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Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant
by
Merkininkaitė, Greta
, Stančikas, Jokūbas
, Šakirzanovas, Simas
, Vargalis, Rokas
, Tičkūnas, Titas
, Sirutkaitis, Valdas
, Bachmann, Julien
, Jurkšas, Tomas
, Butkutė, Agnė
, Jonušauskas, Linas
, Baravykas, Tomas
in
Chemical reactions
/ Contact angle
/ Digital cameras
/ Etchants
/ Etching
/ Experiments
/ Fused silica
/ High aspect ratio
/ Inscriptions
/ Laser etching
/ Microfluidics
/ Potassium hydroxides
/ Selectivity
/ Wetting
2022
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Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant
by
Merkininkaitė, Greta
, Stančikas, Jokūbas
, Šakirzanovas, Simas
, Vargalis, Rokas
, Tičkūnas, Titas
, Sirutkaitis, Valdas
, Bachmann, Julien
, Jurkšas, Tomas
, Butkutė, Agnė
, Jonušauskas, Linas
, Baravykas, Tomas
in
Chemical reactions
/ Contact angle
/ Digital cameras
/ Etchants
/ Etching
/ Experiments
/ Fused silica
/ High aspect ratio
/ Inscriptions
/ Laser etching
/ Microfluidics
/ Potassium hydroxides
/ Selectivity
/ Wetting
2022
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Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant
by
Merkininkaitė, Greta
, Stančikas, Jokūbas
, Šakirzanovas, Simas
, Vargalis, Rokas
, Tičkūnas, Titas
, Sirutkaitis, Valdas
, Bachmann, Julien
, Jurkšas, Tomas
, Butkutė, Agnė
, Jonušauskas, Linas
, Baravykas, Tomas
in
Chemical reactions
/ Contact angle
/ Digital cameras
/ Etchants
/ Etching
/ Experiments
/ Fused silica
/ High aspect ratio
/ Inscriptions
/ Laser etching
/ Microfluidics
/ Potassium hydroxides
/ Selectivity
/ Wetting
2022
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Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant
Journal Article
Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant
2022
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Overview
Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 μm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.
Publisher
MDPI AG,MDPI
Subject
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