Journal Article

PCBdesign follows ICpackaging

Scheel, W., Kloeser, J.

2000

Overview

The evolution of IC manufacturing technology has led to a decrease in feature size on the silicon die from around 2m nowadays down to 0.18m, and in the near future down to 0.13m. This implies a simultaneous decrease in the distance of the individual contact pads pitch, decreasing from a moderate 0.5mm to nowadays 0.1mm or even 0.07mm for leading edge ICs. The near future will not allow this trend to continue. Instead of peripheral contacts, several rows of contacts or even use of the entire die area to accommodate the contacts will allow the numbers of IOs to increase to the required value. Following the roadmap of electronic devices the PCB has its design continuously changed. Accordingly we need today PCBs with high density interconnects, realized by sequential buildup technology SBU including microvias. We see at the end of the next decade that the semiconductor technology will be introduced at the PCB level. At this time we are also able to transfer the chip design into the PCB directly. This dependence of the development from chip and PCBtechnology is the subject of the paper.

• Publisher: MCB UP Ltd
• Subject: Chip scale packaging / Design / Printed circuit boards