Explore the vast range of titles available.

NanoArduSiPM represents a paradigm shift in the ArduSiPM (Architected Detection Unit for Silicon Photomultipliers) roadmap, evolving from a standalone instrument into a high-density modular building block (36 mm × 42 mm × 3 mm, 7 g). This revision does not merely pursue miniaturization; it re-engineers the signal-processing chain to maintain high performance within a scaled-down footprint, enabling the transition from single-unit detection to scalable, distributed multi-detector systems. NanoArduSiPM is based on a three-layer architecture comprising an external scintillator and Silicon Photomultiplier (SiPM) detection module, a dedicated high-speed discrete analog front-end, and a System-on-Chip (SoC) for embedded acquisition and processing. The physical implementation adopts high-integrity PCB routing and rigorous isolation techniques designed to suppress digital–analog coupling, a critical requirement in such a compact form factor. This deterministic layout strategy provides the architectural foundation for time-tagging capabilities, currently under quantitative characterization, by addressing the fundamental sources of signal interference at the hardware level. Beyond hardware integration, NanoArduSiPM introduces the capability for extended firmware functionality, including event tagging via external inputs and the implementation of coincidence and veto logic. This framework supports the acquisition of multiple correlated histograms and allows multiple units to be interconnected on a shared SPI bus. By shifting from standalone operation to a coordinated, hierarchical architecture, NanoArduSiPM enables distributed detection schemes where event selection and correlation are handled natively within the system, reducing the dependency on external data acquisition electronics. The compact modular architecture, together with the high-performance discrete analog front-end and embedded data handling, makes NanoArduSiPM suitable for applications where low mass and low power consumption are critical, targeting applications such as space-based payloads, laboratory instrumentation, remote sensing, and large-scale distributed multi-channel detection systems. While no radiation-tolerance qualification of the complete system has been performed in this work, the microcontroller family used in the design is also available in radiation-tolerant variants, which may support future implementations targeting more demanding radiation environments.

Bi2Se3 thin films with different thicknesses are deposited on prepatterned n-Si substrates by the vapor–solid deposition method, demonstrating photodetector performances in the visible and near-infrared range up to the telecommunication wavelength 1550 nm and showing response times as low as 126 ns. The current voltage characteristics measured in the temperature range 77–300 K indicate the formation of Schottky junctions at the interface between the two materials. The nature of the junctions is discussed considering the effect of disorder at the interface induced by the Bi2Se3 film granularity. The temperature dependence of the ideality factors and the Schottky barrier heights is consistent with a thermionic field effect mechanism governing the electron motion through the interface, which is responsible for the fast response of the photodetectors.

Photodetector (PD) devices based on carbon nanotube/n-silicon heterojunction (NSH) have been realized, with a linear response in a large optical power range, proving competitive performances with respect to a recent nanostructure-based detector and those currently available on the market. The core of these devices is a thin semi-transparent and conductive single-walled carbon nanotubes film with a multitask role: junction element, light absorber and transmitter, photocarrier transporting layer, and charge collector. The PD exhibits rise times of some nanoseconds, detecting light from ultraviolet (240 nm) to infrared (1600 nm), and external quantum efficiency reaching 300% in the VIS spectra region.

Bi Se thin films with different thicknesses are deposited on prepatterned n-Si substrates by the vapor-solid deposition method, demonstrating photodetector performances in the visible and near-infrared range up to the telecommunication wavelength 1550 nm and showing response times as low as 126 ns. The current voltage characteristics measured in the temperature range 77-300 K indicate the formation of Schottky junctions at the interface between the two materials. The nature of the junctions is discussed considering the effect of disorder at the interface induced by the Bi Se film granularity. The temperature dependence of the ideality factors and the Schottky barrier heights is consistent with a thermionic field effect mechanism governing the electron motion through the interface, which is responsible for the fast response of the photodetectors.

Bi[sub.2]Se[sub.3] thin films with different thicknesses are deposited on prepatterned n-Si substrates by the vapor–solid deposition method, demonstrating photodetector performances in the visible and near-infrared range up to the telecommunication wavelength 1550 nm and showing response times as low as 126 ns. The current voltage characteristics measured in the temperature range 77–300 K indicate the formation of Schottky junctions at the interface between the two materials. The nature of the junctions is discussed considering the effect of disorder at the interface induced by the Bi[sub.2]Se[sub.3] film granularity. The temperature dependence of the ideality factors and the Schottky barrier heights is consistent with a thermionic field effect mechanism governing the electron motion through the interface, which is responsible for the fast response of the photodetectors.

The fascinating properties of two dimensional (2D) crystals have gained increasing interest for many applications. The synthesis of a 2D silicon structure, namely silicene, is attracting great interest for possible development of next generation electronic devices. The main difficulty in working with silicene remains its strong tendency to oxidation when exposed to air as a consequence of its relatively highly buckled structure. In this work, we univocally identify the Raman mode of air-stable low-buckled silicene nanosheets synthesized on highly oriented pyrolytic graphite (HOPG) located at 542.5 cm−1. The main focus of this work is Raman spectroscopy and mapping analyses in combination with ab initio calculations. Scanning tunneling microscopy images reveal the presence of a patchwork of Si three-dimensional (3D) clusters and contiguous Si areas presenting a honeycomb atomic arrangement, rotated by 30° with respect to the HOPG substrate underneath, with a lattice parameter of 0.41 ± 0.02 nm and a buckling of the Si atoms of 0.05 nm. Raman analysis supports the co-existence of 3D silicon clusters and 2D silicene. The Raman shift of low-buckled silicene on an inert substrate has not been reported so far and it is completely different from the one calculated for free-standing silicene and the ones measured for silicene grown on Ag(111) surfaces. Our experimental results are perfectly reproduced by our ab initio calculations of deposited silicene nanosheets. This leads us to conclude that the precise value of the observed Raman shift crucially depends on the strain between the silicene and the HOPG substrate.

Single-photon sources are important for integrated photonics and quantum technologies, and can be used in quantum key distribution, quantum computing, and sensing. Color centers in the solid state are a promising candidate for the development of the next generation of single-photon sources integrated in quantum photonics devices. They are point defects in a crystal lattice that absorb and emit light at given wavelengths and can emit single photons with high efficiency. The landscape of color centers has changed abruptly in recent years, with the identification of a wider set of color centers and the emergence of new solid-state platforms for room-temperature single-photon generation. This review discusses the emerging material platforms hosting single-photon-emitting color centers, with an emphasis on their potential for the development of integrated optical circuits for quantum photonics.

Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon.

Since the 1980s, researchers have taken giant steps in understanding how to use quantum mechanics for solving real problems—for example, making a computer that works according to the laws of quantum mechanics. In recent decades, researchers have tried to develop a platform for quantum information and computation that can be integrated into digital and telecom technologies without the need of a cryogenic environment. The current status of research in the field of quantum integrated photonics will be reviewed. A review of the most common integrated photonic platforms will be given, together with the main achievements and results in the last decade.

Single-photon detectors have gained significant attention recently, driven by advancements in quantum information technology. Applications such as quantum key distribution, quantum cryptography, and quantum computation demand the ability to detect individual quanta of light and distinguish between single-photon states and multi-photon states, particularly when operating within waveguide systems. Although single-photon detector fabrication has been established for some time, integrating detectors with waveguides using new materials with suitable structural and electronic properties, especially at telecommunication wavelengths, creates more compact source-line-detector systems. This review explores the state of the art of single-photon detector research and examines the potential breakthroughs offered by novel low-dimensional materials in this field.