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Enhanced Radiation Damage Tolerance of Amorphous Interphase and Grain Boundary Complexions in Cu-Ta
by
Cao, Penghui
, Wharry, Janelle P.
, Rupert, Timothy J.
, Aksoy, Doruk
, Trelewicz, Jason R.
in
Alloys
/ Amorphous alloys
/ amorphous complexions
/ amorphous intergranular film
/ Amorphous materials
/ Atomic collisions
/ Chemical separation
/ Chemistry/Food Science
/ Copper base alloys
/ Crystal defects
/ Cu-Ta alloy
/ Damage tolerance
/ Earth Sciences
/ Energy
/ Engineering
/ Environment
/ Grain boundaries
/ grain boundary
/ interface structure
/ Interfaces
/ Material properties
/ MATERIALS SCIENCE
/ Misfit dislocations
/ Nanostructured Materials in Extreme Environments
/ Physics
/ Point defects
/ Radiation
/ Radiation damage
/ Radiation tolerance
/ Simulation
/ Thickness
/ Zirconium
2024
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Enhanced Radiation Damage Tolerance of Amorphous Interphase and Grain Boundary Complexions in Cu-Ta
by
Cao, Penghui
, Wharry, Janelle P.
, Rupert, Timothy J.
, Aksoy, Doruk
, Trelewicz, Jason R.
in
Alloys
/ Amorphous alloys
/ amorphous complexions
/ amorphous intergranular film
/ Amorphous materials
/ Atomic collisions
/ Chemical separation
/ Chemistry/Food Science
/ Copper base alloys
/ Crystal defects
/ Cu-Ta alloy
/ Damage tolerance
/ Earth Sciences
/ Energy
/ Engineering
/ Environment
/ Grain boundaries
/ grain boundary
/ interface structure
/ Interfaces
/ Material properties
/ MATERIALS SCIENCE
/ Misfit dislocations
/ Nanostructured Materials in Extreme Environments
/ Physics
/ Point defects
/ Radiation
/ Radiation damage
/ Radiation tolerance
/ Simulation
/ Thickness
/ Zirconium
2024
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Enhanced Radiation Damage Tolerance of Amorphous Interphase and Grain Boundary Complexions in Cu-Ta
by
Cao, Penghui
, Wharry, Janelle P.
, Rupert, Timothy J.
, Aksoy, Doruk
, Trelewicz, Jason R.
in
Alloys
/ Amorphous alloys
/ amorphous complexions
/ amorphous intergranular film
/ Amorphous materials
/ Atomic collisions
/ Chemical separation
/ Chemistry/Food Science
/ Copper base alloys
/ Crystal defects
/ Cu-Ta alloy
/ Damage tolerance
/ Earth Sciences
/ Energy
/ Engineering
/ Environment
/ Grain boundaries
/ grain boundary
/ interface structure
/ Interfaces
/ Material properties
/ MATERIALS SCIENCE
/ Misfit dislocations
/ Nanostructured Materials in Extreme Environments
/ Physics
/ Point defects
/ Radiation
/ Radiation damage
/ Radiation tolerance
/ Simulation
/ Thickness
/ Zirconium
2024
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Enhanced Radiation Damage Tolerance of Amorphous Interphase and Grain Boundary Complexions in Cu-Ta
Journal Article
Enhanced Radiation Damage Tolerance of Amorphous Interphase and Grain Boundary Complexions in Cu-Ta
2024
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Overview
Amorphous interfacial complexions are particularly resistant to radiation damage and have been primarily studied in alloys with good glass-forming ability, yet recent reports suggest that these features can form even in immiscible alloys such as Cu-Ta under irradiation. In this study, the mechanisms of damage production and annihilation due to primary knock-on atom collisions are investigated for amorphous interphase and grain boundaries in a Cu-Ta alloy using atomistic simulations. Amorphous complexions, in particular amorphous interphase complexions that separate Cu and Ta grains, result in less residual defect damage than their ordered counterparts. Stemming from the nanophase chemical separation in this alloy, the amorphous complexions exhibit a highly heterogeneous distribution of atomic excess volume, as compared to a good glass former like Cu-Zr. Complexion thickness, a tunable structural descriptor, plays a vital role in damage resistance. Thicker interfacial films are more damage-tolerant because they alter the defect production rate due to differences in intrinsic displacement threshold energies during the collision cascade. Overall, the findings of this work highlight the importance of interfacial engineering in enhancing the properties of materials operating in radiation-prone environments and the promise of amorphous complexions as particularly radiation damage-tolerant microstructural features.
Publisher
Springer US,Springer Nature B.V,Springer
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