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Mixed-mode load bearing estimation of the cracked additively manufactured materials using stress/strain-based models
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Mixed-mode load bearing estimation of the cracked additively manufactured materials using stress/strain-based models
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Journal Article
Mixed-mode load bearing estimation of the cracked additively manufactured materials using stress/strain-based models
2023
Overview
Purpose
The main aim of this study is to investigate the mixed-mode I/II failure and the cracking manner of three-dimensional (3D)-printed components made by the fused deposition modeling technique in an experimental and theoretical manner.
Design/methodology/approach
Acrylonitrile butadiene styrene (ABS) material and a modified printing method (that increases the adhesion and integrity between the layers and strands) are used for manufacturing the semicircular bending (SCB) test samples. In addition to precracking, the effect of additional stress concentration on the stress field is studied by introducing three small holes to the SCB fracture samples. The critical mixed-mode I/II failure loads obtained from the experiments are predicted using different stress/strain-based fracture theories, including maximum tangential stress (MTS), maximum tangential strain (MTSN), generalized form of MTS and MTSN and combination of them with equivalent material concept (EMC). The effects of plastic deformation, as well as the structural stress concentration, are considered for a more realistic prediction of mixed-mode fracture load.
Findings
The stress-based criteria are more suitable than the strain-based theories. Among the investigated fracture models, the EMC–generalized maximum tangential stress theory provided the best agreement with the experimental results obtained from 3D-printed SCB tests.
Originality/value
The influences of stress risers and applicability of different failure theories in cracked layered 3D-printed parts are studied on the fracture behavior of tested specimens under mixed-mode I/II.
Publisher
Emerald Publishing Limited,Emerald Group Publishing Limited
Subject
