devices. LTspice simulations revealed the switching characteristics under an 800 V operating condition. Subsequently, a thermal simulation model was constructed in COMSOL to quantify the module junction temperature gradient (25 °C → 80 °C). Key process parameters affecting reliability were then quantified, including conductive adhesive sintering (S820-F680, 39.3 W/m·K), high-temperature baking at 175 °C, and aluminum wire bonding (15 mil wire diameter and 500 mW ultrasonic power/500 g bonding force). Finally, a double-pulse dynamic test platform was established to capture switching transient characteristics. Experimental results demonstrated the following: (1) The packaged module successfully passed the 800 V high-voltage validation. Measured drain current (4.62 A) exhibited an error of <0.65% compared to the simulated value (4.65 A). (2) The simulated junction temperature (80 °C) was significantly below the safety threshold (175 °C). (3) Microscopic examination using a Leica IVesta 3 microscope (55× magnification) confirmed the absence of voids at the sintering and bonding interfaces. (4) Frequency-dependent dynamic characterization revealed a 6 nH parasitic inductance via Ansys Q3D 2025 R1 simulation, with experimental validation at 8.3 nH through double-pulse testing. Thermal evaluations up to 200 kHz indicated 109 °C peak temperature (below 175 °C datasheet limit) and low switching losses. This work provides a critical process benchmark for the micro/nano-manufacturing of high-density SiC modules.

Purpose - The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.Design methodology approach - This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.Findings - This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.Originality value - Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.

Modified control charts are used to monitor and control manufacturing processes which are considered to be six-sigma processes. The use of these charts is based on the idea that the cost of identifying and correcting special causes is much higher than the cost of off-target products. Therefore, the process mean is essentially acceptable as long as it is anywhere within the specification limits. These concepts are applied to the packaging process in multihead weighers. The weight of the packed product, seen as the quality characteristic to be monitored, must be as close to a specified target weight as possible and comply with applicable regulations. The packaging process was previously optimized and improved using a packaging strategy, which was evaluated through a proposed packing algorithm. In this way, a set of numerical experiments were conducted to examine the solutions generated, which were subsequently monitored.

Purpose - The purpose of this paper is to report case studies conducted in a company in Italy that produces packaging systems, in comparison with a Brazilian company within a similar industrial sector. The paper compares those two cases in terms of quality function deployment (QFD) usage and discusses the lessons learned from the cases. Design/methodology/approach - Case-based research was employed. Data were mostly gathered through semi-structured interviews with engineers and managers involved with product development. Direct observation and archival data were also used to extract more evidence towards triangulation. Then, the aggregation of results was done a posteriori. Findings - QFD implementation process was found to be similar in both companies but with some differences in terms of managerial aspects of product development, e.g. gathering the voice of customer and a more extensive use of other matrices besides the \"house of quality\". Research limitations/implications - The study was limited in two companies. Although one of the purposes was to analyse if there are contextual differences between those two cases, this study was unable of verifying the context of QFD application. In addition, the study findings are not generalisable to other similar plants. Practical implications - The research shows the importance of QFD implementation and similarities between the cases, in addition to contributing to application by identifying relevant aspects of its introduction. It enables practitioners to use the findings on factors that should be taken into consideration when applying QFD. Originality/value - Besides the comparison between two companies, the paper discusses the innovation on QFD projects in one of the companies. In addition, the empirical results found grounding in existing theory to some extent.

Purpose Consumer's demand for fresh, naturally preserved, food products has grown dramatically in recent years. Modified atmosphere packaging MAP has proved to be most innovative growth area in food packaging. Studies have been conducted to increase the shelf life of readytobake pizza by using MAP technique. The purpose of this paper is to study the influence of different modified atmospheres and refrigerated storage on the sensory characteristics of the readytobake unbaked pizza. Designmethodologyapproach The most uptodate and pertinent studies within the literature have been included and summated in this paper. Findings To determine the shelf life of MAP readytobake pizza, the samples were subjected to four types of atmospheres air, 100 per cent CO2, 100 per cent N2 and 50 per cent CO250 per cent N2 and stored for various time intervals at 71C. The shelf life of readytobake pizza significantly increased up to 15 days a 300 per cent increase for the samples packaged under 100 per cent CO2 atm 2, 50 per cent CO250 per cent N2 atm 4 and 100 per cent N2 atm 3, compared to conventional air pack five days. Originalityvalue This paper gives a concise, uptodate overview on how different gases affect the various sensory parameters of readytobakepizza.

Purpose - The purpose of this paper is to provide an understanding of how the materials feeding design at a workstation impacts the assembly process performance, in terms of manufacturing flexibility, process support, materials planning and work task efficiency.Design methodology approach - The empirical data are based on two embedded case studies performed in close corporation with two Swedish automotive companies; additional observations from more than 20 company visits in Japan, and small-scale case studies performed in Japanese companies. To fully assess the work measurement figures, video recordings, work instructions and layout drawings were used to plot the operators' walking patterns, and it was then possible to map the whole work cycle for an operator. Industrial engineers, managers, group leaders, team leaders and operators were interviewed. Based on the literature review and personal experience from the small-scale case studies carried out in Japan, the existing assembly systems' component racks were conceptually re-designed. This led to two hypothetical assembly systems, which could be used for understanding the impact of materials feeding design on assembly process performance. The design of the new component racks and the choice of packaging types were made together with practitioners.Findings - The paper shows that the design of component racks and choice of packaging types have a major impact on the assembly process performance. Component racks with a large depth and small width and tailored packages create important advantages over traditional Swedish component racks designed for EUR-pallets. Line stocking is not always the best choice for materials feeding, but this paper shows that line stocking, especially in Swedish assembly systems, can be improved. Sequencing can thus be reduced, resulting in fewer problems when there are sequence breaks in the production flow. Component racks with small packages and large depth increase the work task efficiency, volume, mix, new products and modification flexibility. For example, free space is an important issue for these types of flexibilities. Component racks that are portable and easy to rearrange, together with free space, greatly facilitate handling of new product introductions or modifications of products. The new and old component can be displayed and fed to the same workstation, and if there is a larger change a whole segment of a component rack can easily be replaced by a new one between work shifts.Research limitations implications - The scope of the study is limited to the conditions at workstations. Consequences for the materials flow upstream (i.e. internal materials handling, warehousing, transport, supplier processes, etc.) are not included, but must in further studies also be considered to avoid sub-optimisation.Originality value - The paper highlights the fact that a shift in focus is necessary when designing workstations with component racks in Swedish companies, meaning that operators become the customers rather than the transport company or materials handler.

This paper addresses the question of trade‐offs in supply chains by exploring the roles of packaging in distribution networks. Taking a starting point in the logistical role of packaging and the potential trade‐offs with its marketing and environmental roles, the paper illustrates some difficulties with integrated systems. The paper discusses the concept of packaging as an integrated system and presents a case study of a transport package, a roll‐rack, for distribution of fresh milk. The analysis shows that although it fulfils well all its three roles for milk, the roll‐rack's efficiency is decreasing as continuously larger volumes of products for which it was not designed, are distributed through the network. Because it is so integrated in the milk‐chain and adaptations have developed between the roll‐rack and other resources such as vehicles, terminals and display facilities in the stores, it is difficult to use for other products. As similar adaptations have developed within the other package/product chains, it is also difficult to replace other transport packages with the roll‐rack. The paper contributes to the understanding of use and development of logistics resources, trade‐offs between adaptation and adaptability, integration and standardisation.