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1 result(s) for "microcapsule molded"
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Intelligent Fire Suppression Devices Based on Microcapsules Linked to Sensor Internet of Things
Most fire spread is caused by the absence of suppression means at the beginning of the fire. This results in the missed golden time. There are various factors that cause initial fires, such as electrical outlets, general distribution circuits, and oil–vapor–gas cluster spaces. In most cases, these places are out of reach of human hands or they lose the initial suppression time when a fire occurs, causing the spread of fire. This study implements an intelligent fire suppression device that connects sensor IoT based on microcapsules to secure initial fire suppression and golden time in the event of a fire in blind spots that cannot be seen by humans or at a time when it is difficult to recognize a fire. The microcapsule is a micro-collection unit that collects Novec 1230 gas generated in the semiconductor production process. The microcapsule is molded into a form with a fire suppression function and, when a fire occurs, the molded body explodes and absorbs ambient oxygen to suppress the fire. The complex-sensor IoT executes smoke and heat detection generated when a fire is suppressed within 10 s, which ensures the reliability of the detector by notifying of the fire and detecting the ignition point through communication linkages such as Ieee 485 and WiFi or LoRa.