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Simulation Design of an Electron Gun for Microchannel Plate Scrubbing
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Journal Article
Simulation Design of an Electron Gun for Microchannel Plate Scrubbing
2025
Overview
The microchannel plate (MCP) is susceptible to the adsorption of substantial amounts of gas during its fabrication process. To mitigate this, a uniform electron source is essential for effective electron scrubbing and gas removal. Thermionic emission, a method of electron generation, can be employed to create the electron source. In this study, a flat spiral filament was designed and simulated using the CST Studio Suite electron simulation software to assess the cleaning performance of the electron gun. The impact of variations in electron gun parameters on the uniformity of the electron beam and current density was systematically analysed. The simulation results show that, with filament, grid, focusing sleeve, and anode voltages set to 200 V, 500 V, 250 V, and 300 V, respectively, a uniform electron beam with a diameter exceeding 30 mm can be achieved. In order to obtain the current density (5~50 nA/mm2) required for the MCP, the temperature of the filament should be 1800–2000 K through theoretical calculation. These findings offer valuable insights for designing a more efficient electron gun for MCP scrubbing.
Publisher
MDPI AG
Subject
