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This comprehensive review begins by tracing the historical development and progress of cold plasma technology as an innovative approach to polymer engineering. The study emphasizes the versatility of cold plasma derived from a variety of sources including low-pressure glow discharges (e.g., radiofrequency capacitively coupled plasmas) and atmospheric pressure plasmas (e.g., dielectric barrier devices, piezoelectric plasmas). It critically examines key operational parameters such as reduced electric field, pressure, discharge type, gas type and flow rate, substrate temperature, gap, and how these variables affect the properties of the synthesized or modified polymers. This review also discusses the application of cold plasma in polymer surface modification, underscoring how changes in surface properties (e.g., wettability, adhesion, biocompatibility) can be achieved by controlling various surface processes (etching, roughening, crosslinking, functionalization, crystallinity). A detailed examination of Plasma-Enhanced Chemical Vapor Deposition (PECVD) reveals its efficacy in producing thin polymeric films from an array of precursors. Yasuda’s models, Rapid Step-Growth Polymerization (RSGP) and Competitive Ablation Polymerization (CAP), are explained as fundamental mechanisms underpinning plasma-assisted deposition and polymerization processes. Then, the wide array of applications of cold plasma technology is explored, from the biomedical field, where it is used in creating smart drug delivery systems and biodegradable polymer implants, to its role in enhancing the performance of membrane-based filtration systems crucial for water purification, gas separation, and energy production. It investigates the potential for improving the properties of bioplastics and the exciting prospects for developing self-healing materials using this technology.

Multilayer barrier flexible polymer films are gaining attention for their lightness and versatility, representing over 17% of global plastic packaging production, primarily in the food sector. However, their complex chemical composition and strong interlayer adhesion—due to the presence of tie layers pose significant recycling challenges. This review explores waste management technologies for these complex films, including physical recycling (mechanical recycling, delamination, and selective dissolution‐precipitation) and chemical recycling (pyrolysis, gasification, and depolymerization). Among them, mechanical recycling is the least energy‐intensive and most environmentally friendly but is hindered by polymer degradation. Delamination, the least impactful solvent‐based method, offers advantages, while selective dissolution‐precipitation achieves high polymer purity but has a substantial environmental footprint due to excessive solvent use. Chemical recycling, though highly energy‐intensive, produces derivatives with purity comparable to virgin materials. Therefore, the recent insights into each recycling process and their main scientific and technological challenges are summarized and discussed. Furthermore, life cycle assessment (LCA) studies on multilayer film waste management are reviewed. One proposed eco‐design strategy involves transitioning from multi‐material to mono‐material multilayer films, offering a promising path toward sustainable management. Multilayer barrier flexible polymer films, representing over 17% of global plastic packaging production, face recycling challenges due to complex compositions and strong interlayer adhesion. This image examines recycling methods, including mechanical recycling, delamination, selective dissolution‐precipitation, and chemical recycling. Mechanical recycling is eco‐friendly but limited by polymer degradation, while chemical methods offer high purity but are energy‐intensive.

In this paper, fiber sensor based on Vernier effect for simultaneous measurement of relative humidity (RH) and temperature is proposed. The sensor is fabricated by coating two kinds of ultraviolet (UV) glue with different refractive indexes (RI) and thicknesses on the end face of a fiber patch cord. The thicknesses of two films are controlled to generate the Vernier effect. The inner film is formed by a cured lower-RI UV glue. The exterior film is formed by a cured higher-RI UV glue, of which thickness is much thinner than the inner film. Through the analysis of the Fast Fourier Transform (FFT) of the reflective spectrum, the Vernier effect is formed by the inner lower-RI polymer cavity and the cavity composed of both polymer films. By calibrating the RH and temperature response of two peaks on the envelope of the reflection spectrum, simultaneous measurements of RH and temperature are realized by solving a set of quadratic equations. Experimental results show that the highest RH and temperature sensitivities of the sensor are 387.3 pm/%RH (in 20%RH to 90%RH) and −533.0 pm/°C (in 15 °C to 40 °C), respectively. The sensor has merits of low cost, simple fabrication, and high sensitivity, which makes it very attractive for applications that need to simultaneously monitor these two parameters.

