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Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al2O3 Ceramics Substrate
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Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al2O3 Ceramics Substrate
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Journal Article
Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al2O3 Ceramics Substrate
2021
Overview
Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al2O3 ceramics substrate was studied. Two laser trepanning patterns were evaluated, filled spiral trepanning and multiple rings trepanning, with the optimized laser machining parameters. In conjunction with the studies, the hole saturated taper and the saturated processing time were taken as the primary criteria for evaluation of the hole quality and the machining efficiency, respectively. Finally, the trepanning patterns were optimized aiming for the high hole quality; the process was based on the saturated hole tapers. The hole high qualities and machining efficiencies were obtained based on the saturated processing time, which was proven to have a great significance when using the nanosecond pulse laser to machine Al2O3 ceramics substrate.
Publisher
MDPI AG,MDPI
Subject
