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Selective laser etching (SLE) is a procedure to create customized micro-fluidic or micro-mechanical structures in glass. We aim to utilize SLE for optics production as well and report on detailed investigations of the glass structuring process by variation of stage speed, laser power, polarization and repetition rate of the laser to reduce the surface roughness to optical quality without any additional process steps. We show that a surface roughness of 30 nm can be achieved which is sufficient to fabricate optical components or integrated optical structures even for the visible wavelength range. Our results enable the fabrication of free standing micro-structures with a feature size of less than 1 µm in fused silica using SLE and KOH as etchant which enables the fabrication of optical gratings.

As an emerging fringe science, bionics integrates the understanding of nature, imitation of nature, and surpassing nature in one aspect, and it organically combines the synergistic complementarity of function and structure–function integrated materials which is of great scientific interest. By imitating the microstructure of a natural biological surface, the bionic superhydrophobic surface prepared by human beings has the properties of self-cleaning, anti-icing, water collection, anti-corrosion and oil–water separation, and the preparation research methods are increasing. The preparation methods of superhydrophobic surface include vapor deposition, etching modification, sol–gel, template, electrostatic spinning, and electrostatic spraying, which can be applied to fields such as medical care, military industry, ship industry, and textile. The etching modification method can directly modify the substrate, so there is no need to worry about the adhesion between the coating and the substrate. The most obvious advantage of this method is that the obtained superhydrophobic surface is integrated with the substrate and has good stability and corrosion resistance. In this article, the different preparation methods of bionic superhydrophobic materials were summarized, especially the etching modification methods, we discussed the detailed classification, advantages, and disadvantages of these methods, and the future development direction of the field was prospected.

Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 μm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.

Nowadays, lab-on-chip (LOC) devices are attracting more and more attention since they show vast prospects for various biomedical applications. Usually, an LOC is a small device that serves a single laboratory function. LOCs show massive potential for organ-on-chip (OOC) device manufacturing since they could allow for research on the avoidance of various diseases or the avoidance of drug testing on animals or humans. However, this technology is still under development. The dominant technique for the fabrication of such devices is molding, which is very attractive and efficient for mass production, but has many drawbacks for prototyping. This article suggests a femtosecond laser microprocessing technique for the prototyping of an OOC-type device—a liver-on-chip. We demonstrate the production of liver-on-chip devices out of glass by using femtosecond laser-based selective laser etching (SLE) and laser welding techniques. The fabricated device was tested with HepG2(GS) liver cancer cells. During the test, HepG2(GS) cells proliferated in the chip, thus showing the potential of the suggested technique for further OOC development.

This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, high transparency, and adjustable thermal expansion coefficient. To date, various studies have suggested numerous techniques to generate holes in glass. In this study, we adopt the selective laser etching (SLE) technique. SLE consists of two processes: local modification via an ultrashort pulsed laser and chemical etching. In our previous study, we found that the process speed can be enhanced by changing the local modification method. For further enhancement in the process speed, in this study, we focus on the chemical etching process. In particular, we try to find a proper etchant for TGV formation. Here, four different etchants (HF, KOH, NaOH, and NH4F) are compared in order to improve the etching speed. For a quantitative comparison, we adopt the concept of selectivity. The results show that NH4F has the highest selectivity; therefore, we can tentatively claim that it is a promising candidate etchant for generating TGV. In addition, we also observe a taper angle variation according to the etchant used. The results show that the taper angle of the hole is dependent on the concentration of the etchant as well as the etchant itself. These results may be applicable to various industrial fields that aim to adjust the taper angle of holes.

Transparent and high-hardness materials have become the object of wide interest due to their optical and mechanical properties; most notably, concerning technical glasses and crystals. A notable example is sapphire—one of the most rigid materials having impressive mechanical stability, high melting point and a wide transparency window reaching into the UV range, together with impressive laser-induced damage thresholds. Nonetheless, using this material for 3D micro-fabrication is not straightforward due to its brittle nature. On the microscale, selective laser etching (SLE) technology is an appropriate approach for such media. Therefore, we present our research on C-cut crystalline sapphire microprocessing by using femtosecond radiation-induced SLE. Here, we demonstrate a comparison between different wavelength radiation (1030 nm, 515 nm, 343 nm) usage for material modification and various etchants (hydrofluoric acid, sodium hydroxide, potassium hydroxide and sulphuric and phosphoric acid mixture) comparison. Due to the inability to etch crystalline sapphire, regular SLE etchants, such as hydrofluoric acid or potassium hydroxide, have limited adoption in sapphire selective laser etching. Meanwhile, a 78% sulphuric and 22% phosphoric acid mixture at 270 °C temperature is a good alternative for this process. We present the changes in the material after the separate processing steps. After comparing different processing protocols, the perspective is demonstrated for sapphire structure formation.

