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Vortex holes at the welding interface will affect the interface sealing performance of the explosive welding clad plate, so in the production process to choose the appropriate parameters to avoid the production of vortex holes. The step method is used to study the titanium-copper explosive welding clad plate interface vortex holes generation and interface ripple morphology change law under different stand-off distances. Experimental results show that the shear strength of the welding interface, the wavelength and amplitude of the ripple are positively correlated with the stand-off distance. The closer to the interface, the greater the hardness; the presence of dislodged metal blocks in the melt zone leads to no significant increase in hardness. When the stand-off distance is 4 mm ( β = 16 ∘ , V p = 779 m / s ), the least amount of intermetallic compounds is generated at the interface. When the stand-off distance is not more than 8 mm ( β ≤ 19 ∘ , V p ≤ 947 m / s ), there are no vortex holes on the interface. The welding process is simulated by the smooth particle hydrodynamics method in AUTODYN. The numerical simulation results show that the main component of the jet is titanium; numerical simulation can well predict the ripple shape of the welding interface.

Titanium-copper alloy films with stoichiometry given by Ti1−xCux were produced by magnetron co-sputtering technique and analyzed in order to explore the suitability of the films to be applied as resistive temperature sensors with antimicrobial properties. For that, the copper (Cu) amount in the films was varied by applying different DC currents to the source during the deposition in order to change the Cu concentration. As a result, the samples showed excellent thermoresistivity linearity and stability for temperatures in the range between room temperature to 110 °C. The sample concentration of Ti0.70Cu0.30 has better characteristics to act as RTD, especially the αTCR of 1990 ×10−6°C−1. The antimicrobial properties of the Ti1−xCux films were analyzed by exposing the films to the bacterias S. aureus and E. coli, and comparing them with bare Ti and Cu films that underwent the same protocol. The Ti1−xCux thin films showed bactericidal effects, by log10 reduction for both bacteria, irrespective of the Cu concentrations. As a test of concept, the selected sample was subjected to 160 h reacting to variations in ambient temperature, presenting results similar to a commercial temperature sensor. Therefore, these Ti1−xCux thin films become excellent antimicrobial candidates to act as temperature sensors in advanced coating systems.

Grain size plays a decisive role in governing the interface evolution and mechanical properties of ultra-thin metal composite foils. This study systematically investigates this relationship in roll-bonded C7701/Ti/C7701 (Cu-Ni-Zn alloy) composite foils. By controlling the initial grain size via pre-annealing, we demonstrate that a moderate grain size (~7–8 μm) optimally regulates a sequential “bonding–diffusion–intermetallic compound (IMC) formation” process at the interface. This results in a continuous, thin IMC layer and the best strength–ductility synergy (e.g., UTS ~217.5 MPa, elongation ~4.15%). In contrast, excessively fine or coarse grains lead to thick, brittle IMCs or interfacial defects, respectively, degrading performance. The mechanism by which grain size influences performance is revealed through a sequential mechanism of “bonding–diffusion–intermetallic compound formation.”

Implants are widely used in the field of orthopedics and dental sciences. Titanium (TI) and its alloys have become the most widely used implant materials, but implant-associated infection remains a common and serious complication after implant surgery. In addition, titanium exhibits biological inertness, which prevents implants and bone tissue from binding strongly and may cause implants to loosen and fall out. Therefore, preventing implant infection and improving their bone induction ability are important goals. To study the antibacterial activity and bone induction ability of titanium-copper alloy implants coated with nanosilver/poly (lactic-co-glycolic acid) (NSPTICU) and provide a new approach for inhibiting implant-associated infection and promoting bone integration. We first examined the in vitro osteogenic ability of NSPTICU implants by studying the proliferation and differentiation of MC3T3-E1 cells. Furthermore, the ability of NSPTICU implants to induce osteogenic activity in SD rats was studied by micro-computed tomography (micro-CT), hematoxylin-eosin (HE) staining, masson staining, immunohistochemistry and van gieson (VG) staining. The antibacterial activity of NSPTICU in vitro was studied with gram-positive and gram-negative bacteria. was used as the test bacterium, and the antibacterial ability of NSPTICU implanted in rats was studied by gross view specimen collection, bacterial colony counting, HE staining and Giemsa staining. Alizarin red staining, alkaline phosphatase (ALP) staining, quantitative real-time polymerase chain reaction (qRT-PCR) and western blot analysis showed that NSPTICU promoted the osteogenic differentiation of MC3T3-E1 cells. The in vitro antimicrobial results showed that the NSPTICU implants exhibited better antibacterial properties. Animal experiments showed that NSPTICU can inhibit inflammation and promote the repair of bone defects. NSPTICU has excellent antibacterial and bone induction ability, and has broad application prospects in the treatment of bone defects related to orthopedics and dental sciences.

