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Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing
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Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing
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Journal Article
Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing
2021
Overview
Sn is the main interconnect material for three-dimensional (3D) Packaging of chip stacking in electronic packaging. In this paper, the intermetallic compound (IMC) produced through an interfacial reaction between Sn-
x
CNTs (
x
= 0, 0.075 wt%) solder and a Cu substrate was evaluated at 130 °C, 150 °C, and 170 °C for 30, 50, 100 h and after multiple reflows (3, 6, 9). In Sn-0.075CNTs system, CNTs inhibited the growth of Cu
6
Sn
5
and refine the microstructure of solder joint. The growth rate of IMC decreased after reflowing and aging for 100 h. Compared to pure Sn/Cu system, the thickness of Cu
6
Sn
5
and Cu
3
Sn was the thinner when the CNTs addition amount was 0.075 wt%. Some voids and cracks were formed in solder joints after reflowing and thermal aging. At this time, the IMC growth activation energies of Sn solder is 33.256 kJ/mol, and that of Sn-0.075CNTs composite solder is 58.19 kJ/mol.
Publisher
Springer US,Springer Nature B.V
