Asset Details
Do you wish to reserve the book?
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds
Do you wish to request the book?
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds
2018
Overview
Cu6Sn5 is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal η-Cu6Sn5 intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)6Sn5 intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu6Sn5 has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2110], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in η-Cu6Sn5.
Publisher
Trans Tech Publications, Ltd,Trans Tech Publications Ltd
Subject