Dental implants are the standard for replacing missing teeth, with the Ti‐6Al‐4V alloy dominating the market due to its superior osteointegration. However, long‐term implant success is often hindered by peri‐implantitis, which stems from bacterial colonization and biofilm formation. To address this challenge, titanium‐copper (Ti‐Cu) alloys garner attention for their dual antibacterial and osteogenic properties. This review organizes and explores the antibacterial mechanisms of Ti‐Cu alloys and their role in promoting osteogenesis in comparison to conventional alloys. Key findings from existing literature underscore the potential of Ti‐Cu alloys to enhance implant performance and longevity. Although the literature is promising, further research is needed to determine optimal composition ranges that balance biocompatibility, mitigate cytotoxicity from copper ion release, and facilitate clinical translation. Ti‐Cu alloys represent a transformative approach to improving implant outcomes and addressing the limitations of current materials. Given the growing interest in antibiotic‐free implant strategies and the need for biocompatible solutions to combat peri‐implantitis and implant failure, this review gives a timely and comprehensive overview of Ti‐Cu alloys as next‐generation biomaterials. A focus is their dual functionality, i.e., the intrinsic antibacterial behavior and osteogenic properties. The review closes with systematic recommendations for future studies emphasizing Ti‐Cu as a top candidate for next‐generation implant materials.

Titanium-copper (Ti-Cu) alloy is an advanced antibacterial material with excellent mechanical properties, thermodynamic stability, corrosion resistance and biocompatibility. Sandblasting and acid-etching was applied to the Ti-3Cu alloy to construct a rough surface with Ti2Cu phase on the surface in order to improve the antibacterial properties and the osseointegration. The phase constitutes and the physical properties were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and confocal laser scanning microscope (CLSM), and the surface chemical properties were analyzed by X-ray photoelectron spectroscopy (XPS) and electrochemical testing. The antibacterial property was assessed by the plate-count method and the cell compatibility was evaluated by the CCK-8 test in order to reveal the effect of surface characteristics on the antibacterial ability and bioactivity. The results demonstrated a rough and lamellar surface structure with many submicron Ti2Cu particles on the surface of Ti-3Cu, which could enhance the antibacterial ability and promote the cell proliferation and the initial adhesion of osteoblasts. However, the surface treatment also reduced the corrosion resistance and accelerated the Cu ion release.

Although Ti-Cu alloys have been shown to possess good antibacterial properties, they are still biologically inert. In this study, sandblasting and acid etching combined with anodic oxidation were applied to roughen the surface as well as to form a TiO2/CuO/Cu2O composite film, which would benefit both the antibacterial properties and the biocompatibility. The surface morphology, the phase composition, and the physicochemical properties were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Electrochemical testing and inductively coupled plasma spectrometry (ICP) were used to determine the corrosion resistance and Cu ion release, the plate counting method was used to evaluate the antibacterial performance, and the CCK-8 method was used to evaluate the cytocompatibility. It was revealed that a rough surface with densely porous double layer composed of TiO2/CuO/Cu2O was produced on Ti-Cu alloy surface after the combined surface modification, which enhanced the corrosion resistance significantly. The plate counting results demonstrated that the modified sample had strong long-term antibacterial performance (antibacterial rate > 99%), which was attributed to the formation of TiO2/CuO/Cu2O composite film. The cell compatibility evaluation results indicated that the surface modification improved the cytocompatibility. It was demonstrated that the combined modification provided very strong antibacterial ability and good cytocompatiblity, potentially making it a good candidate surface modification technique for Ti-Cu alloy for biomedical applications.

Aim: The aim of this study was to investigate the friction and the difference in the roughness of the wire on the standard edgewise bracket. Materials and Methods: This was an experimental laboratory study with a posttest only control group design. The number of samples in this research was 21. The samples were divided into three groups (n = 7) consisting of 0.016′′ x 0.022′′ stainless steel archwire (SS group), 0.016′′ x 0.022′′ nickel-titanium archwire (NiTi group), and 0.016′′ x 0.022′′ nickel-titanium copper archwire (NiTiCu group). The bracket used in each group is standard edgewise slot 0.018. Friction coefficient test was conducted by creating an examination tool from acrylic to fixate the bracket with a size of 2cm x 5cm. The bracket was then attached using glue (polyvinyl acetate) and the archwire was fixated to the bracket using power O. After the friction test, three samples were taken from each group to be tested morphology and topography of each type using scanning electron microscope (SEM). Statistical analysis used in this research is using one-way analysis of variance (ANOVA) to find out the comparison of variables and Tukey's honest significant difference (HSD) to find out the comparison between three groups (P < 0.05). Results: The lowest friction coefficient was found in SS archwire, which consecutively followed by NiTiCu and NiTi. The smoothest archwire surface observed by SEM was SS, followed by NiTiCu and NiTi. Conclusion: SS wire has the smoothest archwire surface and the lowest frictional force, so it is well used for the teeth movement in space closing on edgewise bracket.

An Al–Ti–Cu–Si solid–liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500–600°C was designed for SiC–metal joining. The microstructure, phases, differential thermal curves, and high-temperature wetting behavior of the alloy were analyzed using scanning electron microscopy, X-ray diffraction analysis, differential scanning calorimetry, and the sessile drop method. The experimental results show that the 76.5Al–8.5Ti–5Cu–10Si alloy is mainly composed of Al–Al 2 Cu and Al–Si hypoeutectic low-melting-point microstructures (493–586°C) and the high-melting-point intermetallic compound AlTiSi (840°C). The contact angle, determined by high-temperature wetting experiments, is approximately 54°. Furthermore, the wetting interface is smooth and contains no obvious defects. Metallurgical bonding at the interface is attributable to the reaction between Al and Si in the alloy and ceramic, respectively. The formation of the brittle Al 4 C 3 phase at the interface is suppressed by the addition of 10wt% Si to the alloy.