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Dislocation dynamics modelling of the creep behaviour of particle-strengthened materials
by
Cocks, A. C. F
, Tarleton, E.
, Liu, F. X.
in
Creep
/ Cross-Slip
/ Particle
/ Self-Climb
2021
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Dislocation dynamics modelling of the creep behaviour of particle-strengthened materials
by
Cocks, A. C. F
, Tarleton, E.
, Liu, F. X.
in
Creep
/ Cross-Slip
/ Particle
/ Self-Climb
2021
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Dislocation dynamics modelling of the creep behaviour of particle-strengthened materials
Journal Article
Dislocation dynamics modelling of the creep behaviour of particle-strengthened materials
2021
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Overview
Plastic deformation in crystalline materials occurs through dislocation slip and strengthening is achieved with obstacles that hinder the motion of dislocations. At relatively low temperatures, dislocations bypass the particles by Orowan looping, particle shearing, cross-slip or a combination of these mechanisms. At elevated temperatures, atomic diffusivity becomes appreciable, so that dislocations can bypass the particles by climb processes. Climb plays a crucial role in the long-term durability or creep resistance of many structural materials, particularly under extreme conditions of load, temperature and radiation. Here we systematically examine dislocation-particle interaction mechanisms. The analysis is based on three-dimensional discrete dislocation dynamics simulations incorporating impenetrable particles, elastic interactions, dislocation self-climb, cross-slip and glide. The core diffusion dominated dislocation self-climb process is modelled based on a variational principle for the evolution of microstructures, and is coupled with dislocation glide and cross-slip by an adaptive time-stepping scheme to bridge the time scale separation. The stress field caused by particles is implemented based on the particle–matrix mismatch. This model is helpful for understanding the fundamental particle bypass mechanisms and clarifying the effects of dislocation glide, climb and cross-slip on creep deformation.
Publisher
Royal Society,The Royal Society Publishing
Subject
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