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Thermal Friction Contact Analysis of Graded Piezoelectric Coatings Under Conductive Punch Loading
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Thermal Friction Contact Analysis of Graded Piezoelectric Coatings Under Conductive Punch Loading
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Journal Article
Thermal Friction Contact Analysis of Graded Piezoelectric Coatings Under Conductive Punch Loading
2025
Overview
In this paper, we investigate the thermal friction sliding contact of a functionally graded piezoelectric material (FGPM)-coated half-plane subjected to a rigid conductive cylindrical punch. This study considers the effect of the thermal convection term in heat conduction. The thermo-electro-elastic material parameters of the coating vary exponentially along its thickness direction. Utilizing thermoelastic theory and Fourier integral transforms, the problem is formulated into Cauchy singular integral equations of the first and second kinds with surface stress, contact width, and electric displacement as the unknown variables. The numerical solutions for the contact stress, electric displacement, and temperature field of the graded coating surface are obtained using the least-squares method and iterative techniques. It can be observed that the thermo-electro-elastic contact behavior of the coating surface undergoes significant changes as the graded index varies from −0.5 to 0.5, the friction coefficient ranges from 0.1 to 0.5, and the sliding velocity changes from 0.01 m/s to 0.05 m/s. The results indicate that adjusting the graded index of the coating, the sliding speed of the punch, and the friction coefficient can improve the thermo-electro-elastic contact damage of the material’s surface.
Publisher
MDPI AG
Subject
