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Titanium aluminium (TiAl) alloy thin films were deposited on silicon wafer and stainless steel substrate by sputtering method. The effects of the Al/Ti target current ratio (R) on chemical composition, structure, surface morphology, wettability, and corrosion resistance of the deposited films were investigated using energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM), contact angle measurement, and potentiostat, respectively. In the experiment, when the Al/Ti target current ratio increased from 0.375 to 1.5, the Al/Ti concentration ratio of the deposited films increased. When the Al/Ti target current ratios were 1.0 and 1.5, the deposited film structure exhibited γ-TiAl phase with tetragonal crystal structure. Moreover, the Al/Ti target current ratio of 1.5 provided the deposited film with the highest crystallinity, surface roughness, hydrophobicity, and corrosion resistance.