Journal Article

Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform

Pedreschi, Elena, De Matteis, Fabio, Ditalia Tchernij, Sviatoslav, Barbato, Fabrizio, Liberali, Valentino, Fontana, Andrea, Roncolato, Carlo, Campostrini, Matteo, Bonaiuto, Vincenzo, Shojaii, Jafar, Sargeni, Fausto, Stabile, Alberto, Lacava, Cosimo, Piergentili, Paolo, Amanti, Francesco, Forneris, Jacopo, Gunnella, Roberto, Spinella, Franco, Vitali, Valerio, Marzioni, Francesco, Dao, Thu Ha, Iadanza, Simone, Toncelli, Alessandra, Bellani, Vittorio, Martini, Leonardo, Salvato, Matteo, Cammarata, Simone, Andrini, Greta, Donati, Simone, Armani, Fabrizio, Morescalchi, Luca, Di Giuseppe, Giovanni, Frontini, Luca, Rossella, Francesco, Demontis, Valeria, Kaplan, Ali Emre, Rigato, Valentino, Prete, Domenic

2024

Overview

Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon.

• Publisher: MDPI AG
• Subject: Biosensors / Circuits / Design / Directional couplers / Efficiency / Fabrication / integrated photonic circuits / integrated waveguide devices / Light / optical interconnect / Phase shifters / Photonics / Power efficiency / Propagation / Quantum computing / Reviews / semiconductor / Semiconductors / Sensors / Silicon / silicon photonics / Silicon substrates / silicon-on-insulator / SOI (semiconductors) / Waveguides