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Modeling the Stress Field in MSLA-Fabricated Photosensitive Resin Components: A Combined Experimental and Numerical Approach
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Modeling the Stress Field in MSLA-Fabricated Photosensitive Resin Components: A Combined Experimental and Numerical Approach
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Journal Article
Modeling the Stress Field in MSLA-Fabricated Photosensitive Resin Components: A Combined Experimental and Numerical Approach
2025
Overview
This study presents an experimental and numerical investigation into the stress field in cylinders manufactured from photosensitive resin using the Masked Stereolithography (MSLA) technique. For material characterization, tensile and bending test data from resin specimens were utilized. The stress field in resin disks was experimentally analyzed using photoelasticity and Digital Image Correlation (DIC) methods, subjected to compressive loads, according to the cylinder–plane contact model. Images were captured during the experiments using polarizing film and a low-cost CPL lens, coupled to a smartphone. The experimental results were compared with numerical and analytical simulations, where the formation of fringes and regions indicating the direction and magnitude of normal and shear stresses were observed, with variations ranging from 0.6% to 8.2%. The convergence of the results demonstrates the feasibility of using parts produced with commercially available photosensitive resin on non-professional printers for studying contact theory and stress fields. In the future, this methodology is intended to be applied to studies on stress in gears.
