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Single-photon sources are important for integrated photonics and quantum technologies, and can be used in quantum key distribution, quantum computing, and sensing. Color centers in the solid state are a promising candidate for the development of the next generation of single-photon sources integrated in quantum photonics devices. They are point defects in a crystal lattice that absorb and emit light at given wavelengths and can emit single photons with high efficiency. The landscape of color centers has changed abruptly in recent years, with the identification of a wider set of color centers and the emergence of new solid-state platforms for room-temperature single-photon generation. This review discusses the emerging material platforms hosting single-photon-emitting color centers, with an emphasis on their potential for the development of integrated optical circuits for quantum photonics.

Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon.

Since the 1980s, researchers have taken giant steps in understanding how to use quantum mechanics for solving real problems—for example, making a computer that works according to the laws of quantum mechanics. In recent decades, researchers have tried to develop a platform for quantum information and computation that can be integrated into digital and telecom technologies without the need of a cryogenic environment. The current status of research in the field of quantum integrated photonics will be reviewed. A review of the most common integrated photonic platforms will be given, together with the main achievements and results in the last decade.

Single-photon detectors have gained significant attention recently, driven by advancements in quantum information technology. Applications such as quantum key distribution, quantum cryptography, and quantum computation demand the ability to detect individual quanta of light and distinguish between single-photon states and multi-photon states, particularly when operating within waveguide systems. Although single-photon detector fabrication has been established for some time, integrating detectors with waveguides using new materials with suitable structural and electronic properties, especially at telecommunication wavelengths, creates more compact source-line-detector systems. This review explores the state of the art of single-photon detector research and examines the potential breakthroughs offered by novel low-dimensional materials in this field.

Integrated photonic platforms have rapidly emerged as highly promising and extensively investigated systems for advancing classical and quantum information technologies, since their ability to seamlessly integrate photonic components within the telecommunication band with existing silicon-based industrial processes offers significant advantages. However, despite this integration facilitating the development of novel devices, fostering fast and reliable communication protocols and the manipulation of quantum information, traditional integrated silicon photonics faces inherent physical limitations that necessitate a challenging trade-off between device efficiency and spatial footprint. To address this issue, researchers are focusing on the integration of nanoscale materials into photonic platforms, offering a novel approach to enhance device performance while reducing spatial requirements. These developments are of paramount importance in both classical and quantum information technologies, potentially revolutionizing the industry. In this review, we explore the latest endeavors in hybrid photonic platforms leveraging the combination of integrated silicon photonic platforms and nanoscale materials, allowing for the unlocking of increased device efficiency and compact form factors. Finally, we provide insights into future developments and the evolving landscape of hybrid integrated photonic nanomaterial platforms.

SPES (Selective Production of Exotic Species) is an Isotope-Separation On-Line (ISOL) facility at INFN-LNL that was commissioned in November 2024 with the production of the first Radioactive Ion Beam (RIB). In such facilities the RIB production is achieved with the following steps: firstly a production target is typically impinged by a high energy and high intensity primary beam, generating radioactive isotopes. The target is coupled to an ion source, towards which the produced species migrate by diffusive and effusive phenomena. There they are ionized, allowing their electrostatic extraction and acceleration as a RIB, useful for several multidisciplinary experimental activities. With the aim of an efficient RIB production, both target and ion source work in the 1600-2200°C temperature range at high vacuum. The Target-Ion Source (TIS) system represents the core of the RIB production process, and its reliable and efficient operation is of fundamental importance. For this reason a TIS constituted by a silicon carbide target, that was carefully designed and studied with extensive thermomechanical simulations, and a Forced Electron Beam Induced Arc Discharge (FEBIAD) ion source, that included the most recent technological advancements, was selected for the first RIB at SPES. In particular, the ion source most critical component, namely the tantalum cathode, was produced by AM technologies, given the outstanding stability and reliability achieved in the context of HISOL (High performance ISOL systems for the production of RIBs), a structured INFN program of research activities on targets, ion sources and molecular beams.