Film capacitor technology has been under development for over half a century to meet various applications such as direct-current link capacitors for transportation, converters/inverters for power electronics, controls for deep well drilling of oil and gas, direct energy weapons for military use, and high-frequency coupling circuitry. The biaxially oriented polypropylene film capacitor remains the state-of-the-art technology; however, it is not able to meet increasing demand for high-temperature (>125°C) applications. A number of dielectric materials capable of operating at high temperatures (>140°C) have attracted investigation, and their modifications are being pursued to achieve higher volumetric efficiency as well. This paper highlights the status of polymer dielectric film development and its feasibility for capacitor applications. High-temperature polymers such as polyetherimide (PEI), polyimide, and polyetheretherketone were the focus of our studies. PEI film was found to be the preferred choice for high-temperature film capacitor development due to its thermal stability, dielectric properties, and scalability.

HighlightsThe successful fabrication of layered foam/film structure via the crystal melting temperature mismatch for two grades of PVDF resin in a batch foaming process.Developing the heterostructure interfaces between SiC nanowires and MXene (Ti3C2Tx) nanosheets.Achieving efficient electromagnetic interference shielding effectiveness with ultralow reflectivity.Lightweight, high-efficiency and low reflection electromagnetic interference (EMI) shielding polymer composites are greatly desired for addressing the challenge of ever-increasing electromagnetic pollution. Lightweight layered foam/film PVDF nanocomposites with efficient EMI shielding effectiveness and ultralow reflection power were fabricated by physical foaming. The unique layered foam/film structure was composed of PVDF/SiCnw/MXene (Ti3C2Tx) composite foam as absorption layer and highly conductive PVDF/MWCNT/GnPs composite film as a reflection layer. The foam layer with numerous heterogeneous interfaces developed between the SiC nanowires (SiCnw) and 2D MXene nanosheets imparted superior EM wave attenuation capability. Furthermore, the microcellular structure effectively tuned the impedance matching and prolonged the wave propagating path by internal scattering and multiple reflections. Meanwhile, the highly conductive PVDF/MWCNT/GnPs composite (~ 220 S m−1) exhibited superior reflectivity (R) of 0.95. The tailored structure in the layered foam/film PVDF nanocomposite exhibited an EMI SE of 32.6 dB and a low reflection bandwidth of 4 GHz (R < 0.1) over the Ku-band (12.4 − 18.0 GHz) at a thickness of 1.95 mm. A peak SER of 3.1 × 10–4 dB was obtained which corresponds to only 0.0022% reflection efficiency. In consequence, this study introduces a feasible approach to develop lightweight, high-efficiency EMI shielding materials with ultralow reflection for emerging applications.

There is significant variation in the reported magnitude and even the sign of Tg shifts in thin polymer films with nominally the same chemistry, film thickness, and supporting substrate. The implicit assumption is that methods used to estimate Tg in bulk materials are relevant for inferring dynamic changes in thin films. To test the validity of this assumption, we perform molecular simulations of a coarse-grained polymer melt supported on an attractive substrate. As observed in many experiments, we find that Tg based on thermodynamic criteria (temperature dependence of film height or enthalpy) decreases with decreasing film thickness, regardless of the polymer–substrate interaction strength ε. In contrast, we find that Tg based on a dynamic criterion (relaxation of the dynamic structure factor) also decreases with decreasing thickness when ε is relatively weak, but Tg increases when ε exceeds the polymer–polymer interaction strength. We show that these qualitatively different trends in Tg reflect differing sensitivities to the mobility gradient across the film. Apparently, the slowly relaxing polymer segments in the substrate region make the largest contribution to the shift of Tg in the dynamic measurement, but this part of the film contributes less to the thermodynamic estimate of Tg . Our results emphasize the limitations of using Tg to infer changes in the dynamics of polymer thin films. However, we show that the thermodynamic and dynamic estimates of Tg can be combined to predict local changes in Tg near the substrate, providing a simple method to infer information about the mobility gradient.

