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Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy
by
Zhang, Xiangchao
, Wang, Junhua
, Tang, Xinlan
, Xu, Min
, Yu, Fei
in
dark-field microscopy
/ Defects
/ Efficiency
/ Electronics industry
/ Integrated circuit fabrication
/ Lasers
/ Light
/ Microscope and microscopy
/ non-patterned wafer inspection
/ optical inspection
/ Power
/ Scanning electron microscopy
/ Sensors
/ time delay integration
2024
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Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy
by
Zhang, Xiangchao
, Wang, Junhua
, Tang, Xinlan
, Xu, Min
, Yu, Fei
in
dark-field microscopy
/ Defects
/ Efficiency
/ Electronics industry
/ Integrated circuit fabrication
/ Lasers
/ Light
/ Microscope and microscopy
/ non-patterned wafer inspection
/ optical inspection
/ Power
/ Scanning electron microscopy
/ Sensors
/ time delay integration
2024
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While trying to remove the title from your shelf something went wrong :( Kindly try again later!
Do you wish to request the book?
Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy
by
Zhang, Xiangchao
, Wang, Junhua
, Tang, Xinlan
, Xu, Min
, Yu, Fei
in
dark-field microscopy
/ Defects
/ Efficiency
/ Electronics industry
/ Integrated circuit fabrication
/ Lasers
/ Light
/ Microscope and microscopy
/ non-patterned wafer inspection
/ optical inspection
/ Power
/ Scanning electron microscopy
/ Sensors
/ time delay integration
2024
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Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy
Journal Article
Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy
2024
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Overview
In semiconductor manufacturing, defect inspection in non-patterned wafer production lines is essential to ensure high-quality integrated circuits. However, in actual production lines, achieving both high efficiency and high sensitivity at the same time is a significant challenge due to their mutual constraints. To achieve a reasonable trade-off between detection efficiency and sensitivity, this paper integrates the time delay integration (TDI) technology into dark-field microscopy. The TDI image sensor is utilized instead of a photomultiplier tube to realize multi-point simultaneous scanning. Experiments illustrate that the increase in the number of TDI stages and reduction in the column fixed pattern noise effectively improve the signal-to-noise ratio of particle defects without sacrificing the detecting efficiency.
Publisher
MDPI AG,MDPI
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