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The differential transmission line has been widely used in the field of high-speed signals with its unique transmission characteristics, and it will be affected by many factors during the transmission process. In this paper, the differential transmission line is taken as the research object, and a three-dimensional electromagnetic simulation software CST is used to study its signal integrity performance parameters including characteristic impedance, loss, and crosstalk. It is found through simulation that increasing the spacing between differential pairs will reduce the crosstalk. The smaller the differential pair length, the greater the value of the insertion loss. This will improve the quality of signal transmission.

This chapter contains sections titled: Capacitance Between Conductors Differential Mode and Common Mode Capacitance References

Based on through-silicon-vias (TSVs) technology, a circuit model of ground-signal-signal-ground (GSSG)-type TSVs structure has been proposed. The lumped parameters are derived based on the size of the structure considering the adjacent structure. The results of the equivalent-circuit model match well with the results of the electro-magnetic simulation. The model is also placed on a two-layer PCB board for simulation. Signal integrity, near-end and far-end crosstalk are researched in this model. Finally, based on GSSG-type TSVs, the transmission performance and crosstalk behaviors are analyzed with different structure parameters.

Amplitude modulation (AM) is a key technique for transmitting information by altering the amplitude of a carrier signal, including both conventional modulation and overmodulation strategies. Conventional AM focuses on maintaining signal integrity and minimizing distortion despite lower power efficiency, whereas overmodulation enhances signal strength and efficiency, albeit with potential increases in distortion. Crucially, modulation phase plays a pivotal role in AM, impacting signal representation, demodulation, and the processing of multiple signals. This paper aims to report on the dynamics of relaxation oscillations caused by changes in modulation phase under overmodulation. Typically, at low modulation phases, the introduction of modulation phase leads to changes in the system’s vector field structure and a shift in the time series. Particularly, when modulation phase reaches a certain critical value, it causes a sudden extension of the quasi-static slow process in the system’s upper branch, a pattern that persists within a specific parameter range. Furthermore, as modulation phase increases to another critical value, the quasi-static process in the system’s upper branch suddenly extends again. Interestingly, as the modulation phase continues to increase to two additional critical values, this pattern of extending the quasi-static slow process on the upper branch transforms into a pattern of shortening, with each occurring suddenly within their respective parameter ranges. Lastly, using three-parameter and two-parameter bifurcation diagrams, we illustrate the impact of the overmodulation index on the system’s dynamic behavior. Changes in the overmodulation index alter relaxation oscillation patterns: low indices cause sudden extensions, while high indices reduce oscillations. Our research highlights the significant influence of the overmodulation index on dynamic behavior and provides a reference for other modulation conditions.

Surface integrity is a critical factor that affects the fatigue resistance of materials. A surface mechanical rolling treatment (SMRT) process can effectively improve the surface integrity of the material, thus enhancing the fatigue property. In this paper, an analysis of variance (ANOVA) and signal-to-noise ratio (SNR) are performed by orthogonal experimental design with SMRT parameters as variables and surface integrity indicators as optimization objectives, and the support vector machine-active learning (SVM-AL) model is proposed based on machine learning theory. The entire model includes three rounds of AL processes. In each round of the AL process, the SMRT parameters with relative average deviation and high output values from cross-validation are selected for the additional experimental supplement. The results show that the prediction accuracy and generalization ability of the SVM-AL model are significantly improved compared to the support vector machine (SVM) model. A fatigue test was also carried out, and the fatigue property of the SMRT specimens predicted by the SVM-AL model is also higher than that of the other specimens.

