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Stress‐Free Detachment of Flexible Substrate from Glass Carrier Using CO2 Point Laser for Large‐Area Applications (Adv. Mater. Interfaces 13/2023)
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Journal Article
Stress‐Free Detachment of Flexible Substrate from Glass Carrier Using CO2 Point Laser for Large‐Area Applications (Adv. Mater. Interfaces 13/2023)
2023
Overview
Flexible Electronics In article number 2202337, Hyuk Park, Yoonyoung Chung, and colleagues use a roll‐to‐roll process to fabricate electronic devices on a flexible substrate. Point laser beams are applied along the edge of each device, and they are gently detached from the applied edge by a tensile force generated by the roll curvature. After the laser illumination, the devices are entirely separated from the carrier.
Publisher
John Wiley & Sons, Inc
Subject
