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Copper incorporated biomaterial-based technologies for multifunctional wound repair
by
Xue, Hang
, Geng, Yongtao
, Panayi, Adriana C.
, Knoedler, Samuel
, Zhang, Zhenhe
, Dai, Guandong
, Xiong, Yuan
, Liu, Gouhui
, Shahbazi, Mohammad-Ali
, Mi, Bobin
in
Review
2024
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Do you wish to request the book?
Copper incorporated biomaterial-based technologies for multifunctional wound repair
by
Xue, Hang
, Geng, Yongtao
, Panayi, Adriana C.
, Knoedler, Samuel
, Zhang, Zhenhe
, Dai, Guandong
, Xiong, Yuan
, Liu, Gouhui
, Shahbazi, Mohammad-Ali
, Mi, Bobin
in
Review
2024
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Copper incorporated biomaterial-based technologies for multifunctional wound repair
Journal Article
Copper incorporated biomaterial-based technologies for multifunctional wound repair
2024
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Overview
The treatment of wounds is a worldwide challenge, and wound infection can affect the effectiveness of wound treatment and further increase the disease burden. Copper is an essential trace element that has been shown to have broad-spectrum antibacterial effects and to be involved in the inflammation, proliferation, and remodeling stages of wound healing. Compared to treatments such as bioactive factors and skin grafts, copper has the advantage of being low-cost and easily available, and has received a lot of attention in wound healing. Recently, biomaterials made by incorporating copper into bioactive glasses, polymeric scaffolds and hydrogels have been used to promote wound healing by the release of copper ions. In addition, copper-incorporated biomaterials with catalytic, photothermal, and photosensitive properties can also accelerate wound healing through antibacterial and wound microenvironment regulation. This review summarizes the antibacterial mechanisms of copper- incorporated biomaterials and their roles in wound healing, and discusses the current challenges. A comprehensive understanding of the role of copper in wounds will help to facilitate new preclinical and clinical studies, thus leading to the development of novel therapeutic tools.
Publisher
Ivyspring International Publisher
Subject
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