As an important characteristic of a signal transmission network, scattering parameters can accurately reflect the signal transmission situation. By establishing a circuit model based on scattering parameters for the signal path unit, studying the signal attenuation and reflection curves of components including transmission lines, transmission media, vias, high-speed connectors, and transceiver termination devices, a circuit simulation model completely based on scattering parameters is proposed. This model can be parametrically adjusted according to the requirements of actual circuit implementation, and accurately reflect the high-speed signal transmission quality of the final circuit. This circuit simulation model is applied to the high-speed 5G small base station system. The transceiver performance of the modular circuit model completely based on scattering parameters and the scattering parameter model extracted based on board-level implementation is compared. The results show that the modular circuit completely based on scattering parameters can accurately match the channel communication indicators of board-level implementation.

Back-drilling is a crucial technology for improving the signal integrity (SI) of high-speed printed circuit boards (PCBs) and plays a significant role in the growth of signal transmission to high frequencies and speeds. However, the performance of high-speed PCBs is greatly affected by hole plugging, the hole registration accuracy, and the via stub in back-drilling. Therefore, the key problems and technologies of back-drilling are investigated and summarized in this paper. First, the classification, the system components, and the features of back-drilling are presented. A summary of back-drilling effects on SI allows better understanding of the advantages of back-drilling in reducing the signal time delay, reflection, and resonance. The studies done by scholars to avoid plugged holes, to improve the hole registration accuracy, and to decrease the length of the via stub are also reviewed from the aspects of technological processes, machining parameters, back-drilling methods, and drilling machine accuracy. Finally, this paper provides some points of research that will help in the further study of the hole quality, hole registration accuracy, and stub control to enhance the performance of back-drilling.

The development of structural health monitoring (SHM) systems and their integration in actual structures has become a necessity as it can provide a robust and low-cost solution for monitoring the structural integrity of and the ability to predict the remaining life of structures. In this review, we aim at focusing on one of the important issues of SHM, the design, and implementation of sensor networks. Location and number of sensors, in any SHM system, are of high importance as they impact the system integration, system performance, and accuracy of assessment, as well as the total cost. Hence we are interested in shedding the light on the sensor networks as an essential component of SHM systems. The review discusses several important parameters including design and optimization of sensor networks, development of academic and commercial solutions, powering of sensors, data communication, data transmission, and analytics. Finally, we presented some successful case studies including the challenges and limitations associated with the sensor networks.

In this study, an acoustic emission (AE) technique was used as a passive non-destructive tool to detect the damage progress in short glass fiber-reinforced composite panels. AE detection was conducted during three-point bend tests, thus illustrating the flexural damage accumulation for composite panels with different sizes and fiber volume content. To demonstrate the universality of the employed integrity assessment methodology, AE data was detected using different timing parameters and two different transducer types, i.e., medium-band and wide-band frequency sensors. The AE waveform classification presented in this study is based on peak frequency distributions. Frequency bands that are associated with certain failure mechanisms, including matrix micro-cracking, fiber debonding, delamination, and fiber breakage, were obtained from the technical literature. Through this investigation, the concept of cumulative signal strength (CSS) and cumulative rise time versus peak amplitude ratio (CRA) as AE output parameters are shown to facilitate integrity assessment for the employed complex composite material system. Significant jumps in CSS and CRA curves could be correlated to critical strain levels and distinct damage events in the composite panels subjected to flexural loading.

This paper reviews a statistical signal integrity (SI) analysis at the system level for a high-speed system design. An eye diagram graphically shows a system’s performance. However, an eye diagram requires a long acquisition time for accurate results. The time-consuming nature of this process makes an eye-diagram-based SI analysis inefficient. Thus, a statistical eye diagram was introduced for an efficient SI analysis. The statistical eye diagram provides not only SI metrics such as eye height (EH) and eye width (EW), but also the bit-error rate (BER) profile for each channel. The data transmitted over the high-speed channels are determined by an upper hierarchy such as a system. In other words, the data are a function of the system parameters. In conclusion, a statistical eye diagram is determined by the high-speed channels and the system parameters. Therefore, the previous works on statistical eye diagrams at the channel and system levels have been introduced, respectively. This paper reviews the previous works for a system-level statistical SI analysis with a statistical eye diagram.