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Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
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Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
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Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
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Paper
Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
2016
Overview
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 \\(\\mu\\)m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of \\(14\\times10^{15}\\) n\\(_{eq}\\)/cm\\(^2\\). The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50x50 and 25x100 \\(\\mu\\)m\\(^2\\)) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50x50 \\(\\mu\\)m\\(^2\\) pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80\\(^\\circ\\)) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.