Paper-based microfluidic devices are an attractive platform for developing low-cost, point-of-care diagnostic tools. As paper-based devices’ detection chemistries become more complex, more complicated devices are required, often entailing the sequential delivery of different liquids or reagents to reaction zones. Most research into flow control has been focused on introducing delays. However, delaying the flow can be problematic due to increased evaporation leading to sample loss. We report the use of a CO2 laser to uniformly etch the surface of the paper to modify wicking speeds in paper-based microfluidic devices. This technique can produce both wicking speed increases of up to 1.1× faster and decreases of up to 0.9× slower. Wicking speeds can be further enhanced by etching both sides of the paper, resulting in wicking 1.3× faster than unetched channels. Channels with lengthwise laser-etched grooves were also compared to uniformly etched channels, with the most heavily grooved channels wicking 1.9× faster than the fastest double-sided etched channels. Furthermore, sealing both sides of the channel in packing tape results in the most heavily etched channels, single-sided, double-sided, and grooved, wicking over 13× faster than unetched channels. By selectively etching individual channels, different combinations of sequential fluid delivery can be obtained without altering any channel geometry. Laser etching is a simple process that can be integrated into the patterning of the device and requires no additional materials or chemicals, enabling greater flow control for paper-based microfluidic devices.

In this study, dual-face porous silicon layers (Df-PSi) and hybrid structures with (AuNPs/PSi/Si / PSi /AuNPs) configurations are fabricated and investigated. The Df-Psi layers were synthesized simultaneously using the dual beam laser supporting etching (DB-LSE) route, which employed two identical laser beams. The Df-PSi layers hybrid structures were produced by integrating Au-NPs into PSi in an HAuCl4 solution using a dipping technique. The results showed well-ordered, highly symmetrical Df-PSi and hybrid structures with minute variations in overall characteristics due to a small change in the absorption laser intensity during the etching process. Following the Df-PSi synthesis, hotspot vacancies among nanoparticles in hybrid structures and the size distribution, and specific surface area (SSA) of gold nanoparticles (AuNPs) showed a well-ordered realization.

With the increasing demand for drag reduction, energy consumption reduction, and low weight in civil aircraft, high-precision microgroove preparation technology is being developed internationally to reduce wall friction resistance and save energy. Compared to mechanical processing, chemical etching, roll forming, and ultrafast laser processing, nanosecond lasers offer processing precision, high efficiency, and controllable thermal effects, enabling low-cost and high-quality preparation of microgrooves. However, the impact of nanosecond laser etching on the fatigue performance of substrate materials remains unclear, leading to controversy over whether high-precision shape control and fatigue performance enhancement in microgrooves can be achieved simultaneously. This has become a bottleneck issue that urgently needs to be addressed. This paper focuses on the current research status of nanosecond laser processing quality control for microgrooves and the research status of laser effects on enhancing the fatigue performance of substrate materials. It identifies the main existing issues: (1) how to induce surface residual compressive stress through the thermo-mechanical coupling effect of nanosecond lasers to suppress micro-defects while ensuring high-precision shape control of fixed microgrooves; and (2) how to quantify the regulation of nanosecond laser process parameters on residual stress distribution and fatigue performance in the microgroove area. To address these issues, this paper proposes a collaborative strategy for high-quality shape control and surface strengthening in fixed microgrooves, an analysis of multi-dimensional fatigue regulation mechanisms, and a new method for multi-objective process optimization. The aim is to control the geometric accuracy error of the prepared surface microgrooves within 5% and to enhance the fatigue life of the substrate by more than 20%, breaking through the technical bottleneck of separating “drag reduction design” from “fatigue resistance manufacturing”, and providing theoretical support for the integrated manufacturing of “drag reduction-fatigue resistance” in aircraft skins.

Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, followed by phonon vibration. In general, the electron excitation occurs for less than a few tens of picoseconds and phonon vibration occurs for more than 100 picoseconds. Thus, in order to compare the electric absorption and thermal absorption of photons in the commercial glass, we attempt to implement an additional laser pulse of 213 ps and 10 ns after the first pulse. The modified glass sample is etched with 8 mol/L KOH solution with 110 °C to verify the effect. Here, we found that the electric absorption of photons is more effective than the thermal absorption of them. We can claim that this result helps to enhance the process speed of TGV generation.