Asset Details
Do you wish to reserve the book?
Spring-In Prediction of CFRP Part Using Coupled Analysis of Forming and Cooling Processes in Stamping
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
Spring-In Prediction of CFRP Part Using Coupled Analysis of Forming and Cooling Processes in Stamping
Do you wish to request the book?
Spring-In Prediction of CFRP Part Using Coupled Analysis of Forming and Cooling Processes in Stamping
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
Spring-In Prediction of CFRP Part Using Coupled Analysis of Forming and Cooling Processes in Stamping
2024
Overview
The spring-in phenomenon of the composite parts can affect the assembly process. This study aims to predict the spring-in phenomenon of a carbon fiber reinforced plastic (CFRP) part. Here, we predict the spring-in of the CFRP part using a coupled analysis of the forming and cooling processes during the stamping process. First, a simulation of the entire forming process, such as the transfer of the composite laminate, gravity analysis, and forming was performed to obtain the temperature distribution of the CFRP part. Subsequently, a finite-element (FE) simulation of the cooling process was conducted to predict the spring-in phenomenon of the shaped CFRP part using the temperature data obtained in the forming simulation. Finally, a CFRP part was manufactured and compared with the results of the FE simulation.
Publisher
MDPI AG,MDPI
Subject
