Asset Details
Do you wish to reserve the book?
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux
Do you wish to request the book?
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux
2021
Overview
This paper aims to investigate the influence of composite flux on the interfacial reaction, wettability, and shear strength evolution of Sn-3.0Ag-0.5Cu (SAC305) solder joint; the ultrasonic vibration (USV) was performed to the solder joint during reflowing. Cu-modified graphene nanosheets (Cu-GNSs)-doped flux were prepared by chemical modification. It was found that the wettability of the solder was enhanced after the addition of Cu–GNSs, and the wetting angle was reduced up to 14.43%. While, the presence of Cu–GNSs could reduce the thickness of the intermetallic compound (IMC) layer and the size of IMC grain within the solder joint by 4.15% and 3.19%, respectively. Interestingly, the solder joint was prepared with 0.1 wt% Cu–GNSs-doped flux which had the optimal effect on enhancing the wettability of the solder and inhibiting the growth of the IMC layer. The application of USV during reflow could enhance the wettability of the solder and decrease the thickness and grain size of IMC within the solder joint. Shear test results stated that the employment of Cu–GNSs and USV made the shear strength of Cu/SAC305/Cu solder joint enhanced by up to 9.34% and 9.76%, respectively. Furthermore, as the content of Cu–GNSs doped in the flux increased, the fracture type of solder joints without USV treatment gradually changed from the ductile–brittle mixed type to the ductile type, whereas, the fracture type of all the solder joints-relayed USV treatment was the ductile type.
Publisher
Springer US,Springer Nature B.V
