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The Hot Deformation Behavior and Microstructural Evolution of TP2 Pure Copper
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Journal Article
The Hot Deformation Behavior and Microstructural Evolution of TP2 Pure Copper
2023
Overview
The hot deformation behavior and microstructural evolution for TP2 pure copper from 200 to 500 ℃ with a strain rate of 10 s
−1
are studied using Gleeble-3800 thermal simulation tester. Electron back-scattered diffraction and true stress–strain curves are carried out to characterize flow behavior, grain boundary characteristics, microtextural behavior and dynamic recrystallization mechanism of the hot deformed samples. The true stress decreases with increasing deformation temperature. With the increase of temperature, small-angle grain boundary gradually migrates to large-angle grain boundary. The volume fraction of dynamic recrystallization reaches 3.57% and 12.96% at 400 ℃ and 500 ℃, respectively. At 200 ℃, the deformation brass R texture {025} < 100 > plays a leading role. When the temperature increases to 500 ℃, the texture type is almost all transformed into goss texture {110} < 001 > . As the deformation temperature increases, deformation texture has a reduced intensity.
Publisher
Springer India,Springer Nature B.V
Subject
