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Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72
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Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72
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Journal Article
Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72
2022
Overview
The uniformly distributed mini-pin-fins on the copper surface were designed and processed, and the enhanced boiling heat transfer performance on mini-pin-finned copper surfaces in FC-72 was investigated. The smooth copper surface was used as the experimental comparison group. The effect of the copper fin height, spacing, and width on the pool boiling heat transfer performance and the fin efficiency were investigated. At the same liquid subcooling, the critical heat flux and heat transfer coefficient of the uniformly distributed mini-pin-finned copper surface increased with the copper fin height, decreased with the rise of the copper fin spacing and fin width. The fin efficiency increases with the rise of the fin height, spacing, and width. The critical heat flux of the mini-pin-finned copper surface (PF0.3–0.2–2) reached 115.4 W·cm−2 at liquid subcooling of 25 K and increased by about 3.62 times compared with the smooth copper surface, and the heat transfer efficiency of mini-pin-finned copper surface (PF0.5–0.2–2) exceeded 95%.
Publisher
Springer Nature B.V
Subject
