Journal Article

Real surface area determination of dendritic porous copper films electrodeposited by pulsating overpotential regime using cyclic voltammetry method

Madram, Alireza, Shafiei, Fatemeh Karimi Tabar, Jafarzadeh, Kourosh

2024

Overview

To increase the active surface area of copper collectors in Li-ion batteries, electrochemical deposition of porous copper films was carried out using a solution of 0.15 M CuSO 4 ·5H 2 O in 0.5 M H 2 SO 4 . Square-wave pulsating overpotential deposition was performed at overpotential amplitudes of −1100, −1250 and −1400 mV vs . Ag/AgCl on copper foil, rated for Li batteries. Energy-dispersive method analysis and a scanning electron microscope were used to characterize film morphology. X-ray diffraction method was used to analyse structural properties of the deposits. Electroactive and real surfaces of the samples were measured using cyclic voltammetry (CV) in a 0.1 M KOH solution. The results showed that by increasing the applied negative overpotential, the electroactive and real surface area of the samples were increased. As a result, the sample values of 47.13, 58.50 and 62.63 cm 2 were obtained at the respective deposition overpotential amplitudes of −1100, −1250 and −1400 mV. For untreated film, however, the value was around 9.35 cm 2 . Ultimately, it was discovered that CV is a highly effective technique for determining the real surface area of porous copper foils.

• Publisher: Indian Academy of Sciences,Springer Nature B.V
• Subject: Amplitudes / Chemistry and Materials Science / Copper / Electrodeposition / Electrodes / Electrolytes / Energy storage / Engineering / Lithium-ion batteries / Materials Science / Metal films / Metal foils / Morphology / Porous materials / Scanning electron microscopy / Sulfuric acid / Surface area / Voltammetry / Wave diffraction