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Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
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Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
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Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration

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Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration
Journal Article

Self-constrained sintering of Al2O3/glass/Al2O3 ceramics by glass infiltration

2009
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Overview
Though need for precise alignment of interlayer patterning in LTCC application, there have been few reports about zero-shrinkage sintering techniques. In this study, ceramic substrate with minimal x – y shrinkage was prepared by glass infiltration method with ‘Al 2 O 3 /glass/Al 2 O 3 ’ structure. Glass infiltration into alumina particle layer was observed with variation of both sintering temperature (700 ≤  T sint.  ≤ 900 °C) and alumina particle size distribution (0.5 ≤  D 50  ≤ 1.8 μm). Since glass had low viscosity enough to infiltrate at 700 °C, infiltration started at that temperature and infiltrated up to 20 μm or so with temperature increase, but infiltration depth did not increase noticeably above 750 °C. Based on these results, when sintered at 900 °C with controlled sheet thickness of both glass and alumina, the shrinkage in x – y direction was calculated as less than 0.2%, with 40% in z direction. Dielectric constant ( ɛ r ) measured 6.19 with quality factor ( Q ) of 552 at 1 GHz of frequency. From these results, it is thought that zero-shrinkage ceramic substrates would be obtained without de-lamination.