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Microstructural changes in boron-doped nickel aluminide during high temperature low cycle fatigue
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Microstructural changes in boron-doped nickel aluminide during high temperature low cycle fatigue
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Dissertation
Microstructural changes in boron-doped nickel aluminide during high temperature low cycle fatigue
1989
Overview
Microstructural changes in boron doped Ni$\\sb3$Al during high temperature strain controlled (0.5% and 1% strain amplitudes) and stress controlled (constant stress of 85 MPa) low cycle fatigue were studied. From stress-strain plots, it was found that the true stress (as a function of cumulative strain) showed a maximum, followed by a continuous decrease at large cumulative strain. Extensive grain boundary migration could be the major softening mechanism. Grain boundary migration was inhibited if the material had dispersion in the form of voids that pin down the grain boundaries.