This study aimed to compare the performance of fabricated microbially induced precipitated calcium carbonate– (MB–CaCO3) based red seaweed (Kappaphycus alvarezii) bio-polymer film and commercial calcium carbonate– (C–CaCO3) based red seaweed bio-film with the conventional biodegradable mulch film. To the best of our knowledge, there has been limited research on the application of commercial CaCO3 (C–CaCO3) and microbially induced CaCO3 (MB–CaCO3) as fillers for the preparation of films from seaweed bio-polymer and comparison with biodegradable commercial plasticulture packaging. The results revealed that the mechanical, contact angle, and biodegradability properties of the polymer composite films incorporated with C–CaCO3 and MB–CaCO3 fillers were comparable or even superior than the conventional biodegradable mulch film. The seaweed polymer film incorporated with MB–CaCO3 showed the highest contact angle of 100.94°, whereas conventional biodegradable mulch film showed a contact angle of 90.25°. The enhanced contact angle of MB–CaCO3 resulted in high barrier properties, which is highly desired in the current scenario for plasticulture packaging application. The water vapor permeability of MB–CaCO3 based seaweed films was low (2.05 ± 1.06 g·m/m2·s·Pa) when compared to conventional mulch film (2.68 ± 0.35 g·m/m2·s·Pa), which makes the fabricated film an ideal candidate for plasticulture application. The highest tensile strength (TS) was achieved by seaweed-based film filled with commercial CaCO3 (84.92% higher than conventional mulch film). SEM images of the fractured surfaces of the fabricated films revealed the strong interaction between seaweed and fillers. Furthermore, composite films incorporated with MB–CaCO3 promote brighter film, better water barrier, hydrophobicity, and biodegradability compared to C–CaCO3 based seaweed polymer film and conventional mulch film. From this demonstrated work, it can be concluded that the fabricated MB–CaCO3 based seaweed biopolymer film will be a promising candidate for plasticulture and agricultural application.

The mechanical and barrier properties of plant-based enteric polymer films were enhanced by synergistic interactions between binary gum mixtures and adding plasticizers. The results indicated that the best ratio of gellan gum (GG) and xanthan gum (XG) was 7:3 by comparing tensile strength, tensile elongation, transmittance, and water vapor permeability of plant-based enteric polymer films and rheological properties of solutions. Polyethylene glycol 400 (PEG-400) was an effective plasticizer in improving plasticity and water vapor barrier property of the plant-based enteric polymer film. Rheology measurement and different characterization methods, including Fourier transform infrared spectroscopy, thermogravimetric analysis, differential scanning calorimetry, X-ray diffraction, and scanning electron microscopy, were used to explain interactions between GG and XG as well as PEG-400 and components of the film. The new mixed system, composed of GG/XG mixture with ratio of 7:3 as a novel gelling agent and PEG-400 as a plasticizer, was applied to prepare plant-based enteric hard capsules, which have potential applications in medicines and functional food preparations.

In this paper, a new method involving a wear-resistant and reusable template is proposed for the preparation of high-mechanical-strength superhydrophobic polymer film based on wire electrical discharge machining (WEDM). A solid−liquid-contact-angle simulation model was established to obtain surface-texture types and sizes that may achieve superhydrophobicity. The experimental results from template preparation show that there is good agreement between the simulation and experimental results for the contact angle. The maximum contact angle on the template can reach 155.3° given the appropriate triangular surface texture and WEDM rough machining. Besides, the prepared superhydrophobic template exhibits good wear resistance and reusability. PDMS superhydrophobic polymer films were prepared by the template method, and their properties were tested. The experimental results from the preparation of superhydrophobic polymer films show that the maximum contact angle of the polymer films can be up to 154.8° and that these films have good self-cleaning and anti-icing properties, wear resistance, bending resistance, and ductility.

Epoxy resin (EP), as a kind of dielectric polymer, exhibits the advantages of low-curing shrinkage, high-insulating properties, and good thermal/chemical stability, which is widely used in electronic and electrical industry. However, the complicated preparation process of EP has limited their practical applications for energy storage. In this manuscript, bisphenol F epoxy resin (EPF) was successfully fabricated into polymer films with a thickness of 10~15 μm by a facile hot−pressing method. It was found that the curing degree of EPF was significantly affected by changing the ratio of EP monomer/curing agent, which led to the improvement in breakdown strength and energy storage performance. In particular, a high discharged energy density (Ud) of 6.5 J·cm−3 and efficiency (η) of 86% under an electric field of 600 MV·m−1 were obtained for the EPF film with an EP monomer/curing agent ratio of 1:1.5 by hot pressing at 130 °C, which indicates that the hot−pressing method could be facilely employed to produce high−quality EP films with excellent energy storage performance for pulse power capacitors.