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Analysis of the Reasons for the Tearing of Strips of High-Strength Electrical Steels in Tandem Cold Rolling
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Analysis of the Reasons for the Tearing of Strips of High-Strength Electrical Steels in Tandem Cold Rolling
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Analysis of the Reasons for the Tearing of Strips of High-Strength Electrical Steels in Tandem Cold Rolling
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Journal Article
Analysis of the Reasons for the Tearing of Strips of High-Strength Electrical Steels in Tandem Cold Rolling
2021
Overview
High-strength non-oriented electro-technical steels with a low thickness possess excellent isotropy of electromagnetic and mechanical properties which is highly required in the production of high-efficiency electric motors. The manufacturing process of this type of steel includes very important and technologically complex routes such as hot rolling, cold rolling, temper rolling, or final heat treatment. The final thickness is responsible for the decrease in eddy-current losses and is effectively achieved during cold rolling by the tandem rolling mill. Industrial production of thin sheets of high-strength silicon steels in high-speed tandem rolling mills is a rather demanding technological operation due to the increased material brittleness that is mainly caused by the intensive solid solution and deformation strengthening processes, making the dislocation motion more complex. The main objective of this work was to investigate the distribution of local mechanical strains through the thickness of high silicon steel hot bands, generated during the cold rolling. The experimental samples were analysed by means of electron back-scattered diffraction and scanning electron microscopy. From the performed analyses, the correlation between the material workability and the nucleation of cracks causing the observed steel strip failure during the tandem cold rolling was characterized. Specifically, the microstructural, textural, misorientation, and fractographic analyses clearly show that the investigated hot band was characterized by a bimodal distribution of ferrite grains and the formation of intergranular cracks took place only between the grains with recrystallized and deformed structures.
