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In recent years, natural polymeric materials have been widely used in biogel artificial muscles. As a natural fungal polysaccharide material, tremella fuciformis extract (TFE) contains many hydroxyl and carboxyl groups. It also exhibits efficient mass transfer. In this study, we used a fungus polysaccharide gel artificial muscle (FPAM) prepared with carboxylated chitosan and TFE as the main raw materials. The effects of the material ratios on the electrochemical and mechanical properties were experimentally verified with the driving voltage and FPAM size. The results indicated that the optimal performance was reached when 1 g of TFE was added. The large folded structures on the surface were uniformly distributed. The FPAM exhibited weak intermolecular forces and high crystallinity. Compared to that of the control group, the current was approximately 1.5 times higher (the peak current at the optimal proportion was 0.1 A), and the specific capacitance was approximately 2.6 times higher (the specific capacitance with the optimal proportions was 73.589 F/g). The higher ion migration efficiency provided better conductivity. With the optimal proportions, the output force reached a maximum of 2.914 mN, and the elastic modulus was 15 MPa. The enhanced electromechanical response of the FPAM prepared from natural fungal polysaccharides resulted in substantial biocompatibility, providing a new solution for artificial muscle biogel.

Paper-based sensors have good application prospects due to their flexibility and environmental protection. However, paper-based materials are difficult to balance both conductivity and flexibility. This paper mainly reports a high porosity conductive paper based on bamboo wood mixed fiber materials through the wet-manufacture method. The crucial material properties, and long-chain structure of PEDOT:PSS, play an important role in conductivity and flexibility. The relevant experiments show that conductive paper has excellent physical properties and electrical signal transmission capacity. Among them, the conductivity of paper-based electrodes is up to 18.52 S/cm, and there is a low delay in the transmission of the electric signal, when the signal frequency is 300 kHz, the phase frequency angle changes by only 4.9°, not only that, as an electrode, the human pulse signal measured in the capacitive sensor is normal. Under the action of other composite materials, the manufactured electronic paper has a certain mechanical strength, and the thickness is about 90 μm, lower than ordinary paper products. The research shows that the paper-based electrode has the advantages of high conductivity, low hysteresis, light, and thinness, which provides the possibility to be used as a flexible electrode.

In this paper, a novel method for manufacturing flexible microfluidic chips without bonding process is proposed, which combines 3D printing technology and material dissolution technology. The manufacturing process of the microfluidic chip is as follows: a soluble HIPS mold with a preset shape is manufactured by 3D printing and placed in a molten PDMS solution for solidification. Soak in the limonene material to dissolve the mold and form a microchannel in the cured PDMS. Experimental studies have shown that the temperature and concentration of the limonene solution have an important effect on the dissolution rate. A 0.62 cm3 HIPS mold has the fastest dissolution rate at 100°C and 50% concentration. The proposed method provided a new idea for fabricating flexible microfluidic chip. Compared to bonding process, it has the characteristics of not relying on complicated processing conditions and low manufacturing cost.

Purpose Flexible pressure sensor arrays have promising applications in analog haptics, reconfiguration of sensory functions, artificial intelligence, wearable devices and human-computer interaction. The force disturbance generated by the connecting material between the sensor array units will reduce the detection accuracy of the unit. The purpose of this paper is to propose a flexible pressure sensor with interference immunity capability. A C-type bridge flexible piezoelectric structure is used to improve the pressure perturbation. The interference immunity capability of the sensor has been improved. Design/methodology/approach In this paper, a C-type pressure sensor array structure by rapid injection moulding is manufactured through the positive piezoelectric effect of a piezoelectric material. The feasibility of C-type interference immunity structure in a flexible sensor array is verified by further analysis and experiment. A flexible pressure sensor array with C-type interference immunity structure has been proposed. Findings In this paper, we present the results of the perturbation experiment results of the C-type pressure sensor array, showing that the perturbation error is less than 8%. The test of the flexible sensor array show that the sensor can identify the curved angle of up to 120 °, and the output sensitivity of the sensor in the horizontal state reaches 0.12 V/N, and the sensor can withstand the pressure of 80 N. The flexible sensor can work stably in the stretch rate range of 0–8.6% and the stretch length range of 0–6 mm. Originality/value In this paper, C-type pressure sensor array structure is fabricated by rapid injection moulding for the first time. The research in this paper can effectively reduce the disturbance of input pressure on the sensor’s internal array and improve the output accuracy. The sensor can intuitively reflect the number of fingers sliding on the sensor by the order in which the maximum voltage appears. Due to the strong interference immunity capability and flexibility of the flexible sensor array mechanism, it has a broad application prospect in the practical fields of haptic simulation, perceptual function reconstruction, artificial intelligence, wearable devices and human–computer interaction.

Purpose The purpose of this study is to provide a micro-nano chip automatic alignment system. Used for micron and nanometer channel alignment of microfluidic chip. Design/methodology/approach In this paper, combined with the reconstructed micro–nanoscale Hough transform theory, a “clamp–adsorb–rotate” chip alignment method is proposed. The designed alignment system includes a microscopic identification device, a clamping device and a suction device. After assembly, the straightness of the linear slide rail in the horizontal and vertical directions was tested, respectively. The results show that in the horizontal and vertical directions, the linearity error of the linear slide is +0.29 and 0.30 µm, respectively, which meets the requirement of chip alignment accuracy of 15 µm. In the direction of rotation, the angular error between the microchannel and the nanochannel is ±0.5°. In addition, an alignment flow experiment of the chip is designed. The results demonstrate that the closer the angle between the microchannel and the nanochannel is to 90°, the fluid fills the entire channel. Compared with the conventional method, the method and the assembly system realize fully automatic double-layer chip alignment. Findings A mechanical device designed by Hough transform theory can realize microfluidic chip alignment at nanometer and micron level. Originality/value The automatic alignment device adopts Hough transform principle and can be used for microfluidic chip alignment.