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Over decades, fiber-optic temperature sensors based on conventional single-mode fibers (SMF) have been demonstrated with either high linearity and stability in a limited temperature region or poor linearity and thermal hysteresis in a high-temperature measurement range. For high-temperature measurements, isothermal annealing is typically necessary for the fiber-optic sensors, aiming at releasing the residual stress, eliminating the thermal hysteresis and, thus, improving the high-temperature measurement linearity and stability. In this article, an annealing-free fiber-optic high-temperature (1100 °C) sensor based on a diaphragm-free hollow-core fiber (HCF) Fabry-Perot interferometer (FPI) is proposed and experimentally demonstrated. The proposed sensor exhibits an excellent thermal stability and linearity (R2 > 0.99 in a 100–1100 °C range) without the need for high-temperature annealing. The proposed sensor is extremely simple in preparation, and the annealing-free property can reduce the cost of sensor production significantly, which is promising in mass production and industry applications.

In this paper, a fiber probe high-temperature sensor based on the Michelson Interferometer (MI) is proposed and experimentally verified. We used a fiber splicing machine to fabricate a taper of the single-mode fiber (SMF) end. The high order modes were excited at the taper, so that different modes were transmitted forward in the fiber and reflected by the end face of the fiber and then recoupled back to the fiber core to form MI. For comparison, we also coated a thin gold film on the fiber end to improve the reflectivity, and the reflection intensity was improved by 16 dB. The experimental results showed that the temperature sensitivity at 1506 nm was 80 pm/°C (100 °C~450 °C) and 109 pm/°C (450 °C~900 °C). The repeated heating and cooling processes showed that the MI structure had good stability at a temperature up to 900 °C. This fiber probe sensor has the advantages of a small size, simple structure, easy manufacturing, good stability, and broad application prospects in industrial and other environments.

Schottky diode-based temperature sensors are the most common commercially available temperature sensors, and they are attracting increasing interest owing to their higher Schottky barrier height compared to their silicon counterparts. Therefore, this paper presents a comparison of the thermal sensitivity variation trend in temperature sensors, based on dual 4H-SiC junction barrier Schottky (JBS) diodes and Schottky barrier diodes (SBDs). The forward bias current–voltage characteristics were acquired by sweeping the DC bias voltage from 0 to 3 V. The dual JBS sensor exhibited a higher peak sensitivity (4.32 mV/K) than the sensitivity exhibited by the SBD sensor (2.85 mV/K), at temperatures ranging from 298 to 573 K. The JBS sensor exhibited a higher ideality factor and barrier height owing to the p–n junction in JBS devices. The developed sensor showed good repeatability, maintaining a stable output over several cycles of measurements on different days. It is worth noting that the ideality factor and barrier height influenced the forward biased voltage, leading to a higher sensitivity for the JBS device compared to the SBD device. This allows the JBS device to be suitably integrated with SiC power management and control circuitry to create a sensing module capable of working at high temperatures.

A high-temperature sensor based on a metamaterial unit cell is proposed in this paper. The wireless passive temperature sensing method is based on the electromagnetic backscatter principle, and thus has the advantages of higher quality, lower environmental interference, and anti-low frequency interference. We developed a finite-element method-based model for the sensor via high-frequency simulation software (HFSS). A double split-ring resonator (SRR) with an outer ring length of 13 mm was designed on alumina ceramic substrate. The sensor was fabricated at 2.42 GHz using micromechanical technology and screen printing technology. When the temperature increased from 28 to 1100 °C, the resonant frequency decreased from 2.417 to 2.320 GHz with an average sensitivity of 95.63 kHz/°C. As the sensor is easily designed and fabricated, it can be used for chipless radio frequency identification (RFID) tags by simply changing the size of rings. Furthermore, emerging 3D printing technology and commercial desktop inkjet printers will be used to realize the rapid low-cost preparation of the sensor, enabling its wide range of applications in aerospace, military, manufacturing, transportation, and other fields.

This work focuses on the fabrication and evaluation of a passive wireless sensor for the monitoring of the temperature and corrosion of a metal material at high temperatures. An inductor–capacitor (LC) resonator sensor was fabricated through the screen printing of Ag-based inks on dense polycrystalline Al2O3 substrates. The LC design was modeled using the ANSYS HFSS modeling package, with the LC passive wireless sensors operating at frequencies from 70 to 100 MHz. The wireless response of the LC was interrogated and received by a radio frequency signal generator and spectrum analyzer at temperatures from 50 to 800 °C in real time. The corrosion kinetics of the Cu 110 was characterized through thermogravimetric (TGA) analysis and microscopy images, and the oxide thickness growth was then correlated to the wireless sensor signal under isothermal conditions at 800 °C. The results showed that the wireless signal was consistent with the corrosion kinetics and temperature, indicating that these two characteristics can be further deconvoluted in the future. In addition, the sensor also showed a magnitude- and frequency-dependent response to crack/spallation events in the oxide corrosion layer, permitting the in situ wireless identification of these catastrophic events on the metal surface at high temperatures.

Fiber Bragg gratings inscribed in single crystalline multimode sapphire fibers (S-FBG) are suitable for monitoring applications in harsh environments up to 1900 °C. Despite many approaches to optimize the S-FBG sensor, a metrological investigation of the achievable temperature uncertainties is still missing. In this paper, we developed a hybrid optical temperature sensor using S-FBG and thermal radiation signals. In addition, the sensor also includes a thermocouple for reference and process control during a field test. We analyzed the influence of the thermal gradient and hotspot position along the sensor for all three detection methods using an industrial draw tower and fixed point cells. Moreover, the signal processing of the reflected S-FBG spectrum was investigated and enhanced to determine the reachable measurement repeatability and uncertainty. For that purpose, we developed an analytical expression for the long-wavelength edge of the peak. Our findings show a higher stability against mechanical-caused mode variations for this method to measure the wavelength shift compared to established methods. Additionally, our approach offers a high robustness against aging effects caused by high-temperature processes (above 1700 °C) or harsh environments. Using temperature-fixed points, directly traceable to the International System of Units, we calibrated the S-FBG and thermocouple of the hybrid sensor, including the corresponding uncertainty budgets. Within the scope of an over 3-weeks-long field trial, 25 production cycles of an industrial silicon manufacturing process with temperatures up to 1600 °C were monitored with over 100,000 single measurements. The absolute calibrated thermocouple (Uk=2≈1K…4K) and S-FBG (Uk=2≈10K…14K) measurements agreed within their combined uncertainty. We also discuss possible strategies to significantly reduce the uncertainty of the S-FBG calibration. A follow-up measurement of the sensor after the long-term operation at high temperatures and the transport of the measuring system together with the sensor resulted in a change of less than 0.5 K. Thus, both the presented hybrid sensor and the measuring principle are very robust for applications in harsh environments.

Thin-film sensors are regarded as advanced technologies for in situ condition monitoring of components operating in harsh environments, such as aerospace engines. Nevertheless, these sensors encounter challenges due to the high-temperature oxidation of materials and intricate manufacturing processes. This paper presents a simple method to fabricate high temperature-resistant oxidized SiCN precursor and La(Ca)CrO3 composite thin film temperature sensors by screen printing and air annealing. The developed sensor demonstrates a broad temperature response ranging from 200 °C to 1100 °C with negative temperature coefficients (NTC). It exhibits exceptional resistance to high-temperature oxidation and maintains performance stability. Notably, the sensor’s resistance changes by 3% after exposure to an 1100 °C air environment for 1 h. This oxidation resistance improvement surpasses the currently reported SiCN precursor thin-film sensors. Additionally, the sensor’s temperature coefficient of resistance (TCR) can reach up to −7900 ppm/°C at 200 °C. This strategy is expected to be used for other high-temperature thin-film sensors such as strain gauges, heat flux sensors, and thermocouples. There is great potential for applications in high-temperature field monitoring.

This paper presents a high-temperature probe suitable for operating in harsh industrial applications as a reliable alternative to low-lifespan conventional solutions, such as thermocouples. The temperature sensing element is a Schottky diode fabricated on 4H-SiC wafers, with Ni as the Schottky metal, which allows operation at temperatures up to 400 °C, with sensitivities over 2 mV/°C and excellent linearity (R2 > 99.99%). The temperature probe also includes dedicated circuitry for signal acquisition and conversion to the 4 mA–20 mA industrial standard output signal. This read-out circuit can be calibrated for linear response over a tunable temperature detection range. The entire system is designed for full electrical and mechanical compatibility with existing conventional probe casings, allowing for seamless implementation in a factory’s sensor network. Such sensors are tested alongside standard thermocouples, with matching temperature monitoring results, over several months, in real working conditions (a cement factory), up to 400 °C.

Research has shown that SAW (surface acoustic wave) devices with an LGS/Pt (langasite La3Ga5SiO14/platinum) structure are useful in high-temperature sensor applications. Extreme high temperature brings great acoustic attenuation because of the thermal radiation loss, which requires that the sensing device offer a sufficiently high quality factor (Q) and a low loss. Therefore, it is necessary to improve the performance of the quality factor as much as possible so as to better meet the application of high-temperature sensors. Based on these reasons, the main work of this paper was to extract accurate simulation parameters to optimize the Pt/LGS device and obtain Q-value device parameters. Optimization of SAW devices with LGS/Pt structure for sensing extreme high temperature was addressed by employing a typical coupling of modes (COM) model in this work. Using the short pulse method, the reflection coefficient of Pt electrodes on LGS substrate was extracted accurately by characterizing the prepared SAW device with strategic design. Other relevant parameters for COM simulation were determined by finite element analysis. To determine the optimal design parameters, the COM simulation was conducted on the SAW sensing device with a one-port resonator pattern for sensing extreme temperature, which allows for a larger Q-value and low insertion loss. Experimental results validate the theoretical simulation. In addition, the corresponding high-temperature characteristics of the prepared sensing device were investigated.

Bismuth layer-structured ferroelectric (BLSF) ceramics exhibit linearity in resistivity with respect to temperature changes, and therefore find application as high-temperature sensor materials. In this study, calcium bismuth titanate (CBT), a BLSF material, was synthesized by calcining combined oxide precursors at 850°C for 2 h, and its particle size distribution, phase analysis, grain size distribution and morphology were characterized. Circular discs were prepared by sintering in the temperature range of 1000 to 1200°C. The sintered discs were characterized for dielectric constant ( K ), P-E hysteresis loop and DC electrical resistivity ( ρ ) from 100 to 900°C. The highest density (> 95% Th.) was obtained for samples sintered at 1175°C. DC resistivity decreased linearly from 10 14 to 10 5  Ω cm with the rise in temperature from 100 to 900°C, therefore confirming CBT as a prospective high-temperature sensor material.